Patents by Inventor Yung-Chang Peng

Yung-Chang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes
    Patent number: 8933343
    Abstract: An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: January 13, 2015
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Ming-Fung Hsieh, Yu-Chia Chang, Chun-Pin Huang, Yung-Chang Peng
  • ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASING THE BONDING STRENGTH BETWEEN INSIDE AND OUTSIDE ELECTRODES
    Publication number: 20140247575
    Abstract: An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.
    Type: Application
    Filed: March 4, 2013
    Publication date: September 4, 2014
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: MING-FUNG HSIEH, YU-CHIA CHANG, CHUN-PIN HUANG, YUNG-CHANG PENG
  • Automatic N2 purge system for 300 mm full automation fab
    Patent number: 7203563
    Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.
    Type: Grant
    Filed: April 8, 2004
    Date of Patent: April 10, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ko-Pin Chang, Jui-An Shih, Hui-Tang Liu, Simon Chang, Nain-Sung Lee, Yung-Chang Peng
  • Stocker utilization self-balancing system and method
    Patent number: 7099739
    Abstract: A method for operating a plurality of stockers, comprises the steps of: monitoring utilization of the plurality of stockers, each stocker capable of storing a plurality of wafer, LCD or reticle containers; and automatically transferring a first wafer, LCD or reticle container from a first one of the stockers to a second one of the stockers if the utilization of the first stocker is greater than a predetermined thereshold.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: August 29, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chi Chen, Wei-Yu Lai, Yung-Chang Peng
  • Automatic N2 purge system for 300mm full automation fab
    Publication number: 20050228530
    Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.
    Type: Application
    Filed: April 8, 2004
    Publication date: October 13, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Ko-Pin Chang, Jui-An Shih, Hui-Tang Liu, Simon Chang, Nain-Sung Lee, Yung-Chang Peng
  • Method for integrating interbay and intrabay material transportation systems within an integrated circuit factory
    Publication number: 20050191162
    Abstract: An integrated material transport system in an integrated circuit manufacturing factory is disclosed. The system comprises a first material transport subsystem traveling at a first height, and a second material transport subsystem traveling at a second height. There is at least one shared material transfer port to be used by both the first and second transport subsystems. Further, there is an integrated rail subsystem servicing both the first and second material transport subsystems for exchanging predetermined materials through the shared material transfer port with a predetermined material stocker under a ceiling with a uniform height.
    Type: Application
    Filed: February 26, 2004
    Publication date: September 1, 2005
    Inventors: Simon Chang, Nain-Sung Lee, Yung-Chang Peng
  • Stocker utilization self-balancing system and method
    Publication number: 20050125095
    Abstract: A method for operating a plurality of stockers, comprises the steps of: monitoring utilization of the plurality of stockers, each stocker capable of storing a plurality of wafer, LCD or reticle containers; and automatically transferring a first wafer, LCD or reticle container from a first one of the stockers to a second one of the stockers if the utilization of the first stocker is greater than a predetermined thereshold.
    Type: Application
    Filed: December 9, 2003
    Publication date: June 9, 2005
    Inventors: Yu-Chi Chen, Wei-Yu Lai, Yung-Chang Peng