Patents by Inventor Yung-Chao Jen

Yung-Chao Jen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME
    Publication number: 20020140113
    Abstract: A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 3, 2002
    Applicant: WALSIN ADVANCED ELECTRONICS LTD.
    Inventors: Wen-Chun Liu, Yung-Chao Jen, Ming-Feng Wu
  • Encapsulated semiconductor die package
    Patent number: 6459162
    Abstract: A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: October 1, 2002
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Yung-Chao Jen, Ming-Feng Wu