Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A taillight assembly of a bicycle includes a seat, a seat tube and a clamping element. A bottom of the seat is provided with a seat post. An inside of the seat tube defines an inner space for holding the seat post. A rear of the seat tube defines a wire slot which is disposed for holding a signal wire. The clamping element is fastened to a top of the seat tube. The clamping element includes a taillight fastener, a taillight unit and a wire tunnel. The taillight unit has an indicator surface and an assembling surface. The assembling surface is combined with the taillight fastener. An inside of the clamping element defines the wire tunnel. The wire tunnel is connected to the wire slot. The signal wire passes through the wire tunnel, and then the signal wire enters the wire slot.

Abstract: A taillight assembly of a bicycle includes a seat, a seat tube and a clamping element. A bottom of the seat is provided with a seat post. An inside of the seat tube defines an inner space for holding the seat post. A rear of the seat tube defines a wire slot which is disposed for holding a signal wire. The clamping element is fastened to a top of the seat tube. The clamping element includes a taillight fastener, a taillight unit and a wire tunnel. The taillight unit has an indicator surface and an assembling surface. The assembling surface is combined with the taillight fastener. An inside of the clamping element defines the wire tunnel. The wire tunnel is connected to the wire slot. The signal wire passes through the wire tunnel, and then the signal wire enters the wire slot.

Abstract: A water cooling system includes a temperature control device which is connected with a first heat exchanger. A second heat exchanger includes a water temperature control path and a constant temperature water path. The water of the first heat exchanger is controlled by the temperature control device and flows to the water temperature control path. The water in the constant temperature water path tows through the second heat exchanger to proceed heat exchange with the water in the water temperature control path, and then flows to the target equipment. The temperature difference of the water flowing to the target equipment is smaller than that of conventional water cooling system.

Abstract: A water cooling system includes a temperature control device which is connected with a first heat exchanger. A second heat exchanger includes a water temperature control path and a constant temperature water path. The water of the first heat exchanger is controlled by the temperature control device and flows to the water temperature control path. The water in the constant temperature water path tows through the second heat exchanger to proceed heat exchange with the water in the water temperature control path, and then flows to the target equipment. The temperature difference of the water flowing to the target equipment is smaller than that of conventional water cooling system.

Abstract: A supporting device includes a holding module and a locating module. The holding module includes a rear shell and a front shell which have a bottom positioning shell and a top positioning shell covered to define a receiving chamber therebetween. The locating module is movably disposed in the receiving chamber and includes a supporting part, a slide part mounted on the supporting part and slidable forward and backward, a locating part fixed on the slide part and projecting out of the top positioning shell, and an elastic part clamped between the supporting part and the bottom positioning shell. The locating part is located in front of the front shell with a distance therebetween being adjustable by the locating part along with the slide part sliding forward and backward. The supporting part together with the slide part and the locating part can move upward and downward by the elastic part.

Abstract: A supporting device includes a holding module and a locating module. The holding module includes a rear shell and a front shell which have a bottom positioning shell and a top positioning shell covered to define a receiving chamber therebetween. The locating module is movably disposed in the receiving chamber and includes a supporting part, a slide part mounted on the supporting part and slidable forward and backward, a locating part fixed on the slide part and projecting out of the top positioning shell, and an elastic part clamped between the supporting part and the bottom positioning shell. The locating part is located in front of the front shell with a distance therebetween being adjustable by the locating part along with the slide part sliding forward and backward. The supporting part together with the slide part and the locating part can move upward and downward by the elastic part.

Abstract: The present invention relates to a manufacturing method for multilayer high density substrate. The circuit layout of the first layer substrate of the multilayer board requires a high demand of pitch density, and therefore polyimide layer is used to make into polyimide substrate (or other high density polymeric film substrate), and combines with the non-high density multilayer board formed from second layer board (or more layer boards) made of organic substrate. In making the organic multilayer board, the adjacent surface of the first layer polyimide substrate (or high density polymeric film substrate), corresponding to appropriate solder pad position of the first layer polyimide substrate (or high density polymeric film substrate), is formed with a solder bump. Thus, when the individual layer board and the first layer substrate are combined, direct heating and compression are applied, such that the bump and the solder pad are bound and electrically connected.

Abstract: A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

Abstract: A wire bonding technique applied to wafer bump and wafer level chip size package structure and the method of manufacturing thereof comprising under no repassivation layer and without an under bump metallurgy layer, direct forming metal bump on a metal pad of a wafer surface, ball bump, method being employed to form metal bump, and wire bonding of ultrasonic vibration being used to join a suitable metal wire on the metal pad, next pulling off the metal wire and leaving the metal bump, the height of the metal bump is controlled by the parameters of the type, diameter and wire bonding of the metal wire; planarizing the metal bump of all wire bonding to an appropriate height using metallurgical tools; implanting solder bump by means of implant ball or solder printing technology on the metal bump, and an under bump metallurgy layer being formed on the top face of the metal block by means of metal deposition method in case an unfavorable intermetallic compound is formed between the metal (used for the metal bump) a

Abstract: A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

Abstract: A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic materia