Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: A semiconductor manufacturing method is provided. The semiconductor manufacturing method includes the following steps. A first semiconductor element with a bonding film and a first stressing film is formed. The first bonding film and the first stressing film are formed on two opposite sides of the first semiconductor element. The first stressing film makes the first bonding film to have a first convex surface. A second semiconductor element with a second bonding film is formed. The second bonding film is formed on one side of the second semiconductor element. The first semiconductor element and the second semiconductor element are bonded by bonding the first bonding film and the second bonding film.

Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A method of manufacturing an electronic device, including the following steps, is provided. A first dielectric layer and a second dielectric layer are provided. The first dielectric layer has a first surface and a second surface opposite to each other, and the second dielectric layer has a third surface and a fourth surface opposite to each other. A first unit is formed on the first surface or the second surface of the first dielectric layer. The first dielectric layer and the second dielectric layer are combined to form a substrate structure. The second surface of the first dielectric layer faces the third surface of the second dielectric layer. A dielectric loss of the first unit is less than a dielectric loss of the first dielectric layer. The method of manufacturing the electronic device of the embodiment of the disclosure can reduce the dielectric loss by using the unit.

Abstract: A semiconductor device package includes a carrier, a first semiconductor device disposed on the carrier, a second semiconductor device disposed on the first semiconductor device, a conductive wire electrically connecting the first semiconductor device to the carrier, and an encapsulant encapsulating the first semiconductor device, the second semiconductor device and the conductive wire. The second semiconductor device defines a hole. The encapsulant exposes the hole. An apex of the conductive wire is lower than a surface of the second semiconductor device by a first distance (s). The apex of the conductive wire is spaced from the first surface of the encapsulant by a second distance (t). A first surface of the encapsulant is lower than a surface of the second semiconductor device by a third distance (D). The third distance is less than or equal to a difference between the first distance and the second distance.

Abstract: Provided are an organometallic iridium complex, a synthetic method thereof, and an organic light emitting device using the same. The synthetic method includes steps of: (a) reacting a t-Bu—Ar1—MgX with a nitrogen-containing heteroaryl salt in a nucleophilic reaction, so as to obtain an intermediate; wherein t-Bu represents a tert-butyl group; Ar1 is an arylene group having 5 to 16 carbon atoms or a sulfur-containing heteroarylene group having 4 to 14 carbon atoms; X is a halogen atom; the nitrogen-containing heteroaryl salt is a salt which includes the t-Bu—Ar2 group, and Ar2 is a nitrogen-containing heteroaryl group having 5 to 14 carbon atoms; (b) oxidizing the intermediate with an oxidant for aromatization to obtain a ligand; and (c) reacting the ligand with an iridium(III) acetylacetonate to obtain the organometallic iridium complex.

Abstract: A method for obtaining plug combination of detecting apparatus, a method for obtaining power line topology and an electronic apparatus using the same are provided. The method for obtaining plug combination of detecting apparatus includes the following steps: retrieving a first amount of at least one detecting apparatus and a second amount of at least one socket; generating plug combinations between the at least one detecting apparatus and the at least one socket; calculating a total socket relationship value according to the second amount; setting specific plug times and a specific socket relationship value of a specific plug combination according to the first amount; and finding a candidate plug combination among reference plug combinations according to the specific socket relationship value, the total socket relationship value and a distance between the specific plug combination and each of the reference plug combinations.

Abstract: A fan device includes a base unit having at least one air inlet and an outer tube that defines an accommodation space fluidly communicating with the air inlet, and a cover unit having a receiving chamber fluidly communicating with the accommodation space, an air outlet fluidly communicating with the receiving chamber, and a lower seat including spaced apart inner and outer annular walls, and a connecting wall interconnecting the annular walls. A preheat inner tube divides the accommodation space into a heating chamber and a preheat circulation channel that fluidly communicates with each other. A fan unit is disposed in the receiving chamber. A heating unit includes a heating component disposed in the heating chamber.

Abstract: A power monitoring device for identifying the state of an electric appliance based on user feedbacks and a power monitoring method thereof are provided. The power monitoring device includes a measurement module, a variation detection and search module, and an electric appliance signature database established based on user feedbacks. When the measurement module detects a variation of a power consumption feature, the variation detection and search module searches the electric appliance signature database according to the variation to obtain electric appliances similar to the variation and the states thereof. A user contributes data to the electric appliance signature database by confirming the search result, or selecting the correct electric appliance and the state thereof. When the user confirms the search result, the power monitoring device establishes an association between the electric appliance and its electric appliance signatures and updates the electric appliance signature database.

Abstract: A method for obtaining plug combination of detecting apparatus, a method for obtaining power line topology and an electronic apparatus using the same are provided. The method for obtaining plug combination of detecting apparatus includes the following steps: retrieving a first amount of at least one detecting apparatus and a second amount of at least one socket; generating plug combinations between the at least one detecting apparatus and the at least one socket; calculating a total socket relationship value according to the second amount; setting specific plug times and a specific socket relationship value of a specific plug combination according to the first amount; and finding a candidate plug combination among reference plug combinations according to the specific socket relationship value, the total socket relationship value and a distance between the specific plug combination and each of the reference plug combinations.

Abstract: A method for counting a number of people based on appliance usages and a monitoring system using the same method. The method includes the following steps: collecting first numbers of people and first appliance usages corresponding to a first time duration in a specific space; establishing a predictive model related to the first time duration according to the first numbers of people and the appliance usages; detecting a second appliance usages in a second time duration; predicting a second number of people corresponding to the second time duration and the second appliance usages according to the predictive model.

Abstract: A power consumption prediction apparatus, method, and non-transitory computer readable storage medium thereof are provided. The power consumption prediction apparatus receives a plurality of power consumption data of an appliance, wherein the power consumption data have a temporal sequence. Each power consumption datum includes a recorded status and a recorded time length, wherein each recorded status is one of a plurality operation statuses of the appliance. The power consumption prediction apparatus calculates an average operation time length of each operation status according to the recorded statuses and the recorded time lengths and calculates at least one transferring probability of each operation status according to the temporal sequence and the power consumption data. Each transferring probability is the probability of entering into a target status from a source status, wherein the source status is one of the operation statuses and the target status is one of the operation statuses.

Abstract: A system and method of appropriate services detection for a smart building are disclosed in the present invention. The invention may select appropriate services for a house or a building. After a user lives in a smart building with the system of the present invention for a period of time, the system uses the service gateway to collect and analyze environment information and appliance information so as to find relationship within appliances, sensors and actuators. Thus the cloud service platform selects appropriate services for the building to avoid downloading or installing an inappropriate service by a user. Further the cloud service platform may suggest a user buying additional equipment for matching the requirement of a service. The system of the present invention may learn a relationship of devices; locate positions of devices; and automatically collect state data of appliances to identify the appliances.

Abstract: A power monitoring device for identifying the state of an electric appliance based on user feedbacks and a power monitoring method thereof are provided. The power monitoring device includes a measurement module, a variation detection and search module, and an electric appliance signature database established based on user feedbacks. When the measurement module detects a variation of a power consumption feature, the variation detection and search module searches the electric appliance signature database according to the variation to obtain electric appliances similar to the variation and the states thereof. A user contributes data to the electric appliance signature database by confirming the search result, or selecting the correct electric appliance and the state thereof. When the user confirms the search result, the power monitoring device establishes an association between the electric appliance and its electric appliance signatures and updates the electric appliance signature database.

Abstract: The invention provides a white light illumination device including an ultraviolet excitation light source and an ultraviolet excitable aluminosilicate phosphor. The ultraviolet excitable aluminosilicate phosphor has a formula as (M1-x,Rex)aAlbSicOd:D, wherein M is Mg, Ca, Sr, Ba or combination thereof. In addition, Re is Y, La, Pr, Nd, Eu, Gd, Tb, Ce, Dy, Yb, Er, Sc, Mn, Zn, Cu, Ni, Lu or combination thereof, while 0<a, b, c, d, 2a+3b+4c=2d, and 0?x?a. Furthermore, D is F, Cl, I, Br, OH, S or combinations thereof. The aluminosilicate phosphor emits blue or blue-green light under the excitation of ultraviolet light, and the aluminosilicate phosphor may further collocate with different color phosphors to provide a white light illumination device.

Abstract: A composite chip varistor device includes a body; at least one inner varistor, disposed in the body; and a plurality of end electrodes, disposed at two sides of the inner varistor. The body is a highly insulative and imporous mono-material. The body of the present invention provides protection for the inner varistor to avoid being damaged by external factors and the manufacturing cost of the varistor device is effectively reduced.

Abstract: The invention provides a white light illumination device including an ultraviolet excitation light source and an ultraviolet excitable aluminosilicate phosphor. The ultraviolet excitable aluminosilicate phosphor has a formula as (M1-x,Rex)aAlbSicOd:D, wherein M is Mg, Ca, Sr, Ba or combination thereof. In addition, Re is Y, La, Pr, Nd, Eu, Gd, Tb, Ce, Dy, Yb, Er, Sc, Mn, Zn, Cu, Ni, Lu or combination thereof, while 0<a,b,c,d, 2a+3b+4c=2d, and 0?x?a. Furthermore, D is F, Cl, I, Br, OH, S or combinations thereof. The aluminosilicate phosphor emits blue or blue-green light under the excitation of ultraviolet light, and the aluminosilicate phosphor may further collocate with different color phosphors to provide a white light illumination device.

Abstract: The present invention discloses an insulation structure for multilayer passive elements and a fabrication method thereof, wherein a protective insulation film is formed on the surface of a multilayer passive element; a transformation process is performed at a transformation temperature to convert the protective insulation films within the areas exactly below external electrodes into conductors, and the other portion of the protective insulation film still remains insulating. The present invention can protect passive elements from corrosion in the succeeding procedures with a simple fabrication process and without extra material and equipments. Further, the fabrication speed of the present invention is the same as that of a common external-electrode coating, and the fabrication of the present invention can also be automated for mass-production.