Abstract: A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. The semiconductor device is placed and pressed onto a substrate by the pick and place device. An encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. A redistribution structure is formed over the semiconductor device and the encapsulating material. The substrate is removed.

Abstract: In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second interconnect structure, the sidewall of the first substrate being laterally offset from a sidewall of the second substrate and a sidewall of the second interconnect structure.

Abstract: A semiconductor device and a semiconductor manufacturing method thereof are provided. The semiconductor manufacturing method includes the following streps. A first semiconductor element with a first bonding film is formed. The first bonding film is formed on a first side of the first semiconductor element. The first semiconductor element and the first bonding film form a taper structure. The first bonding film forms a wide portion of the taper structure. The first semiconductor element forms a narrow portion of the taper structure. A second semiconductor element with a second bonding film is formed. The second bonding film is formed on the second semiconductor element. The first semiconductor element and the second semiconductor element are bonded by bonding the first bonding film and the second bonding film. An oxide layer is filled to surround the first semiconductor element and the first bonding film.

Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.

Abstract: The present disclosure relates to a system, a method and a computer-readable medium for rendering a streaming on a user terminal. The method includes rendering the streaming in a first mode, receiving an environment parameter of the user terminal, receiving a timing when the user terminal closes the streaming, determining a threshold value of the environment parameter based on the timing the user terminal closes the streaming, receiving an updated environment parameter of the user terminal, and rendering the streaming in a second mode if the updated environment parameter meets the threshold value. The second mode includes fewer data objects than the first mode or includes a downgraded version of a data object in the first mode for the rendering. The present disclosure can customize the rendering mode for each user and maximize the satisfaction of viewing streaming for each user.

Abstract: A purification apparatus and a method of purifying hot zone parts are provided. The purification apparatus is configured to remove impurities attached on at least one hot zone part. The purification apparatus includes a crystal high temperature furnace, an enclosed box disposed in the crystal high temperature furnace, an outer tube connected to the crystal high temperature furnace and the enclosed box, an inner tube disposed in the outer tube, and a gas inlet cover connected to the outer tube. The crystal high temperature furnace includes a furnace body, a furnace cover, and a thermal field module disposed in the furnace body. The gas inlet cover is configured to input a noble gas into the enclosed box through the inner tube, and the thermal field module is configured to heat the noble gas so that the impurities are heated and vaporized through the noble gas.

Abstract: A chain ring includes a chain ring body, a plurality of first teeth, a plurality of second teeth and at least one recess. The chain ring body has a radial outer circumference. The first teeth and the second teeth are respectively extended from the radial outer circumference and alternately arranged on the radial outer circumference of the chain ring body. Each second tooth includes a tooth tip and a tooth flank, and the tooth flank is extended between the tooth tip and the chain ring body, and in a first direction parallel to a rotation axis, the tooth flank includes a first surface and a second surface opposite to the first surface. The at least one recess is disposed on one of the first surface and the second surface of the tooth flank of at least one of the second tooth.

Abstract: A backlight module includes a back plate, light sources, protrusive pieces and a reflective sheet. The light sources are disposed on the back plate. The protrusive pieces protrude from the back plate. Each of the protrusive pieces is located between at least two adjacent light sources. The reflective sheet is disposed on the back plate and has through holes. Each of the light sources passes through a corresponding through hole. The reflective sheet further has cutting line groups. Each of the cutting line groups includes two cutting lines intersected at an intersection point. Each of the intersection points is substantially aligned with a corresponding protrusive piece. Portions of the reflective sheet adjacent to the cutting line groups are warped upwards from the back plate, and respectively resist the protrusive pieces.

Abstract: A backlight module includes a back plate, light sources, protrusive pieces and a reflective sheet. The light sources are disposed on the back plate. The protrusive pieces protrude from the back plate. Each of the protrusive pieces is located between at least two adjacent light sources. The reflective sheet is disposed on the back plate and has through holes. Each of the light sources passes through a corresponding through hole. The reflective sheet further has cutting line groups. Each of the cutting line groups includes two cutting lines intersected at an intersection point. Each of the intersection points is substantially aligned with a corresponding protrusive piece. Portions of the reflective sheet adjacent to the cutting line groups are warped upwards from the back plate, and respectively resist the protrusive pieces.

Abstract: A bicycle drive unit includes a crank having multiple branched radially extending from one end thereof. Each branch has a through hole defined therein. A chain wheel set is laterally mounted to the branches of the crank. The chain wheel set has multiple threaded holes defined therein and each threaded hole co-axially aligning with a corresponding one of the multiple through holes in the crank. A fastener is screwed into a corresponding one of the threaded holes in the chain wheel set after extending through a corresponding one of the multiple through holes in the crank for assembling the crank and the chain wheel set.

Abstract: A developer cup. The developer cup includes a bed. A central spindle is vertically and rotatably coupled to a center of the bed through an end of the central spindle. A chuck is vertically coupled to an end of the central spindle opposite to the bed end. An upper coupling is coupled to the central spindle between the chuck and the bed, wherein the chuck. A lower coupling is moveably coupled to the central spindle between the upper coupling and the bed. The annular cup has an upper wheel and a lower wheel, wherein the upper wheel is aligned with the lower wheel, the upper wheel is coupled to the lower wheel through a plurality of the brackets, and the lower wheel is smaller than the upper wheel.