Abstract: A multidrop network system includes N network devices. The N network devices include a master device and multiple slave devices, and each network device has an identification code as its own identification in the multidrop network system. The N network devices have N identification codes and obtain transmission opportunities in turn according to the N identification codes in each round of data transmission. Each network device performs a count operation to generate a current count value, and when the identification code of a network device is the same as the current count value, this network device obtains a transmission opportunity. After a device obtains the transmission opportunity, it determines whether a cut-in signal from another network device is observed in a front duration of a predetermined time slot, and then determines whether to abandon/defer the right to start transmitting in the remaining duration of the predetermined time slot.

Abstract: A mask storage device for storing a mask used in lithography comprises a desiccant retainer for receiving a desiccant, the desiccant retainer comprising one or more passages. The mask storage device also comprises a first shell and a second shell, the second shell removably attached to the first shell and arranged to form a sealed space with the first shell in a closed state. The desiccant retainer is positioned in the sealed space. The mask storage device also comprises a gasket positioned between the first shell and the second shell. The gasket is configured to create a sufficiently airtight seal between the first shell and the second shell in the closed state. The one or more passages of the desiccant retainer comprise one or more membranes.

Abstract: A mask storage device for storing a mask used in lithography comprises a desiccant retainer for receiving a desiccant, the desiccant retainer comprising one or more passages. The mask storage device also comprises a first shell and a second shell, the second shell removably attached to the first shell and arranged to form a sealed space with the first shell in a closed state. The desiccant retainer is positioned in the sealed space. The mask storage device also comprises a gasket positioned between the first shell and the second shell. The gasket is configured to create a sufficiently airtight seal between the first shell and the second shell in the closed state. The one or more passages of the desiccant retainer comprise one or more membranes.

Abstract: A mask storage device and a method of preventing defect formation on a mask are provided. The method includes providing a mask storage device comprising a first and second shell configured to form a sealed space in a closed state and a desiccant positioned within the mask storage device. The method further includes placing a mask inside the mask storage device and sealing the mask storage device with the mask and desiccant inside the sealed space.

Abstract: A mask storage device and a method of preventing defect formation on a mask are provided. The method includes providing a mask storage device comprising a first and second shell configured to form a sealed space in a closed state and a desiccant positioned within the mask storage device. The method further includes placing a mask inside the mask storage device and sealing the mask storage device with the mask and desiccant inside the sealed space.

Abstract: A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.

Abstract: An exposure system and method for use in an exposure tool. The system includes a compensation unit and an exposure unit. The compensation unit receives a fine-tuning value for an overlay correction parameter for a product in a first run. The compensation unit further receives an adjustment period for an exposure tool, an adjustment time for the exposure tool, and a process time for the product in a second run. The compensation unit also receives an equipment baseline offset of the exposure tool after adjustment, and compensates the fine-tuning value for the overlay correction parameter for the product accordingly. The exposure tool performs overlay processes on a wafer according to the compensated fine-tuning value for the overlay correction parameter.

Abstract: A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.

Abstract: An exposure system and method for use in an exposure tool. The system includes a compensation unit and an exposure unit. The compensation unit receives a fine-tuning value for an overlay correction parameter for a product in a first run. The compensation unit further receives an adjustment period for an exposure tool, an adjustment time for the exposure tool, and a process time for the product in a second run. The compensation unit also receives an equipment baseline offset of the exposure tool after adjustment, and compensates the fine-tuning value for the overlay correction parameter for the product accordingly. The exposure tool performs overlay processes on a wafer according to the compensated fine-tuning value for the overlay correction parameter.