Patents by Inventor Yung-Chin Wu

Yung-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Using a self-assembly layer to facilitate selective formation of an etching stop layer
    Patent number: 12009202
    Abstract: A structure is provided that includes a first conductive component and a first interlayer dielectric (ILD) that surrounds the first conductive component. A self-assembly layer is formed on the first conductive component but not on the first ILD. A first dielectric layer is formed over the first ILD but not over the first conductive component. A second ILD is formed over the first conductive component and over the first ILD. An opening is etched in the second ILD. The opening is at least partially aligned with the first conductive component. The first dielectric layer protects portions of the first ILD located therebelow from being etched. The opening is filled with a conductive material to form a second conductive component in the opening.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue
  • Bioreactor system
    Publication number: 20060148072
    Abstract: A bioreactor system. A supply container receives a cultivation solution. A bioreactor container is connected to the supply container and includes a porous carrier. The porous carrier carries a plurality of cells. The cultivation solution circulates between the supply container and the bioreactor container, providing needed nutrients to the cells.
    Type: Application
    Filed: August 12, 2005
    Publication date: July 6, 2006
    Inventors: Chun-Jen Liao, Yung-Chin Wu, Ko-Chun Hsu, Hua-Chun Hsu, Chen-Chi Tsai, Da-Pan Chen