Abstract: The fastening elements 71 are first set through the rotary disk 1 to be then fixed to the retention plates 2 so that the stretching force induced by the fixing operation is acting upon the retention plates 2. This helps prevent the rotary disk 1 from being affected by the stretching force and thus deformed. Further, the fastening holes 22 are located adjacent to the retention grooves 21 so that they can directly and effectively apply forces to the support members 3 and due to the torque (distance) thereof with respect to the support members 3 being reduced, it is possible to effectively reduce the occurrence of deformation of the retention plates 2.

Abstract: A sextant rotary disk structure includes a rotary disk in which circumferentially distributed mounting slots are formed, the retention plates received in the mounting slots and having sides forming retention grooves, support members arranged between the mounting slots and the retention grooves, fastening elements extending through the rotary disk and the retention plates for fixing, an insertion element arranged at a center of the rotary disk and having a conic insertion hole in a convergent configuration, and a rotary shaft having an end forming an insertion cone insertable into the conic insertion hole. The thickness of the rotary disk can be increased to improve the strength thereof. Maintenance can be performed by only replacing deformed ones of the retention plates. The arrangement of the conic insertion hole and the insertion cone prevents undesired sticking.

Abstract: The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.

Abstract: The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.