Patents by Inventor Yung-Chun Chen
Yung-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240165772Abstract: A hand tool and a method for manufacturing the same are provided. The method for manufacturing the hand tool includes following steps of: determining a target size according to a first standard range and a second standard range; and forming a hand tool body according to the target size. The hand tool body includes an opening and a plurality of sidewalls defining the opening, and a distance between two said sidewalls radially opposite to each other corresponds to the target size.Type: ApplicationFiled: November 21, 2022Publication date: May 23, 2024Inventors: YUNG-SHUN CHEN, TZU-CHUN CHEN
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Patent number: 11985784Abstract: A server information handling system is secured by a bezel that couples to an access location, such as an air vent at a front or rear face of a housing. The bezel includes a security structure having a lock and configured to couple directly at the front face or with a bezel extension at the rear face so that the server information handling system can use the same bezel with both a front face or rear face rack mount. The bezel has a lock integrated with the security structure, an air filter that fits over the security structure to filter air flowing into the housing, and a filter brace that captures the air filter by coupling to the security structure over the air filter. The filter brace attaches and detaches at the security structure when the security structure locks a server information handling system housing so that the air filter can be changed while the housing remains secure.Type: GrantFiled: October 27, 2021Date of Patent: May 14, 2024Assignee: Dell Products L.P.Inventors: Peter T. Clark, Amrita Sidhu Maguire, Richard W. Guzman, Sean P. O'Donnell, Matthew B. Gilbert, Georg Todtenbier, Oscar Coutinho, Yung-Chun Chen, Ming-Chiao Lee, Chi-Sung Chang
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Publication number: 20240153895Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.Type: ApplicationFiled: April 19, 2023Publication date: May 9, 2024Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
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Publication number: 20240122078Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
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Patent number: 11955154Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.Type: GrantFiled: May 16, 2022Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
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Patent number: 11955370Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.Type: GrantFiled: September 18, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Cyuan Lu, Ting-Gang Chen, Sung-En Lin, Chunyao Wang, Yung-Cheng Lu, Chi On Chui, Tai-Chun Huang, Chieh-Ping Wang
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Patent number: 11948920Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.Type: GrantFiled: August 30, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
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Patent number: 11942130Abstract: A bottom-pinned spin-orbit torque magnetic random access memory (SOT-MRAM) is provided in the present invention, including a substrate, a bottom electrode layer on the substrate, a magnetic tunnel junction (MTJ) on the bottom electrode layer, a spin-orbit torque (SOT) layer on the MTJ, a capping layer on the SOT layer, and an injection layer on the capping layer, wherein the injection layer is divided into individual first part and second part, and the first part and the second part are connected respectively with two ends of the capping layer.Type: GrantFiled: March 23, 2022Date of Patent: March 26, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Jian-Jhong Chen, Yi-Ting Wu, Jen-Yu Wang, Cheng-Tung Huang, Po-Chun Yang, Yung-Ching Hsieh
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Publication number: 20230128507Abstract: A server information handling system is secured by a bezel that couples to an access location, such as an air vent at a front or rear face of a housing. The bezel includes a security structure having a lock and configured to couple directly at the front face or with a bezel extension at the rear face so that the server information handling system can use the same bezel with both a front face or rear face rack mount. The bezel has a lock integrated with the security structure, an air filter that fits over the security structure to filter air flowing into the housing, and a filter brace that captures the air filter by coupling to the security structure over the air filter. The filter brace attaches and detaches at the security structure when the security structure locks a server information handling system housing so that the air filter can be changed while the housing remains secure.Type: ApplicationFiled: October 27, 2021Publication date: April 27, 2023Applicant: Dell Products L.P.Inventors: Peter T. Clark, Amrita Sidhu Maguire, Richard W. Guzman, Sean P. O'Donnell, Matthew B. Gilbert, Georg Todtenbier, Oscar Coutinho, Yung-Chun Chen, Ming-Chiao Lee, Chi-Sung Chang
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Publication number: 20230129135Abstract: A server information handling system is secured by a bezel that couples to an access location, such as an air vent at a front or rear face of a housing. The bezel includes a security structure having a lock and configured to couple directly at the front face or with a bezel extension at the rear face so that the server information handling system can use the same bezel with both a front face or rear face rack mount. The bezel has a lock integrated with the security structure, an air filter that fits over the security structure to filter air flowing into the housing, and a filter brace that captures the air filter by coupling to the security structure over the air filter. The filter brace attaches and detaches at the security structure when the security structure locks a server information handling system housing so that the air filter can be changed while the housing remains secure.Type: ApplicationFiled: October 27, 2021Publication date: April 27, 2023Applicant: Dell Products L.P.Inventors: Peter T. Clark, Amrita Sidhu Maguire, Richard W. Guzman, Sean P. O'Donnell, Matthew B. Gilbert, Georg Todtenbier, Oscar Coutinho, Yung-Chun Chen, Ming-Chiao Lee, Chi-Sung Chang
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Patent number: D972572Type: GrantFiled: February 9, 2021Date of Patent: December 13, 2022Assignee: Dell Products L.P.Inventors: Peter Clark, Richard W. Guzman, Sean P. O'Donnell, Georg Todtenbier, Oscar Coutinho, Yung-Chun Chen, Ming-Chiao Lee