Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.

Abstract: A radio frequency (RF) shield includes a shield enclosure formed of conductive material that defines and partially encloses an interior cavity. The shield enclosure is configured to receive, within the interior cavity, a shielding partition securable in a fixed position that defines one end of a first chamber within a narrow portion of the shield enclosure. The first chamber provides RF isolation of an RF conductor that is enclosed within the first chamber.

Abstract: A radio frequency shield is disclosed.