Patents by Inventor Yung-Chung Chang
Yung-Chung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250081730Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.Type: ApplicationFiled: June 26, 2024Publication date: March 6, 2025Inventors: Andrew Lin, Alper Ozgurluk, Chao Liang Chien, Cheuk Chi Lo, Chia-Yu Chen, Chien-Chung Wang, Chih Pang Chang, Chih-Hung Yu, Chih-Wei Chang, Chin Wei Hsu, ChinWei Hu, Chun-Kai Tzeng, Chun-Ming Tang, Chun-Yao Huang, Hung-Che Ting, Jung Yen Huang, Lungpao Hsin, Shih Chang Chang, Tien-Pei Chou, Wen Sheng Lo, Yu-Wen Liu, Yung Da Lai
-
Patent number: 8783579Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.Type: GrantFiled: July 4, 2012Date of Patent: July 22, 2014Assignee: Industrial Technology Research InstituteInventors: Li-Chi Chang, Yung-Chung Chang, Chang-Chih Liu, Cheng-Hua Tsai, Meng-Sheng Chen
-
Patent number: 8686821Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.Type: GrantFiled: June 19, 2012Date of Patent: April 1, 2014Assignee: Industrial Technology Research InstituteInventors: Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Cheng-Hua Tsai
-
Publication number: 20140008443Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.Type: ApplicationFiled: July 4, 2012Publication date: January 9, 2014Applicant: Industrial Technology Research InstituteInventors: Li-Chi Chang, Yung-Chung Chang, Chang-Chih Liu, Cheng-Hua Tsai, Meng-Sheng Chen
-
Patent number: 8610626Abstract: An antenna having a signal feeding structure, an antenna conductor coupled to the signal feeding structure and forming a slot in the antenna conductor. A closing portion capacitively closing the at least one slot at a mechanically open end of the slot.Type: GrantFiled: December 9, 2010Date of Patent: December 17, 2013Assignee: Industrial Technology Research InstituteInventors: Li-Chi Chang, Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Chang-Sheng Chen
-
Publication number: 20130187743Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.Type: ApplicationFiled: June 19, 2012Publication date: July 25, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Cheng-Hua Tsai
-
Patent number: 8480773Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.Type: GrantFiled: June 14, 2011Date of Patent: July 9, 2013Assignee: IV Technologies Co., Ltd.Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
-
Patent number: 8339233Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.Type: GrantFiled: May 18, 2011Date of Patent: December 25, 2012Assignee: Industrial Technology Research InstituteInventors: Cheng-Hua Tsai, Chang-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Yung-Chung Chang
-
Publication number: 20120146853Abstract: An antenna having a signal feeding structure, an antenna conductor coupled to the signal feeding structure and forming a slot in the antenna conductor. A closing portion capacitively closing the at least one slot at a mechanically open end of the slot.Type: ApplicationFiled: December 9, 2010Publication date: June 14, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Chi CHANG, Yung-Chung CHANG, Meng-Sheng CHEN, Chang-Chih LIU, Chang-Sheng CHEN
-
Publication number: 20120146757Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.Type: ApplicationFiled: May 18, 2011Publication date: June 14, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Hua Tsai, Chang-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Yung-Chung Chang
-
Publication number: 20110241258Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.Type: ApplicationFiled: June 14, 2011Publication date: October 6, 2011Applicant: IV Technologies Co., Ltd.Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
-
Patent number: 8016647Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.Type: GrantFiled: March 20, 2007Date of Patent: September 13, 2011Assignee: IV Technologies Co., Ltd.Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
-
Patent number: 7875335Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.Type: GrantFiled: April 24, 2006Date of Patent: January 25, 2011Assignee: IV Technologies Co., Ltd.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
-
Publication number: 20080102741Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.Type: ApplicationFiled: December 26, 2007Publication date: May 1, 2008Applicant: IV TECHNOLOGIES CO., LTD.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
-
Patent number: 7335094Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.Type: GrantFiled: July 22, 2006Date of Patent: February 26, 2008Assignee: IV Technologies Co., Ltd.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
-
Publication number: 20070259612Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.Type: ApplicationFiled: March 20, 2007Publication date: November 8, 2007Applicant: IV TECHNOLOGIES CO., LTD.Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
-
Patent number: 7285233Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.Type: GrantFiled: January 10, 2006Date of Patent: October 23, 2007Assignee: IV Technologies Co., Ltd.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
-
Patent number: 7258602Abstract: A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the window has at least one second groove therein. More particularly, the first groove is deeper than the second groove. The polishing pad having a grooved window therein has advantages of providing precise endpoint detection and thereby reducing or resolving defect problems.Type: GrantFiled: September 24, 2004Date of Patent: August 21, 2007Assignee: IV Technologies Co., Ltd.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
-
Patent number: 7241408Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.Type: GrantFiled: April 24, 2006Date of Patent: July 10, 2007Assignee: I.V. Technologies Co., Ltd.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
-
Publication number: 20060258277Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.Type: ApplicationFiled: July 22, 2006Publication date: November 16, 2006Applicant: IV TECHNOLOGIES CO., LTD.Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu