Patents by Inventor Yung-Fong Chen

Yung-Fong Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Publication number: 20070137773
    Abstract: A die bonding apparatus comprising a tape transfer device and a bonding device is provided. The tape transfer device includes a roller tape and a first roller axle. The roller tape comprises a plurality of glue layers and a first releasing film. Both surfaces of the glue layers are adhesive. The first releasing film covers one of the surfaces of the glue layers. The first roller axle is used for rolling up the first releasing film so as to rotate the roller tape. The bonding device is disposed at the front end of the tape transfer device. The bonding device includes at least a robotic arm and a controller. The controller controls the rotation and movement of the robotic arm.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 21, 2007
    Inventors: Yung-Fong Chen, Cheng-Wen Ou, In-Shieh Liu