Patents by Inventor Yung-Han Kuo

Yung-Han Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133514
    Abstract: A frame device includes a back board, a buckle member and a casing. The back board has a groove. The buckle member is disposed on the back board, and has a first part member and the second part member disposed corresponding to the groove, and a distance between the first part member and the second part member varies along a direction. The casing is provided with a hook having a first engaging part and a second engaging part, and a distance between the first engaging part and the second engaging part varies along the direction. The first part member is engaged with the first engaging part, and the second part member is engaged with the second engaging part.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 25, 2024
    Inventors: Heng-Shen KUO, Yung-Shen HUANG, I-Han LIU
  • Patent number: 11942417
    Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Chi Chu, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20150070819
    Abstract: A power supply system has a housing and a front panel. The housing has multiple power supply slots disposed on a rear of the housing for mounting multiple power supplies respectively. The front panel has multiple peak portions and multiple valley portions arranged alternately to form a multi-dimensional space. Each peak portion has a first inclined wall for mounting multiple terminal holders, and has a second inclined wall for forming a heat dissipating structure. Electric power is input into the server power supply system via the terminal holder and is transformed and transmitted to the power supplies. With the terminal holders and the heat dissipating structures disposed on the peak portions of the front panel, space of the front of the housing can be utilize efficiently and heat dissipating efficiency to the server power supply system is also improved.
    Type: Application
    Filed: February 12, 2014
    Publication date: March 12, 2015
    Applicant: ACBEL POLYTECH INC.
    Inventors: Yung-Han KUO, Hsin-Yan CHIEN
  • Publication number: 20100052482
    Abstract: A case has a base and a bolt assembly. The base has a distal sidewall with a mounting hole and a proximal sidewall with a large hole and a small hole. The small hole communicates with the large hole. The bolt assembly has a bolt. The bolt has a proximal end, a distal end and a stopping flange. The proximal end protrudes into the large hole via the mounting hole and is engaged with the small hole. The distal end protrudes into the mounting hole and has a knob abutting an outer surface of the distal sidewall. The stopping flange is annular and protrudes around the bolt. The knob and the stopping flange allow the bolt to connect securely with the base. The case can be assembled and disassembled quickly and easily without using any tool, which saves time and lowers cost.
    Type: Application
    Filed: March 16, 2009
    Publication date: March 4, 2010
    Inventor: Yung-Han Kuo