Abstract: A semiconductor device includes a first stacked structure, a second stacked structure, a first vertical connector, and a second vertical connector. The first stacked structure includes a first stacked wafer and a first bonding layer. The first stacked wafer includes multiple first dielectric bonding interfaces. The second stacked structure includes a second stacked wafer and a second bonding layer. The second stacked wafer includes multiple second dielectric bonding interfaces. The first bonding layer is bonded and electrically connected to the second bonding layer, such that there is a hybrid bonding interface between the first stacked structure and the second stacked structure. The first vertical connector penetrates the first dielectric bonding interfaces and is electrically connected to the first bonding layer. The second vertical connector penetrates the second dielectric bonding interfaces and is electrically connected to the second bonding layer.

Abstract: An electronic device includes a substrate, a sensor, an inner cover, a water proof member, and an outer cover. The sensor is disposed on the substrate. The inner cover is disposed on the substrate and covers the sensor. The inner cover includes an opening. The water proof member is disposed on the inner cover and covers the opening. The outer cover is disposed on the substrate and covers the inner cover, so that a drainage chamber is formed between the inner cover and the outer cover. The drainage chamber communicates with outside through a first hole and a second hole. The first hole and the second hole are staggered with the opening. A portion of the drainage chamber between the first hole and the second hole acts as a drainage channel. A length of the drainage channel is greater than a diameter of the opening.

Abstract: An electronic device includes a first substrate, a second substrate, a sensor, a lid, a water proof member, and an outer cover. The first substrate includes a first inner cavity and a through hole. The second substrate is stacked on the first substrate so as to form a second inner cavity and a straight airflow channel. The sensor is disposed on the first substrate, covers the through hole, and includes a back cavity. The lid is disposed on the second substrate, covers the second inner cavity, and includes an opening. The water proof member covers the opening. The outer cover is disposed on the lid and forms a drainage chamber with the lid. The outer cover includes a first hole and a second hole connecting the drainage chamber to the outside. The first hole and the second hole are staggered from the opening.

Abstract: A 3D stack package structure includes a first chip, a second chip, a through-silicon via (TSV), and a multi-layer protective structure. The second chip is bonded to the first chip. The second chip includes an interconnect structure composed of multiple metal layers and a plurality of vias respectively connecting upper and lower layers of the multiple metal layers. The TSV extends through the second chip. The multi-layer protective structure is disposed within the second chip and surrounds the TSV. The multi-layer protective structure includes: multiple protective layers, each having an opening for passage of the TSV; and a plurality of sealing rings, respectively connecting upper and lower layers of the multiple protective layers and surrounding the TSV.

Abstract: An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.

Abstract: An adjusting module configured to adjust a boresight of a lens module is provided. The adjusting module includes a fixed plate, a movable plate and at least one adjusting unit. The movable plate is movably connected to a first surface of the fixed plate. The movable plate is suitable for disposing the lens module. A light-emitting surface of the lens module is on a same side as the first surface, and a light incident surface of the lens module is on a same side as a second surface. Each of the adjusting unit includes a driving member and a driven member. The driving member is pivotally disposed on the fixed plate along a first axis and linked to the driven member. The driven member is movably connected to the fixed plate and the movable plate along a second axis. The first axis is perpendicular to the second axis. When the driving member rotates while taking the first axis as a rotating axis, the driving member drives the driven member to move the movable plate along the second axis.

Abstract: An electronic device, including a substrate, a package component, a first sensor chip, and a second sensor chip, is provided. The substrate has an inner space and a first through hole communicated with the inner space. The package component is disposed on the substrate and forms a front chamber and a back chamber together with the substrate. The package component has an opening. The front chamber is communicated with an outside air by the opening. The inner space constitutes at least part of the back chamber, and the back chamber is communicated with the front chamber by the first through hole. The first sensor chip is disposed on the substrate and covers the first through hole to separate an airflow in the front chamber and an airflow in the back chamber. The second sensor chip is disposed on the substrate and located in the back chamber.

Abstract: A wafer stacking method includes the following steps. A first wafer is provided. A second wafer is bonded to the first wafer to form a first wafer stack structure. A first edge defect inspection is performed on the first wafer stack structure to find a first edge defect and measure a first distance in a radial direction between an edge of the first wafer stack structure and an end of the first edge defect away from the edge of the first wafer stack structure. A first trimming process with a range of a first width is performed from the edge of the first wafer stack structure to remove the first edge defect. Herein, the first width is greater than or equal to the first distance.

Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a sparkling drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container in order, so as to automatically form a sparkling drink/aerated drink with a predetermined flavor within the beverage container.

Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a layered drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container, so as to automatically form a layered drink/gradient drink having at least two color layers within the beverage container.

Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.

Abstract: A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of the lower opening is larger than an aperture of the upper opening. The sensing module is disposed on the first surface of the substrate and covers the upper opening. The waterproof layer is disposed on the second surface of the substrate and covers the lower opening. The waterproof layer has multiple fine holes. The fine holes are communicated with the acoustic hole. The cover is disposed on the first surface and covers the sensing module.

Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.

Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.

Abstract: A mold apparatus including a mold, a bearing structure, and a sensing module is provided. The mold has a cavity. The sensing module includes a temperature sensor and a pressure sensor. The temperature sensor has a sensing portion and an abutting portion. The sensing portion is located in the mold and corresponds to a position in the cavity, and the abutting portion is located in the bearing structure. The pressure sensor is disposed in the bearing structure and corresponds to the abutting portion. The abutting portion is adapted to abut against the pressure sensor by a pressure of the position in the cavity.

Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.

Abstract: An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.