Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of the lower opening is larger than an aperture of the upper opening. The sensing module is disposed on the first surface of the substrate and covers the upper opening. The waterproof layer is disposed on the second surface of the substrate and covers the lower opening. The waterproof layer has multiple fine holes. The fine holes are communicated with the acoustic hole. The cover is disposed on the first surface and covers the sensing module.

Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.

Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.

Abstract: A mold apparatus including a mold, a bearing structure, and a sensing module is provided. The mold has a cavity. The sensing module includes a temperature sensor and a pressure sensor. The temperature sensor has a sensing portion and an abutting portion. The sensing portion is located in the mold and corresponds to a position in the cavity, and the abutting portion is located in the bearing structure. The pressure sensor is disposed in the bearing structure and corresponds to the abutting portion. The abutting portion is adapted to abut against the pressure sensor by a pressure of the position in the cavity.

Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.

Abstract: An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: The disclosure provides an injection molding apparatus, including a mold unit, an injecting unit, and a counter pressure unit. The mold unit is adapted to provide a first cavity and a second cavity. The injecting unit is adapted to inject a first material into the first cavity to form a first molded object. The second cavity is adapted to accommodate the first molded object. The injecting unit is adapted to inject a second material into the second cavity to form a second molded object, such that the first molded object and the second molded object in the second cavity are combined. The second material is a foaming material. And the counter pressure unit is adapted to provide gas into the second cavity to increase the pressure in the second cavity.

Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus includes a mold, an injection device, a porous structure, and a gas-driven unit. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity so that the material is formed into a forming article. The porous structure is disposed on an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. The gas-driven unit is connected to the mold and is adapted to drive a gas to flow into or flow out of the mold cavity through the porous structure. In addition, an injection molding method is also provided.

Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.

Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.

Abstract: An injection molding apparatus including an injection device, a mold, a gas supply device, and a temperature control device is provided. The mold has a mold cavity, wherein the injection device is adapted to inject a material into the mold cavity. The gas supply device is adapted to supply a gas to the mold cavity such that the pressure in the mold cavity is increased. The temperature control device is adapted to control the temperature in the mold cavity. In addition, an injection molding method is also provided.