Abstract: The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.

Abstract: The invention relates to a vertical light-emitting diode chip structure capable of measuring temperature and a temperature measurement calibration method thereof. A semiconductor epitaxial structure and a metal film resistance temperature measurement structure are separately arranged on the upper plane of a transverse high thermal conductivity extension structure. Through the high thermal conductivity characteristic of the transverse high thermal conductivity extension structure, the temperature of an active layer of the semiconductor epitaxial structure can be quickly transferred to the metal film resistance temperature measurement structure. The temperature measurement calibration method comprises: placing a plurality of connected and uncut package support plates into a constant temperature device at the same time to obtain a temperature calibration relation for different package support plates at the same time to reduce the temperature calibration cost in a batch mass production mode.

Abstract: The invention provides an automotive lighting unit for detecting electrical characteristics of light emitter diode component. At least one light emitter diode light source is selectively disposed on any one of at least one circuit channel of at least one drive power loop. At least one circuit breaker comprises at least one circuit switch corresponding to the at least one drive power loop, and is disposed on the circuit channel with the at least one light emitter diode light source. The at least one circuit channel is controlled by the at least one circuit switch to turn in a state of isolating from a drive power. An ammeter connection line is connected with the two sides one of the at least one light emitter diode light source.

Abstract: The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.

Abstract: A three-in-one RGB mini-LED device includes a substrate, a second electrical semiconductor layer, a plurality of multiple-quantum well layers, a plurality of first electrical semiconductor layers, and a plurality of mirrors. The second electrical semiconductor layer is disposed on the substrate. The plurality of multiple-quantum well layers are disposed on the second electrical semiconductor layer. An area of each of the plurality of multiple-quantum well layers is smaller than an area of the second electrical semiconductor layer, and a region on the second semiconductor layer is not covered by the plurality of multiple-quantum well layers.

Abstract: A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrodes electrically connected to the first electrodes on the package surface layer, cutting the light-emitting diode chips, sorting and testing as well as regrouping the light-emitting diode chips, covering sides of the light-emitting diode chips with a package layer, drilling and filling a conductive material on the package layer to form a plurality of common electrodes, and then printing a plurality of common electrical circuits, electrically connecting each of the common electrical circuits to one of the common electrodes and the leading electrodes, and finally covering with a circuit protection layer to complete the process.

Abstract: A light source module is provided. The light source module includes a full wave rectifier, a constant current output integrated circuit (IC) and at least one high operating voltage light emitting diode (HVLED) die coupled between the constant current output IC and a ground. The full wave rectifier generates a rectified signal according to an alternating current (AC) power. The constant current output IC outputs a constant current signal according to the rectified signal. A brightness of the HVLED die is determined by the constant current signal.

Abstract: A light emitting diode (LED) lamp. Brightness of the LED lamp is controlled by a dimmer and an external alternating current (AC) source is received via the dimmer. The LED lamp includes at least one LED, a rectifying-modulating-driving apparatus and a current holding compensator. The rectifying-modulating-driving apparatus is coupled between the LED and the dimmer for bridge-rectifying and modulating an AC source with a conducting angle from the dimmer to drive the LED. The current holding compensator is coupled to the rectifying-modulating-driving apparatus to provide a compensation current when the AC source with the conducting angle is lower than a voltage after being bridge-rectified.

Abstract: A method of driving plane light is used in a liquid crystal display. A plane light device includes a first substrate, a frame, a second substrate, a fluorescent layer, a plurality of spacers, and an outer electrode layer. A plane chamber is formed between the first substrate and the second substrate to filling mixed gases therein. The outer electrode layer includes a plurality of independent electrode pairs. The mixed gas is discharged by the fluorescent layer to produce a plurality of corresponding light emitting regions after driving respectively the plurality of electrode pairs. The plurality of light emitting regions have interval lines parallel or perpendicular to scanning lines of the liquid crystal display. The plurality of light emitting regions are opened synchronously, in series or alternately. The image blurry phenomenon displayed in the LCDs will be effectively improved caused by slow response of LCD's cells.

Abstract: A surge protection and reset circuit is provided for resetting a microprocessor to maintain a discharge lamp under a normal operating condition when the microprocessor is crashed owing to the cross talk or radiation effect in igniting a discharge lamp. The surge protection and reset circuit includes a ballast electrically connected to the discharge lamp for igniting the discharge lamp, a starting control circuit electrically connected to the ballast for triggering the ballast to ignite the discharge lamp and powering the ballast, a microprocessor electrically connected to the starting control circuit for initializing the starting control circuit when the microprocessor receives a lamp-state signal and a reset signal, and a reset circuit having an output terminal electrically connected to the microprocessor for providing the reset signal to reset the microprocessor when the reset circuit receives the lamp-state signal from a lamp-state terminal of the ballast.

Abstract: A surge protection and reset circuit is provided for resetting a microprocessor to maintain a discharge lamp under a normal operating condition when the microprocessor is crashed owing to the cross talk or radiation effect in igniting a discharge lamp. The surge protection and reset circuit includes a ballast electrically connected to the discharge lamp for igniting the discharge lamp, a starting control circuit electrically connected to the ballast for triggering the ballast to ignite the discharge lamp and powering the ballast, a microprocessor electrically connected to the starting control circuit for initializing the starting control circuit when the microprocessor receives a lamp-state signal and a reset signal, and a reset circuit having an output terminal electrically connected to the microprocessor for providing the reset signal to reset the microprocessor when the reset circuit receives the lamp-state signal from a lamp-state terminal of the ballast.