Patents by Inventor Yung-Hsiang Wu

Yung-Hsiang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230201598
    Abstract: A movement monitor sensor includes a body, a conduction area, at least one depth electrode set and a flat electrode set. The body has an axis and two axial ends. The conduction area at one axial end connects a conductive wire. The depth electrode set includes four separate depth electrodes disposed on the body by surrounding the axis and connected individually with first wires. The flat electrode set includes a substrate disposed at another axial end and four separate flat electrodes disposed at the substrate by surrounding the axis and connected individually with second wires. The conductive wire, the first and second wires are individually connected with the conduction area, the depth electrodes and the flat electrodes. When a human movement changes, a processor evaluates impedance variations generated by the depth electrode set, the flat electrode set and/or the conduction area to determine electrical stimulation control upon human brain.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 29, 2023
    Inventors: JO-PING LEE, SHENG-HONG TSENG, CHUNG-HSIN SU, YUNG-HSIANG WU
  • Publication number: 20080223820
    Abstract: A method for forming miniature wires by printing or dispensing a solution on a substrate, the solution comprising a solute being capable of being etched and forming an inner and outer region on the substrate, each region having a thickness. After an etching process is applied on the substrate, the region inner region is removed so the outer region remains as desired wires. A line width of thus formed wires is narrowed to reach micron-scale wires.
    Type: Application
    Filed: February 20, 2008
    Publication date: September 18, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yung-Hsiang WU, Je-Ping HU, Ming-Huan YANG, Chun-Jung CHEN, Chien-Hung LIU
  • Publication number: 20050136337
    Abstract: A method for forming wires of nano-meter grade, wherein by printing or dispensing a solution on a substrate, the solute contained in the solution will form two regions with different thicknesses on the substrate when the solvent has dried. After an etching process is comprehensively applied on the substrate, the region with thinner solute will be completely removed, and only the region with the thicker solute remains as the desired wires. With such a process, the line width of the created wires is narrowed to reach the nano-grade.
    Type: Application
    Filed: April 26, 2004
    Publication date: June 23, 2005
    Applicant: Industrial Technology Research Institute
    Inventors: Yung-Hsiang Wu, Je-Ping Hu, Ming-Huan Yang, Chun-Jung Chen, Chien-Hung Liu
  • Patent number: D506167
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: June 14, 2005
    Inventor: Yung-Hsiang Wu
  • Patent number: D506420
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: June 21, 2005
    Inventor: Yung-Hsiang Wu