Abstract: An electronic device is provided. The electronic device includes a redistribution structure, an electronic unit and a first conductive pad. The first conductive pad is disposed between the redistribution structure and the electronic unit. The electronic unit is electrically connected to the redistribution structure through the first conductive pad. The first conductive pad has a first coefficient of thermal expansion and a first Young's modulus. The first coefficient of thermal expansion and the first Young's modulus conform to the following formula: 0.7×(0.0069E2?1.1498E+59.661)?CTE?1.3×(0.0069E2?1.1498E+59.661), wherein CTE is the first coefficient of thermal expansion, and E is the first Young's modulus in the formula.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: Provided are sustained-release pharmaceutical compositions including a ketamine pamoate salt and a pharmaceutically acceptable carrier thereof. The compositions include aqueous suspension, solution and matrix delivery system, which can provide sustained release for anesthesia, analgesia or treatment of central nervous system and anti-inflammatory diseases.

Abstract: The present invention is a modular structure for connecting interface on front panel of pc case, which combines the case and base such that not only the connecting interfaces for input/output originally installed at back side of PC are aligned at the front panel, but all connecting interfaces which accept insertion are integrated in a modular structure as well. Consequently, PC can be connected or expanded conveniently and, with the help of one or specialized flat cables, the assembly process of connecting interface is easy.

Abstract: The present invention is a modular structure for connecting interface on front panel of pc case, which combines the case and base such that not only the connecting interfaces for input/output originally installed at back side of PC are aligned at the front panel, but all connecting interfaces which accept insertion are integrated in a modular structure as well. Consequently, PC can be connected or expanded conveniently and, with the help of one or specialized flat cables, the assembly process of connecting interface is easy.