Patents by Inventor Yung-Hui Huang
Yung-Hui Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250067327Abstract: A composite reduction driving mechanism is configured to be applied to an electrical power system of an electric vehicle and to connect between an electric motor of the electrical power system and a wheel shaft. The composite reduction driving mechanism comprises a reduction gear set and a transmission band set. The reduction gear set connects a driving shaft of the electric motor. The transmission band set connects between a driven shaft of the reduction gear set and a wheel shaft. Power outputted by the electric motor is transmitted to the wheel shaft through the composite reduction driving mechanism and through two times of speed reduction during transmission, thus providing a high-torque power performance to the wheel shaft.Type: ApplicationFiled: August 25, 2023Publication date: February 27, 2025Inventors: HUI-HUI HUANG, CHING-HSIUNG TUNG, YUNG-CHIH HUANG
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Patent number: 12234898Abstract: A composite reduction driving mechanism is configured to be applied to an electrical power system of an electric vehicle and to connect between an electric motor of the electrical power system and a wheel shaft. The composite reduction driving mechanism comprises a reduction gear set and a transmission band set. The reduction gear set connects a driving shaft of the electric motor. The transmission band set connects between a driven shaft of the reduction gear set and a wheel shaft. Power outputted by the electric motor is transmitted to the wheel shaft through the composite reduction driving mechanism and through two times of speed reduction during transmission, thus providing a high-torque power performance to the wheel shaft.Type: GrantFiled: August 25, 2023Date of Patent: February 25, 2025Assignee: AEON MOTOR CO., LTD.Inventors: Hui-Hui Huang, Ching-Hsiung Tung, Yung-Chih Huang
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Patent number: 12237165Abstract: The present disclosure for wafer bonding, including forming an epitaxial layer on a top surface of a first wafer, forming a sacrificial layer over the epitaxial layer, trimming an edge of the first wafer, removing the sacrificial layer, forming an oxide layer over the top surface of the first wafer subsequent to removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer.Type: GrantFiled: July 30, 2021Date of Patent: February 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Lung Lin, Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou
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Publication number: 20250053161Abstract: A manufacturing control method is applied to a computer system comprising a processor, a storage device, and a display device. The manufacturing control method includes: dividing a plurality of outlier-filtered data into a plurality of data subgroups based on a group division reference value; calculating a plurality of standard deviations for each of these data subgroups; calculating a warning line upper limit and a warning line lower limit based on the group division reference value, a predetermined multiple, and the standard deviations; adjusting either the warning line upper limit or the warning line lower limit based on the predetermined multiple and the standard deviations; and when a sensing data exceeds the warning line upper limit or the warning line lower limit, the computing system triggers a warning signal.Type: ApplicationFiled: August 24, 2023Publication date: February 13, 2025Inventors: Yung-Yu YANG, Chih-Kuan CHANG, Chung-Chih HUNG, Yu-Hsien TSAI, Chen-Hui HUANG
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Publication number: 20250037324Abstract: A machine learning method includes: processing a first global image and a first local image by a first augmentation pipeline to generate a first augmentation global image and a first augmentation local image; processing the first global image by a second augmentation pipeline to generate a second augmentation global image; processing the first augmentation global image to generate a first global representation vector; processing the second augmentation global image and the first augmentation local image to generate a second global representation vector and a first local representation vector; comparing the first and second global representation vectors to generate a global loss function; comparing the first global representation vector and the first local representation vector to generate a mixed loss function; and adjusting the second encoder according to the global loss function and the mixed loss function.Type: ApplicationFiled: July 30, 2024Publication date: January 30, 2025Inventors: Yung-Hui LI, Van Nhiem TRAN, Chi-En HUANG, Shen-Hsuan LIU, Muhammad Saqlain ASLAM, Kai-Lin YANG
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Patent number: 12205634Abstract: The present disclosure provides an electronic circuit, a memory device, and a method for operating an electronic circuit. An electronic circuit comprises a driver circuit configured to provide a drive voltage to a word line of the electronic circuit, a suppression circuit electrically connected to the driver circuit and the word line, and a control circuit electrically connected to the suppression circuit. The suppression circuit is configured to generate a voltage drop in the drive voltage. The control circuit controls the suppression circuit.Type: GrantFiled: February 15, 2022Date of Patent: January 21, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Cheng Wu, Pei-Yuan Li, Kao-Cheng Lin, Chien Hui Huang, Yung-Ning Tu
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Publication number: 20250024671Abstract: A memory device is provided which includes a first memory cell including a first transistor and a second transistor coupled to the first transistor in parallel. Gates of the first transistor and the second transistor are coupled to each other, and the gates of the first transistor and the second transistor pass different layers and overlap with each other. Types of the first transistor and the second transistor are the same.Type: ApplicationFiled: July 11, 2023Publication date: January 16, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien Hui Huang, Kao-Cheng LIN, Wei Min CHAN, Shang Lin WU, Chia-Chi HUNG, Wei-Cheng WU, Chia-Che CHUNG, Pei-Yuan LI, Chien-Chen LIN, Yung-Ning TU, Yen Lin CHUNG
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Publication number: 20240382799Abstract: The invention relates to a method, an exercise device and a software for measuring maximum muscle strength value. Wherein, the method for measuring the maximum muscle strength value through an exercise device with dynamically variable resistance signal-connected to an arithmetic control unit, is obtained by performing the following steps. The steps include: an obtaining original muscle strength value step, an initial muscle strength value generation step and a maximum muscle strength value generation step. The characteristic of the present invention is that the maximum muscle strength value is obtained according to the position of the exercise process, which overcomes the shortcoming of traditional technology that can only obtain a single data. Moreover, the present invention further forms a maximum muscle strength curve, whereby the obtained data can be used in fitness training to effectively improve training effects and avoid muscle injuries caused by overloading.Type: ApplicationFiled: May 13, 2024Publication date: November 21, 2024Inventors: YUNG HUI HUANG, TingChun Su
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Publication number: 20240342559Abstract: The present invention provides a method for velocity based eccentric weight training (VBET), which mainly aims at overcoming the conventional weight based eccentric weight training method, and for the problems generated during the eccentric weight training process. The invention is an eccentric weight training based on velocity. By monitoring the velocity, the load is dynamically adjusted to replace the traditional eccentric training based on a certain weight, so that the velocity of the eccentric weight training can be stably maintained. There is no risk of crushing injuries due to weakness or mistake in letting go, which can effectively reduce the risk of user's injury, enhance user's confidence during operation, and provide a highly safe resistance control method, resistance system and software.Type: ApplicationFiled: March 28, 2024Publication date: October 17, 2024Inventors: YUNG HUI HUANG, TingChun Su
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Patent number: 7731110Abstract: A method of making abrasive compositions, and more particularly, it relates to a method of making precipitated silica abrasive compositions having excellent cleaning performance and lower abrasiveness with post-reactor sizing of the abrasive particles being performed directly via wet comminution and centrifugation, optionally followed by hydraulic chamber press filtering combined with vacuum dewatering and de-agglomeration is provided. By targeting a specific particle size range, it has been determined that higher pellicle film cleaning levels may be achieved without also increasing the dentin abrasion properties of the silica products themselves. As a result, dentifrices including such classified abrasive silica products, exhibiting particularly desirable cleaning benefits, can be provided for improved tooth polishing, whitening, and the like, without deleteriously affecting the hard tooth surfaces.Type: GrantFiled: June 29, 2005Date of Patent: June 8, 2010Assignee: J.M. Huber CorporationInventor: Yung-Hui Huang
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Patent number: 7297318Abstract: Methods for the removal of lead from a metal silicate during the process of manufacturing of such a material are provided. With the reliance upon lower cost starting silicon dioxide starting materials that are known to exhibit elevated amounts of heavy metal therein for the purpose of producing metal silicates (such as sodium silicate, as one example), it has been realized that removal of significant amounts of such heavy metals is necessary to comply with certain regulatory requirements in order to provide a finished material that exhibits the same low level of heavy metal contamination as compared with finished materials that are made from more expensive, purer starting silicon dioxides. Two general methods may be followed for such decontamination purposes. One entails the introduction of a calcium phosphate material, such as dicalcium phosphate, tricalcium phosphate, and/or hydroxyapatite, to a formed metal silicate solution but prior to filtering.Type: GrantFiled: November 17, 2005Date of Patent: November 20, 2007Assignee: J.M. Huber CorporationInventors: Yung-Hui Huang, John V. Offidani
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Publication number: 20070107634Abstract: Methods for the removal of lead from a metal silicate during the process of manufacturing of such a material are provided. With the reliance upon lower cost starting silicon dioxide starting materials that are known to exhibit elevated amounts of heavy metal therein for the purpose of producing metal silicates (such as sodium silicate, as one example), it has been realized that removal of significant amounts of such heavy metals is necessary to comply with certain regulatory requirements in order to provide a finished material that exhibits the same low level of heavy metal contamination as compared with finished materials that are made from more expensive, purer starting silicon dioxides. Two general methods may be followed for such decontamination purposes. One entails the introduction of a calcium phosphate material, such as dicalcium phosphate, tricalcium phosphate, and/or hydroxyapatite, to a formed metal silicate solution but prior to filtering.Type: ApplicationFiled: November 17, 2005Publication date: May 17, 2007Inventors: Yung-Hui Huang, John Offidani
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Patent number: 7201885Abstract: Methods for the removal of lead from a metal silicate during the process of manufacturing of such a material are provided. With the reliance upon lower cost starting silicon dioxide starting materials that are known to exhibit elevated amounts of heavy metal therein for the purpose of producing metal silicates (such as sodium silicate, as one example), it has been realized that removal of significant amounts of such heavy metals is necessary to comply with certain regulatory requirements in order to provide a finished material that exhibits the same low level of heavy metal contamination as compared with finished materials that are made from more expensive, purer starting silicon dioxides. Two general methods may be followed for such decontamination purposes. One entails the introduction of a calcium phosphate material, such as dicalcium phosphate, tricalcium phosphate, and/or hydroxyapatite, to a formed metal silicate solution but prior to filtering.Type: GrantFiled: November 17, 2005Date of Patent: April 10, 2007Assignee: J.M. Huber CorporationInventors: Yung-Hui Huang, John V. Offidani
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Patent number: 7159803Abstract: A method of making abrasive compositions, and more particularly, it relates to a method of making precipitated silica abrasive compositions having excellent cleaning performance and lower abrasiveness with post-reactor sizing of the abrasive particles being performed directly via wet comminution and centrifugation, optionally followed by hydraulic chamber press filtering combined with vacuum dewatering and de-agglomeration is provided. By targeting a specific particle size range, it has been determined that higher pellicle film cleaning levels may be achieved without also increasing the dentin abrasion properties of the silica products themselves. As a result, dentifrices including such classified abrasive silica products, exhibiting particularly desirable cleaning benefits, can be provided for improved tooth polishing, whitening, and the like, without deleteriously affecting the hard tooth surfaces.Type: GrantFiled: June 29, 2005Date of Patent: January 9, 2007Assignee: J.M. Huber CorporationInventor: Yung-Hui Huang
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Publication number: 20070003465Abstract: A method of making abrasive compositions, and more particularly, it relates to a method of making precipitated silica abrasive compositions having excellent cleaning performance and lower abrasiveness with post-reactor sizing of the abrasive particles being performed directly via wet comminution and centrifugation, optionally followed by hydraulic chamber press filtering combined with vacuum dewatering and de-agglomeration is provided. By targeting a specific particle size range, it has been determined that higher pellicle film cleaning levels may be achieved without also increasing the dentin abrasion properties of the silica products themselves. As a result, dentifrices including such classified abrasive silica products, exhibiting particularly desirable cleaning benefits, can be provided for improved tooth polishing, whitening, and the like, without deleteriously affecting the hard tooth surfaces.Type: ApplicationFiled: June 29, 2005Publication date: January 4, 2007Inventor: Yung-Hui Huang
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Publication number: 20070001037Abstract: A method of making abrasive compositions, and more particularly, it relates to a method of making precipitated silica abrasive compositions having excellent cleaning performance and lower abrasiveness with post-reactor sizing of the abrasive particles being performed directly via wet comminution and centrifugation, optionally followed by hydraulic chamber press filtering combined with vacuum dewatering and de-agglomeration is provided. By targeting a specific particle size range, it has been determined that higher pellicle film cleaning levels may be achieved without also increasing the dentin abrasion properties of the silica products themselves. As a result, dentifrices including such classified abrasive silica products, exhibiting particularly desirable cleaning benefits, can be provided for improved tooth polishing, whitening, and the like, without deleteriously affecting the hard tooth surfaces.Type: ApplicationFiled: June 29, 2005Publication date: January 4, 2007Inventor: Yung-Hui Huang
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Patent number: 7125432Abstract: New methods of producing narrower particle size distribution precipitated silica and/or silicate materials are provided. Such a method permits a significant reduction in manufacturing costs through the utilization of more efficient drying/evaporation components, in essence, in one potentially preferred embodiment, production of such silica and/or silicate materials followed directly by a hydraulic chamber press filtering step combined with vacuum dewatering subsequently leading to the needed resultant particle comminution. The resultant precipitated silicas and/or silicates produced thereby exhibit greater density prior to comminution and thus greater propensity for more uniform milling than previously utilized and prevalent spray/flash drying apparatuses.Type: GrantFiled: July 23, 2004Date of Patent: October 24, 2006Assignee: J.M. Huber CorporationInventor: Yung-Hui Huang
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Publication number: 20060027142Abstract: New methods of producing narrower particle size distribution precipitated silica and/or silicate materials are provided. Such a method permits a significant reduction in manufacturing costs through the utilization of more efficient drying/evaporation components, in essence, in one potentially preferred embodiment, production of such silica and/or silicate materials followed directly by a hydraulic chamber press filtering step combined with vacuum dewatering subsequently leading to the needed resultant particle comminution. The resultant precipitated silicas and/or silicates produced thereby exhibit greater density prior to comminution and thus greater propensity for more uniform milling than previously utilized and prevalent spray/flash drying apparatuses.Type: ApplicationFiled: July 23, 2004Publication date: February 9, 2006Inventor: Yung-Hui Huang
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Patent number: 6946010Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, the abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is Theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.Type: GrantFiled: September 30, 2004Date of Patent: September 20, 2005Assignee: J.M. Huber CorporationInventor: Yung-Hui Huang
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Publication number: 20050076582Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, the abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is Theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.Type: ApplicationFiled: September 30, 2004Publication date: April 14, 2005Inventor: Yung-Hui Huang