Patents by Inventor Yung-Hui Wang
Yung-Hui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240030155Abstract: The present invention provides a wafer level chip scale package (WLCSP) unit; the WLCSP unit includes a die, a dielectric layer, and a bottom metal layer; the die has a substrate and an active surface; multiple pads are mounted on the active surface, and a soldering layer is mounted on a surface of each of the pads; the dielectric layer covers an upper part of four lateral surfaces of the die, exposing a lower part of the four lateral surfaces of the die; the bottom metal layer is mounted on a bottom surface of the substrate; the bottom metal layer protects a bottom surface of the dies, dissipates heat generated by the dies, and also protects the dies from external electromagnetic interferences (EMI).Type: ApplicationFiled: August 10, 2022Publication date: January 25, 2024Applicant: PANJIT INTERNATIONAL INC.Inventors: Chung-Hsiung HO, Chi-Hsueh LI, Yu-Ming HSU, Yung-Hui WANG, Chia-Wei CHEN
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Publication number: 20230326833Abstract: A method for manufacturing a packaged component with a composite pin structure has: dividing a substrate into a body area and a pin area, wherein a chip is arranged on the body area of the substrate and is electrically connected to conductive layers on the opposite surfaces of the substrate. The pin area is pre-defined with multiple parallel pin positions. After the electrical connection of the chip is completed in the body area, a cutting tool is used to cut along the peripheries of the body area and the pin positions to obtain a packaged component body and multiple pins. Each of the pins is integrally formed by the substrate of the packaged component body without using a conventional lead frame.Type: ApplicationFiled: May 11, 2022Publication date: October 12, 2023Applicant: PANJIT INTERNATIONAL INC.Inventors: Yung-Hui WANG, CHUNG-HSIUNG HO, CHI-HSUEH LI
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Patent number: 11774673Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.Type: GrantFiled: April 12, 2022Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Hsuan Wu, Yung-Hui Wang
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Publication number: 20220236480Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Hsuan WU, Yung-Hui WANG
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Patent number: 11300727Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.Type: GrantFiled: July 31, 2019Date of Patent: April 12, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Hsuan Wu, Yung-Hui Wang
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Publication number: 20210033785Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.Type: ApplicationFiled: July 31, 2019Publication date: February 4, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Hsuan WU, Yung-Hui WANG
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Publication number: 20180122749Abstract: A semiconductor wafer includes a substrate structure, a first insulation layer, a conductive layer and a second insulation layer. The substrate structure defines a via. The first insulation layer covers a surface of the substrate structure. The first insulation layer extends into the via, covers a lateral wall of the via and exposes a bottom surface at a bottom of the via. The conductive layer covers the first insulation layer and the bottom surface exposed by the first insulation layer. The second insulation layer covers the conductive layer. A warpage of the semiconductor wafer is less than 550 micrometers.Type: ApplicationFiled: November 1, 2016Publication date: May 3, 2018Inventors: Ying-Chih LEE, Chin-Cheng KUO, Yung-Hui WANG, Wei-Hong LAI, Chung-Ting WANG, Hsiao-Yen LEE
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Patent number: 9768103Abstract: An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.Type: GrantFiled: January 7, 2016Date of Patent: September 19, 2017Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Hui Wang, Ying-Te Ou
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Publication number: 20160118325Abstract: An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yung-Hui WANG, Ying-Te OU
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Patent number: 9253887Abstract: An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.Type: GrantFiled: August 1, 2012Date of Patent: February 2, 2016Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Hui Wang, Ying-Te Ou
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Patent number: 8987734Abstract: The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of dielectric layers. The semiconductor wafer is defined as a plurality of die areas and a plurality of trench areas, each of the die areas has an integrated circuit including a plurality of patterned metal layers disposed between the dielectric layers. The trench areas are disposed between the die areas, and the at least one metal segment is disposed in the trench area and insulated from the integrated circuit of the die area.Type: GrantFiled: March 15, 2013Date of Patent: March 24, 2015Assignee: Advanced Semiconductor Engineering, Inc.Inventor: Yung-Hui Wang
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Publication number: 20140264716Abstract: The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of dielectric layers. The semiconductor wafer is defined as a plurality of die areas and a plurality of trench areas, each of the die areas has an integrated circuit including a plurality of patterned metal layers disposed between the dielectric layers. The trench areas are disposed between the die areas, and the at least one metal segment is disposed in the trench area and insulated from the integrated circuit of the die area.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Yung-Hui Wang
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Patent number: 8528128Abstract: A closure device for a drain pipeline includes an outer sleeve, an inner sleeve mounted in the outer sleeve, and a closure member. The outer sleeve is adapted to be installed between a drain of a sink or washbasin and a drainpipe. A flow port is defined in the inner sleeve. The closure member is movably supported in the inner sleeve in a vertical direction. The closure member is normally biased by a spring to close the flow port so as to block odor from flowing into an indoor space, and the closure member is moved downwards to open the flow port when draining water into the outer sleeve.Type: GrantFiled: November 15, 2010Date of Patent: September 10, 2013Inventor: Yung-Hui Wang
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Publication number: 20120295403Abstract: An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.Type: ApplicationFiled: August 1, 2012Publication date: November 22, 2012Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yung-Hui Wang, Ying-Te Ou
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Publication number: 20120117721Abstract: A closure device for a drain pipeline includes an outer sleeve, an inner sleeve mounted in the outer sleeve, and a closure member. The outer sleeve is adapted to be installed between a drain of a sink or washbasin and a drainpipe. A flow port is defined in the inner sleeve. The closure member is movably supported in the inner sleeve in a vertical direction. The closure member is normally biased by a spring to close the flow port so as to block odor from flowing into an indoor space, and the closure member is moved downwards to open the flow port when draining water into the outer sleeve.Type: ApplicationFiled: November 15, 2010Publication date: May 17, 2012Inventor: Yung-Hui Wang
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Patent number: 8099865Abstract: A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.Type: GrantFiled: June 20, 2008Date of Patent: January 24, 2012Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Yung Hui Wang, Ying Te Ou
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Patent number: 8000107Abstract: A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate.Type: GrantFiled: March 28, 2008Date of Patent: August 16, 2011Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Yung-Hui Wang, In-De Ou, Chih-Pin Hung
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Publication number: 20110036701Abstract: A closed-air cushioned key switch structure includes an electrical board having multiple contacts, and multiple key switch bodies arranged above the contacts of the electrical board, each key switch body having top press portion for clicking by a user, a conductor at the bottom side for contacting one respective contact of the electrical board to produce a switching signal and an enclosed air chamber defined in between the press portion and the conductor for buffering clicking to give comfort to the user's finger to avoid noises. The key switch bodies are formed in integrity without any gap in therebetween, avoiding penetration of fluid or water through the key switch bodies to contaminate or wet the electrical board.Type: ApplicationFiled: July 28, 2010Publication date: February 17, 2011Inventor: Yung-Hui WANG
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Publication number: 20100018761Abstract: An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.Type: ApplicationFiled: July 10, 2009Publication date: January 28, 2010Applicant: Advanced Semiconductor Engineering, Inc.Inventors: YUNG-HUI WANG, Ying-Te Ou
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Publication number: 20100006330Abstract: A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a number of through holes are provided. The opening and the through holes connect the first surface and the second surface. A chip is then disposed in the opening. Next, a dielectric layer is formed in the opening and the through holes to fix the chip in the opening. Thereafter, a number of conductive vias are respectively formed in the through holes and insulated from the metal core layer by a portion of the dielectric layer located in the through holes. A circuit structure is then formed on the first surface of the metal core layer by performing a build-up process, and the circuit structure electrically connects the chip and the conductive vias.Type: ApplicationFiled: June 26, 2009Publication date: January 14, 2010Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chieh-Chen Fu, Ying-Te Ou, Yung-Hui Wang