Abstract: An I/O interface configuration device for configuring I/O interfaces comprises an input interface, an output interface, a storage unit, a detecting pin, a converting unit and a computing unit. The input interface electrically connects to a controlling port of a controlling circuit to receive a data type. The output interface electrically connects to a controlled port of a controlled device to output another data type. The storage unit stores a plurality of configuration files, one of the configuration files corresponds to a circuit type of the controlling circuit. The detecting pin is adapted to retrieve the circuit type. The converting unit converts the data type to said another data type and selectively outputs said another data type from the output interface. The computing unit loads the configuration file corresponding to the circuit type and control the converting unit to configure the I/O interface according to the configuration file.

Abstract: A circuit board for transmitting a high speed signal and for the high speed signal to be detected comprises a substrate, an insulating layer and two metal printed wires. The insulating layer is disposed on the substrate, and comprises a first surface, a second surface and a test opening, with the first surface facing away from the substrate, the second surface facing the substrate, and the test opening passing through the first surface and formed above the second surface. Said two metal printed wires are configured to transmit the high speed signal and embedded in the insulating layer between the first surface and the second surface. At least one of the metal printed wires comprises a test section which is aligned to the test opening of the insulating layer and exposed by the test opening.

Abstract: A circuit board for transmitting a high speed signal and for the high speed signal to be detected comprises a substrate, an insulating layer and two metal printed wires. The insulating layer is disposed on the substrate, and comprises a first surface, a second surface and a test opening, with the first surface facing away from the substrate, the second surface facing the substrate, and the test opening passing through the first surface and formed above the second surface. Said two metal printed wires are configured to transmit the high speed signal and embedded in the insulating layer between the first surface and the second surface. At least one of the metal printed wires comprises a test section which is aligned to the test opening of the insulating layer and exposed by the test opening.

Abstract: An I/O interface configuration device for configuring I/O interfaces comprises an input interface, an output interface, a storage unit, a detecting pin, a converting unit and a computing unit. The input interface electrically connects to a controlling port of a controlling circuit to receive a data type. The output interface electrically connects to a controlled port of a controlled device to output another data type. The storage unit stores a plurality of configuration files, one of the configuration files corresponds to a circuit type of the controlling circuit. The detecting pin is adapted to retrieve the circuit type. The converting unit converts the data type to said another data type and selectively outputs said another data type from the output interface. The computing unit loads the configuration file corresponding to the circuit type and control the converting unit to configure the I/O interface according to the configuration file.

Abstract: A hot swap control circuit is utilized for detecting operating status of an NVMe storage module to generate a detection report to a storage server, wherein the detection report indicates at least one of a hot remove event and a hot add event. The hot remove event happens when at least one NVMe storage device of the NVMe storage module is removed, and the hot swap control circuit reports the hot remove event to the storage server by the detection report. Moreover, the hot add event happens when a new NVMe storage device is added to the NVMe storage module, and the hot swap control circuit reports the hot add event to the storage server by the detection report.

Abstract: A hot swap control circuit is utilized for detecting operating status of an NVMe storage module to generate a detection report to a storage server, wherein the detection report indicates at least one of a hot remove event and a hot add event. The hot remove event happens when at least one NVMe storage device of the NVMe storage module is removed, and the hot swap control circuit reports the hot remove event to the storage server by the detection report. Moreover, the hot add event happens when a new NVMe storage device is added to the NVMe storage module, and the hot swap control circuit reports the hot add event to the storage server by the detection report.

Abstract: A signal-switching circuit for use in an electronic system is provided. The electronic system includes a plurality of hardware circuits. The signal-switching circuit includes a control circuit and a switch circuit. The control circuit is arranged to receive a trigger signal generated by a trigger circuit of the electronic system, and change a mode signal generated by the control circuit according to the trigger signal. The switch circuit is arranged to electrically connect transmission signals from one of the hardware circuits to a transmission interface of the electronic system according to the mode signal.

Abstract: A rack mountable server apparatus is disposed on a plane of a rack. The rack mountable server apparatus includes a chassis and a plurality of server units. The chassis is disposed in the rack, and the appearance of the chassis is a rectangular cuboid. When the chassis is installed in the rack, a first surface constructed by a length and a width of the chassis is parallel to the plane. The server units are disposed in the chassis. Each of server units has a circuit board, and the circuit boards are arranged parallel to a second surface which is constructed by the length and the height of the chassis or the width and the height of the chassis, and are perpendicular to the first surface.

Abstract: A rack mountable server apparatus is disposed on a plane of a rack. The rack mountable server apparatus includes a chassis and a plurality of server units. The chassis is disposed in the rack, and the appearance of the chassis is a rectangular cuboid. When the chassis is installed in the rack, a first surface constructed by a length and a width of the chassis is parallel to the plane. The server units are disposed in the chassis. Each of server units has a circuit board, and the circuit boards are arranged parallel to a second surface which is constructed by the length and the height of the chassis or the width and the height of the chassis, and are perpendicular to the first surface.