Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: An electronic device module, an electronic device thereof, a protection element thereof and a method of raising working frequency thereof are provided. The electronic device module comprises the electronic device and the protection element. The electronic device comprises a main body, a device detection element and a central processing unit (CPU), wherein the device detection element and the CPU are disposed within the main body. The protection element comprises a protection cover and a protection detection element, wherein the protection detection element is disposed on the protection cover. The CPU raises a working frequency thereof according to an approaching movement between the device detection element and the protection detection element.

Abstract: A fan device and an electronic device thereof are disclosed. The fan device is disposed in a casing of the electronic device and adjacent to a board of the casing, wherein the board has a first state and a second state. The fan device includes a plurality of fan blades, a shaft, and a ball. The shaft is connected to the plurality of fan blades and allows the plurality of fan blades rotating with the shaft, wherein at least one end of the shaft has a ball accommodating portion and an opening. The ball is disposed in the ball accommodating portion and limited by the opening for not separate from the ball accommodating portion. When the board is in the first state, a gap is between the ball and the casing. When the board is in the second state, the board and the ball touch each other.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.

Abstract: A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween.

Abstract: A thin heating pipe includes a pipe, a main capillary structure, a first capillary structure, and a second capillary structure. The pipe has a hollow chamber and a connecting chamber. The first capillary structure is disposed in the chamber and between the first and the second capillary structures. The first capillary structure has a first channel, the second capillary structure has a second channel, and the connecting chamber is communicated with the first channel and the second channel.

Abstract: A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located between the first casing and the electronic component, a circuit board putting on the electronic component and fixed on the first casing, and a second casing pressing the circuit board and fixed on the first casing. The circuit board contacts against the electronic component tightly by an assembly of the first casing and the second casing.

Abstract: A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located between the first casing and the electronic component, a circuit board putting on the electronic component and fixed on the first casing, and a second casing pressing the circuit board and fixed on the first casing. The circuit board contacts against the electronic component tightly by an assembly of the first casing and the second casing.

Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.

Abstract: An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device.

Abstract: A heat dissipating unit includes a plurality of heat dissipating fins arranged in an annular array and each including a flow guide plate extending from an inner side to an outer side of the annular array, two connecting plates respectively connected to and forming an angle with two opposite sides of the flow guide plate, and an air inlet and an air channel communicating fluidly with each other. Each connecting plate includes a connecting hole, a slanting edge opposite to the flow guide plate, and a connecting portion projecting from the slanting edge. The connecting portions of the connecting plates of each heat dissipating fin engage respectively the connecting holes in the connecting plates of an adjacent heat dissipating fin. The heat dissipating fins overlap each other so that the air inlets of the heat dissipating fins are arranged in a staggered manner.

Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.

Abstract: A pressure sensing device for an electronic device includes a pressure sensing unit, a control unit, and an alarm unit. The pressure sensing unit is installed in the electronic device, and used for detecting fluid pressure to generate a pressure signal. The control unit is coupled to the pressure sensing unit, and used for determining variation in the fluid pressure in the electronic device according to the pressure signal and generating a control signal. The alarm unit is coupled to the control unit, and used for outputting an alarm signal according to the control signal to execute an alarm function.

Abstract: An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device.

Abstract: The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into the cooling pad. The first and second phase-change materials are separately placed in two chambers. The reaction temperatures of two phase-change materials differ from each other. The phase-change material of higher reaction temperature assists in heat-absorbing and preventing overheating. There is a heat peak when the cooling pad reaches the preset high-temperature state. When the temperature of the cooling pad declines below a preset temperature, the phase-change material of lower reaction temperature will release the stored latent heat, enabling the cooling pad to maintain an operating temperature and improve the heat-radiating efficiency in a variety of equipment.

Abstract: The heat-radiating device with composite heat radiation efficiency includes a foundation with a heating surface and a radiating surface. The foundation has an inner space for inserting phase-changing materials. A heat pipe includes a heat-absorbing end placed into the foundation and a radiating end protruded out of the foundation. A radiating fin set is arranged onto the radiating end of the heat pipe. The heat-radiating device enables the heat absorbed by the foundation to be quickly guided out of the foundation through the heat pipe. The radiation area is increased by the radiating fin set for improved heat radiation efficiency. The phase-changing material assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device has a composite heat radiation effect with improved applicability.

Abstract: The present invention provides a vane structure of an airflow generator. The plate of predefined thickness and width has a locating portion and a swinging end. The swinging end of the vane is wider than the locating portion. There is an oblique section placed between the swinging end and locating portion for linking purposes. A better wind guide effect can be obtained from the expanded swinging end, and the oblique section is employed to reduce inlet stagnation, thus greatly improving the smoothness of air flow and the operating performance of the vane with better applicability.