Patents by Inventor Yung-Li TSAI
Yung-Li TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958090Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: July 28, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11955423Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.Type: GrantFiled: March 26, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
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Patent number: 11766703Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: GrantFiled: August 6, 2019Date of Patent: September 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20230062848Abstract: A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a substrate processing device and a processor. The substrate processing device includes a processing chamber, a gas supply module and a gas source. The processor is configured to monitor and control the gas supplied into the substrate processing device.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: WEI-CHUN HSU, YUNG-LI TSAI, SHENG-WEI WU, CHIH-HAO CHAO, YU-HAO HUANG
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Publication number: 20230017404Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: ApplicationFiled: July 28, 2022Publication date: January 19, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: BO CHEN CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20220262651Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.Type: ApplicationFiled: May 5, 2022Publication date: August 18, 2022Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
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Publication number: 20220208581Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: ApplicationFiled: March 21, 2022Publication date: June 30, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11355366Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.Type: GrantFiled: August 26, 2019Date of Patent: June 7, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
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Patent number: 11282728Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: GrantFiled: June 10, 2019Date of Patent: March 22, 2022Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Patent number: 11139183Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.Type: GrantFiled: May 24, 2018Date of Patent: October 5, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
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Patent number: 10943804Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.Type: GrantFiled: June 27, 2019Date of Patent: March 9, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20200075352Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.Type: ApplicationFiled: August 26, 2019Publication date: March 5, 2020Inventors: Tsui-Wei WANG, Yung-Li TSAI, Chui-Ya Peng
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Publication number: 20200058521Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.Type: ApplicationFiled: August 13, 2019Publication date: February 20, 2020Inventors: Kun-Hsiung SHIH, Bo-Chen CHEN, Yung-Li TSAI, Chui-Ya PENG
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Publication number: 20200055099Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.Type: ApplicationFiled: August 6, 2019Publication date: February 20, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen CHEN, Sheng-Wei WU, Yung-Li TSAI
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Publication number: 20200006101Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.Type: ApplicationFiled: June 27, 2019Publication date: January 2, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20200006104Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.Type: ApplicationFiled: June 10, 2019Publication date: January 2, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
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Publication number: 20190362990Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.Type: ApplicationFiled: May 24, 2018Publication date: November 28, 2019Inventors: Tsui-Wei WANG, Yung-Li Tsai, Chui-Ya Peng
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Patent number: 9583352Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.Type: GrantFiled: August 18, 2015Date of Patent: February 28, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wen-Chang Tsai, Shao-Yen Ku, Hsieh-Ching Wei, Yuan Chih Chiang, Jui-Chuan Chang, Yung-Li Tsai
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Publication number: 20150357198Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.Type: ApplicationFiled: August 18, 2015Publication date: December 10, 2015Inventors: Wen-Chang TSAI, Shao-Yen KU, Hsieh-Ching WEI, Yuan Chih CHIANG, Jui-Chuan CHANG, Yung-Li TSAI
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Patent number: 9136149Abstract: A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described.Type: GrantFiled: November 16, 2012Date of Patent: September 15, 2015Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wen-Chang Tsai, Shao-Yen Ku, Hsieh-Ching Wei, Yuan Chih Chiang, Jui-Chuan Chang, Yung-Li Tsai