Patents by Inventor Yung-Li TSAI

Yung-Li TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220295540
    Abstract: A method for a user equipment (UE) to monitor a physical downlink control channel (PDCCH) is provided. The method receives, while being in a radio resource control (RRC) CONNECTED state, from a base station (BS), an RRC release message that includes a small data transmission (SDT) configuration. After receiving the RRC release message, the method transitions to an RRC_INACTIVE state from the RRC_CONNECTED state in response to receiving the RRC release message. The method then initiates an SDT procedure based on the SDT configuration. The method further determines whether a search space set associated with an SDT search space is received from the BS. The method monitors the PDCCHby monitoring the search space set during the SDT procedure when the search space set is received from the BS.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Inventors: HSIN-HSI TSAI, HENG-LI CHIN, WAN-CHEN LIN, YUNG-LAN TSENG
  • Publication number: 20220262651
    Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.
    Type: Application
    Filed: May 5, 2022
    Publication date: August 18, 2022
    Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
  • Patent number: 11408154
    Abstract: A rough-in assembly for mounting a free-standing faucet on a floor is revealed. The rough-in assembly includes a mounting base, a connection tube set having cold-water and hot-water connection tubes, a fixing plate, and a plurality of nuts. The mounting base consists of a bottom plate fixed on a laminated wood, a tube-fixing portion positioned on the bottom plate and provided with two locking slots, and a plurality of bolts projecting from the bottom plate and inserted through a mounting hole on the floor. The cold-water and hot-water connection tubes are locked in the two locking slots of the tube-fixing portion. The fixing plate allows the bolts of the mounting base to pass therethrough. The nuts are threaded on the bolts for fastening the fixing plate on the floor. Thereby the free-standing faucet is secured on the floor firmly and production cost is dramatically reduced.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: August 9, 2022
    Assignee: Globe Union Industrial Corp.
    Inventors: Chunhung Li, Yung-Cheng Yu, Jiun-Li Tsai, Chu-Cheng Chu
  • Publication number: 20220223548
    Abstract: Methods for forming under-bump metallurgy (UBM) structures having different surface profiles and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a first under-bump metallurgy (UBM) structure over and electrically coupled to the first redistribution line, the first UBM structure extending through the first passivation layer, a top surface of the first UBM structure being concave; and a second UBM structure over and electrically coupled to the second redistribution line, the second UBM structure extending through the first passivation layer, a top surface of the second UBM structure being flat or convex.
    Type: Application
    Filed: June 9, 2021
    Publication date: July 14, 2022
    Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
  • Publication number: 20220208581
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Application
    Filed: March 21, 2022
    Publication date: June 30, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20220209915
    Abstract: A method for small data transmission (SDT) and a user equipment (UE) are provided. In the method, a SDT procedure is initiated. A synchronization signal/physical broadcast channel block (SSB) is selected during the SDT procedure. Transmission is performed based on a selected SSB during the SDT procedure. A timer is started or restarted in response to performing the transmission. A physical downlink control channel (PDCCH) is monitored, while the timer is running, by assuming the PDCCH has the same demodulation reference signal (DM-RS) antenna port quasi co-location properties as for the selected SSB associated with transmission.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 30, 2022
    Applicant: FG Innovation Company Limited
    Inventors: Hsin-Hsi Tsai, Heng-Li Chin, Mei-Ju Shih, Yung-Lan Tseng
  • Patent number: 11355366
    Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: June 7, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
  • Patent number: 11282728
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 22, 2022
    Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Patent number: 11139183
    Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsui-Wei Wang, Yung-Li Tsai, Chui-Ya Peng
  • Patent number: 10943804
    Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20200075352
    Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 5, 2020
    Inventors: Tsui-Wei WANG, Yung-Li TSAI, Chui-Ya Peng
  • Publication number: 20200058521
    Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Inventors: Kun-Hsiung SHIH, Bo-Chen CHEN, Yung-Li TSAI, Chui-Ya PENG
  • Publication number: 20200055099
    Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei WU, Yung-Li TSAI
  • Publication number: 20200006104
    Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.
    Type: Application
    Filed: June 10, 2019
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen Chen, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20200006101
    Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo Chen CHEN, Sheng-Wei Wu, Yung-Li Tsai
  • Publication number: 20190362990
    Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 28, 2019
    Inventors: Tsui-Wei WANG, Yung-Li Tsai, Chui-Ya Peng
  • Patent number: 9583352
    Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: February 28, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Chang Tsai, Shao-Yen Ku, Hsieh-Ching Wei, Yuan Chih Chiang, Jui-Chuan Chang, Yung-Li Tsai
  • Publication number: 20150357198
    Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.
    Type: Application
    Filed: August 18, 2015
    Publication date: December 10, 2015
    Inventors: Wen-Chang TSAI, Shao-Yen KU, Hsieh-Ching WEI, Yuan Chih CHIANG, Jui-Chuan CHANG, Yung-Li TSAI
  • Patent number: 9136149
    Abstract: A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: September 15, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Chang Tsai, Shao-Yen Ku, Hsieh-Ching Wei, Yuan Chih Chiang, Jui-Chuan Chang, Yung-Li Tsai
  • Publication number: 20140141541
    Abstract: A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Chang TSAI, Shao-Yen KU, Hsieh-Ching WEI, Yuan Chih CHIANG, Jui-Chuan CHANG, Yung-Li TSAI