Patents by Inventor Yung-Lin Liu

Yung-Lin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153895
    Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.
    Type: Application
    Filed: April 19, 2023
    Publication date: May 9, 2024
    Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240095930
    Abstract: A machine learning method includes: distinguishing foregrounds and backgrounds of a first image to generate a first mask image; cropping the first image to generate second and third images; cropping the first mask image to generate second and third mask images, wherein a position of the second mask image and a position of the third mask image correspond to a position of the second image and a position of the third image, respectively; generating a first feature vector group of the second image and a second feature vector group of the third image by a model; generating a first matrix according to the first and second feature vector groups; generating a second matrix according to the second and third mask images; generating a function according to the first and second matrices; and adjusting the model according to the function.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 21, 2024
    Inventors: Shen-Hsuan LIU, Van Nhiem TRAN, Kai-Lin YANG, Chi-En HUANG, Muhammad Saqlain ASLAM, Yung-Hui LI
  • Publication number: 20240085803
    Abstract: Photolithography overlay errors are a source of patterning defects, which contribute to low wafer yield. An interconnect formation process that employs a patterning photolithography/etch process with self-aligned interconnects is disclosed herein. The interconnection formation process, among other things, improves a photolithography overlay (OVL) margin since alignment is accomplished on a wider pattern. In addition, the patterning photolithography/etch process supports multi-metal gap fill and low-k dielectric formation with voids.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu
  • Patent number: 8267293
    Abstract: A car top bicycle frame for retaining at least one bicycle transversally and obliquely comprises at least one positioning rod; a retaining buckle set; and a track set. By the positioning rod to combine to the track by the clamping sets, a bicycle can be installed upon a top of a car transversally and obliquely so as to be carried safely and conveniently. The bicycle can be fixed to the bicycle retaining frame on the ground before lifted to the car top. Then the bicycle and the frame are lifted to the entrance of the assisting guide track to enter into the track. The height for operation is reduced greatly so that no platform is needed. Only one people can lift the bicycle to the car top or descend the bicycle from the car top. More bicycles can be installed to the car top. The number of bicycles can be increased as the top of the car is prolonged.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: September 18, 2012
    Inventor: Yung-Lin Liu
  • Publication number: 20100038389
    Abstract: A car top bicycle frame for retaining at least one bicycle transversally and obliquely comprises at least one positioning rod; a retaining buckle set; and a track set. By the positioning rod to combine to the track by the pulleys, a bicycle can be installed upon a top of a car transversally and obliquely so as to be carried safely and conveniently. The bicycle can be fixed to the bicycle retaining frame on the ground before lifted to the car top. Then the bicycle and the frame are lifted to the entrance of the assisting guide track to enter into the track. The height for operation is reduced greatly so that no platform is needed. Only one people can lift the bicycle to the car top or descend the bicycle from the car top. More bicycles can be installed to the car top. The number of bicycles can be increased as the top of the car is prolonged.
    Type: Application
    Filed: June 22, 2009
    Publication date: February 18, 2010
    Inventor: YUNG-LIN LIU