Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.

Abstract: A data communication circuit of a SDRAM for data communication comprises a plurality of data lines coupled to a plurality of data pins. The number of the data lines, according to an embodiment of the present invention, is less than the number of the data pins. When the data communication circuit receives/outputs data, one of the LDQM pin and the UDQM pin are enabled to receive/output a first part of the data. The other LDQM pin and the UDQM pin are enabled. Accordingly, the data communication circuit of the SDRAM, according to an embodiment of the present invention, is capable of transmitting more data using a bus with a narrow width.

Abstract: A method of rapidly building multiple three-dimensional pipes includes three primary steps: step of accepting inputs of geometric parameters; step of deriving the surface shape of multiple joined pipes according to geometric parameters; and step of deriving meshing points which present three-dimensional meshes of multiple joined pipes. There are “vacant areas” and “overlap areas” situation occurred joined area of pipes. The present invention divides joined area into “direct overlap areas”, “90 degree area” and “filling area” based on the intersecting angle of pipes.

Abstract: A flat light source with high and uniform intensity includes a reflective frame having several shapes, a ultraviolet insulated layer and a substrate covered on the reflective frame to form a placing space. The ultraviolet light sources are equipped in the placing space, and the ultraviolet light directly or indirectly excites the fluorescence powder layer to radiate the visible light. The visible light directly or reflectively passes through the ultraviolet insulated layer and the substrate to form a flat light source with high and uniform intensity. The present invention can be achieved without the seal and vacuum processes, so that the cost is reduced and the lamp burned situation is solved. The material or shape is selected accordingly, that will have the manufacture flexibility and convenience. Enlarging the coating area of the fluorescence powder layer and enhancing the reflective rate of the reflective frame improve the illumination efficiency.

Abstract: A method and apparatus for reducing intermodulation distortion is disclosed. In one embodiment, the method comprises the steps of accepting a sampled input signal V(t) wherein the input signal V(t) comprises a plurality of peaks; determining n peaks Vp1,Vp2, . . . Vpn of the sampled input signal V(t) exceeding a clip value Vclip at times t1, t2, . . . tn; and modifying the sampled input signal V(t) by weighting the n peaks Vp1,Vp2, . . . ,Vpn exceeding the clip value Vclip of the sampled input signal V(t) by a function b(t) wherein b(t) is either a hard limiting function or b(t)=f(a1, a2, . . . an;t?tp1,t?tp2, . . . t?tpn), wherein a1,a2, . . . an are weight values corresponding to the n peaks Vp1, Vp2, . . . Vpn, and f(t?tp1,t?tp2, . . . t?tpn) is a smooth shaping function. Intermodulation performance is then selectively improved in selected sub-bands by notch filtering prior to application to the non-linearity.

Abstract: Embodiments of the present invention are directed to providing a leakage detecting method for use in an oxidizing system of forming an oxide layer so as to shorten leakage detecting time period. In one embodiment, a leakage detecting method for use in an oxidizing system of forming an oxide layer comprises performing oxidizing processes on a plurality of test wafers in a plurality of test runs under a specified operating condition in an oxidizing system having an oxidizing chamber to form oxide layers on the test wafers having a plurality of oxide thicknesses for the plurality of test runs by flowing an oxidizing gas through the oxidizing chamber containing the test wafers. An oxygen concentration of the oxidizing gas exiting the oxidizing chamber is measured in each of the plurality of test runs.

Abstract: A hanging card mechanism for a socket has two steps of the function of guarding against thief and includes a card body and a base. The card body includes a card having a bottom, a driving head expanding from the bottom of the card, and an inclined conical portion connected to the driving head. The base is circular and groove-shaped and includes a bottom, two snapping pieces disposed at the bottom and being symmetrical to each other, an inner bottom surface, and a groove disposed the inner bottom surface, such that the inclined conical portion of the driving head is inserted into and joined with the groove.

Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.

Abstract: A high-brightness flat lamp structure comprises a reflecting plate, a plurality of UV light sources, a macromolecular polymer layer and a fluorescent powder layer. The UV light sources and the macromolecular polymer layer are sandwiched between the reflecting plate and the fluorescent powder layer. The functions of diffusing and guiding light of the macromolecular polymer layer are exploited to let UV lights emitted by the UV light sources and reflected by the reflecting plate excite the fluorescent powder layer to radiate high-brightness visible lights. Besides, macromolecular polymer and fluorescent powder can be mixed up to form a mixed layer of macromolecular polymer and fluorescent powder to let UV lights emitted by the UV light sources and reflected by the reflecting plate directly excite fluorescent powder to radiate high-brightness visible lights.

Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.

Abstract: A method and apparatus for reducing intermodulation distortion is disclosed. In one embodiment, the method comprises the steps of accepting a sampled input signal V(t) wherein the input signal V(t) comprises a plurality of peaks; determining n peaks Vp1,Vp2, . . . ,Vpn of the sampled input signal V(t) exceeding a clip value Vclip at times t1,t2, . . . ,tn; and modifying the sampled input signal V(t) by weighting the n peaks Vp1,Vp2, . . . ,Vpn exceeding the clip value Vclip of the sampled input signal V(t) by a function b(t) wherein b(t) is either a hard limiting function or b(t)=ƒ(a1,a2, . . . an;t-tp1,t-tp2, . . . t-tpn), wherein a1,a2, . . . an are weight values corresponding to the n peaks Vp1,Vp2, . . . ,Vpn, and ƒ(t-tp1,t-tp2, . . . t-tpn) is a smooth shaping function. Intermodulation performance is then selectively improved in selected sub-bands by notch filtering prior to application to the non-linearity.

Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.

Abstract: A high-brightness flat lamp structure comprises a reflecting plate, a plurality of UV light sources, a macromolecular polymer layer and a fluorescent powder layer. The UV light sources and the macromolecular polymer layer are sandwiched between the reflecting plate and the fluorescent powder layer. The functions of diffusing and guiding light of the macromolecular polymer layer are exploited to let UV lights emitted by the UV light sources and reflected by the reflecting plate excite the fluorescent powder layer to radiate high-brightness visible lights. Besides, macromolecular polymer and fluorescent powder can be mixed up to form a mixed layer of macromolecular polymer and fluorescent powder to let UV lights emitted by the UV light sources and reflected by the reflecting plate directly excite fluorescent powder to radiate high-brightness visible lights.

Abstract: In a method for manufacturing a high-brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, liquid macromolecular polymer is uniformly coated on the reflecting plate and the UV light sources, and fluorescent powder is then uniformly coated on the macromolecular polymer. In another method for manufacturing a high brightness planar lamp, a reflecting plate is first provided, and several UV light sources are placed on the reflecting plate. Next, fluorescent powder and liquid macromolecular polymer are mixed up and uniformly coated on the reflecting plate and the UV light sources. A solidification procedure is then performed. The solidification ways of the mixture of fluorescent powder and macromolecular polymer includes solidification by heating and solidification by illumination of UV light.

Abstract: A constant temperature refrigeration system for extensive temperature range application comprising a refrigerator, a low-temperature heat exchanger, a medium-temperature heat exchanger, a high-temperature heat exchanger, a pump, a first solenoid valve, a second solenoid valve, a third solenoid valve, a temperature sensor, a power regulator and a controller, the temperature sensor is utilized for determining the working fluid temperature and compare the actual input temperature, the actual output temperature and the predetermined temperature, and the controller is utilized for controlling the first solenoid valve, the second solenoid valve and the third solenoid valve for conveying the fluid to flow through various heat exchangers so that the working fluid is heated or cooled, with the result being that the working fluid temperature outputted is to reach the predetermined temperature, so as to acquire the working fluid having the exactly and precisely predetermined low temperature (−40° C.

Abstract: A kind of PDA (Personal Digital Assistant) that comprises a body and an expansion back case. The body comprises a connection groove found at its end, which connects to the body's processor. The expansion back case has default expansion functions, and it comprises a cover panel located at its end and a connection port below the cover panel. The connection port matches the connection groove when the body and the expansion back case are connected. To connect the body and the expansion back case together, simply slide the expansion back case on the back of the body until the cover panel of the expansion back case covers the connection port and the connection groove. A user may choose to carry either the binary PDA or just the body, so as to enhance the flexibility of the use of the PDA.

Abstract: A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.

Abstract: A method of isolating an exposed conductive surface. An aluminum layer (130) is selectively formed over the exposed conductive (106) surface (e.g., Cu) but not over the surrounding dielectric (110) surface using a thermal CVD process. The aluminum layer (130) is then oxidized to form a thin isolating aluminum-oxide (108) over only the conductive surface. The isolating aluminum-oxide provides a barrier for the Cu while taking up minimal space and reducing the effective dielectric constant.

Abstract: A polishing head for holding a wafer during a polishing process without the edge-effect or the edge peeling defect and a method for improving edge profile on a wafer during a polishing process are described. The polishing head is constructed by a carrier head, a retaining ring, and at least three piezoelectric actuator/sensors mounted in-between a recessed peripheral edge portion of the carrier head and a top surface of the retaining ring.

Abstract: A method of isolating an exposed conductive surface. An aluminum layer (130) is selectively formed over the exposed conductive (106) surface (e.g., Cu) but not over the surrounding dielectric (110) surface using a thermal CVD process. The aluminum layer (130) is then oxidized to form a thin isolating aluminum-oxide (108) over only the conductive surface. The isolating aluminum-oxide provides a barrier for the Cu while taking up minimal space and reducing the effective dielectric constant.