Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; forming a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.

Abstract: A method for fabricating an organic electro-luminescence device, including: on a substrate, forming a first conductive layer including a first electrode and a first contact pattern electrically insulated therefrom; on the first conductive layer, forming a first mask including a release film, a base film disposed between the release film and the first conductive layer and an opening for partially exposing the first electrode and the first contact pattern; by shielding of a second mask, forming a patterned organic functional layer partially covering the first mask and the first electrode exposed by the first mask; removing the second mask; forming a second conductive layer over the structure aforesaid; and patterning the second conductive layer by removing the release film and the second conductive layer formed thereon to form a second electrode electrically connected to the first contact pattern and a second contact pattern electrically connected to the first electrode.

Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; foil ling a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.

Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; forming a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.

Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Abstract: A method for fabricating an organic electro-luminescence device, including: on a substrate, forming a first conductive layer including a first electrode and a first contact pattern electrically insulated therefrom; on the first conductive layer, forming a first mask including a release film, a base film disposed between the release film and the first conductive layer and an opening for partially exposing the first electrode and the first contact pattern; by shielding of a second mask, forming a patterned organic functional layer partially covering the first mask and the first electrode exposed by the first mask; removing the second mask; forming a second conductive layer over the structure aforesaid; and patterning the second conductive layer by removing the release film and the second conductive layer formed thereon to form a second electrode electrically connected to the first contact pattern and a second contact pattern electrically connected to the first electrode.

Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; foil ling a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.

Abstract: A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.

Abstract: A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.