Abstract: An omnidirectional LED lamp comprises a light transmission bulb shell, several curved LED modules, a circuit board, and an interface board that connects to LED modules and lamp base. The LED chips are arranged and mounted on the LED module boards so that a uniform light beam with more than a 320 degree wide angle and high rear light flux can be achieved.

Abstract: A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support as mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid the breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.

Abstract: A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support as mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid the breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.

Abstract: A packaged kit of products that includes a backer card and at least one retention member for retaining multiple products between the retention member and the backer card. The retention member may include a retaining component including a first retaining section comprising a first collar portion and a first coupling portion, the first collar portion defining a first slot for retaining a first product. The retaining component may also include a second retaining section comprising a second collar portion and a second coupling portion, the second collar portion defining a second slot for retaining a second product. The retaining component may include a third retaining section extending between the first and second retaining sections that includes notches for securing a third product. At least one locking member may be coupled to and decoupled from the first and second retaining sections to secure the retention member to the backer card.

Abstract: A floating heat sink support with copper sheets for a LED flip chip package may include at least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.

Abstract: A single-pole (two-wire system) phase-controlled trailing-edge light-modulating circuit comprises a full-bridge rectification circuit, a power supply circuit, a light-modulating control circuit, and a voltage detection circuit. The light-modulating control circuit utilizes a CMOS chip and controls a field effect transistor by detecting specific voltage level to perform a trailing-edge phase control action for modulating light output of resistively and/or capacitively loaded light bulbs, e.g. LED light bulbs. The light-modulating control circuit connects to various lighting loads in series. In addition, the triggering circuit and the power supply circuit of are independent to avoid mutual restrictions to each other that might affect the adjustment of the maximum conduction phase angle.

Abstract: A floating heat sink support with copper sheets for a LED flip chip package may include at least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.

Abstract: A single-pole (two-wire system) phase-controlled trailing-edge light-modulating circuit comprises a full-bridge rectification circuit, a power supply circuit, a light-modulating control circuit, and a voltage detection circuit. The light-modulating control circuit utilizes a CMOS chip and controls a field effect transistor by detecting specific voltage level to perform a trailing-edge phase control action for modulating light output of resistively and/or capacitively loaded light bulbs, e.g. LED light bulbs. The light-modulating control circuit connects to various lighting loads in series. In addition, the triggering circuit and the power supply circuit of are independent to avoid mutual restrictions to each other that might affect the adjustment of the maximum conduction phase angle.

Abstract: An LED lamp has two layers of fluorescent powder, wherein a blue light of 400-530 nm emitted by a blue light LED chip first irradiates on an inner layer of silicate fluorescent powder to excite a light of a higher wavelength which is then emitted to an outer layer of YAG fluorescent powder, so as to obtain an ideal warm white light. The yellow light excited by the silicate fluorescent powder re-excites YAG fluorescent powder to obtain a warm white light having a higher color rendering index, while a light source with an area several times greater than that of the original chip obtained by exciting the inner layer of silicate fluorescent powder can re-excite the YAG fluorescent powder to multiply the excitation effect.

Abstract: LED lighting lamps provide improved heat dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity. Generally, the disclosed LED lamps comprise at least one LED lighting element mounted on at least one stand and a two-level heat dissipation mechanism.

Abstract: The present invention discloses a method for packaging an LED emitting light omnidirectionally and an LED package. The present invention utilizes a transparent glue to bond LED chips and electrodes onto one or more transparent glass or organic films, and vertically fixes the transparent bracket having the LED chips, electrodes and welding wires in a transparent vessel. When the diode power is on, the front face of the LED chips on the vertical transparent bracket can emit light properly, while the rear face of the LED chips can emit brighter light via the transparent glass or organic film. The present invention makes it possible to demonstrate the brightest face of an LED, and thus improves LED light extraction.

Abstract: A method of directly contacting a light emitting diode with an electrically nonconductive, substantially transparent liquid and an LED package including an LED in contact with an electrically nonconductive, substantially transparent liquid dissipates heat generated by the LED via thermal convection of the liquid. The method and the light emitting diode package may use a first heat-dissipating element in contact with the liquid and a second heat-dissipating element connected to the first heat-dissipating element to further conduct heat away from the LED. The method and the LED package may have excellent heat dissipation properties and may reduce or eliminate the decomposition and aging of a fluorescent powder due to heat and may further reduce light attenuation and color temperature differences.

Abstract: LED lighting lamps provide optimum heat dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity. Generally, the disclosed LED lamps comprise at least one LED lighting element and a substrate with a plurality of inclined planes.

Abstract: LED lamps with a conformally coated LED chip and methods of manufacturing the same provides for LEDs having predictable color temperature. A conformally coated LED chip includes an LED chip with a conformal resin layer disposed over a portion of the LED chip. The LED lamp may have the characteristics of stable color temperature, substantially even and uniform distribution of illumination, and wide illumination angle.

Abstract: LED lighting lamps provide improved heat dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity. Generally, the disclosed LED lamps comprise at least one LED lighting element mounted on at least one stand and a two-level heat dissipation mechanism.

Abstract: LED lighting lamps provide optimum heat dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity. Generally, the disclosed LED lamps comprise at least one LED lighting element and a substrate with a plurality of inclined planes.