Abstract: A semiconductor device includes a first semiconductor well. The semiconductor device includes a channel structure disposed above the first semiconductor well and extending along a first lateral direction. The semiconductor device includes a gate structure extending along a second lateral direction and straddling the channel structure. The semiconductor device includes a first epitaxial structure disposed on a first side of the channel structure. The semiconductor device includes a second epitaxial structure disposed on a second side of the channel structure, the first side and second side opposite to each other in the first lateral direction. The first epitaxial structure is electrically coupled to the first semiconductor well with a second semiconductor well in the first semiconductor well, and the second epitaxial structure is electrically isolated from the first semiconductor well with a dielectric layer.

Abstract: A semiconductor device including a first active region having a first active configuration, a second active region having a second, and different, active configuration, and a transition cell arranged between the first and second active regions in which the transition cell has a transitional configuration that is different from and compatible with both the first active configuration and the second active configuration.

Abstract: A semiconductor device including a first active region having a first active configuration, a second active region having a second, and different, active configuration, and a transition cell arranged between the first and second active regions in which the transition cell has a transitional configuration that is different from and compatible with both the first active configuration and the second active configuration.

Abstract: A magnetic component includes a core and at least one coil. The core includes at least one outer leg and an inner leg. The inner leg is separated from an upper inner surface of the core. The inner leg is at least partially divided into a plurality of separated portions along a length direction of the inner leg. The at least one coil is wound around the inner leg.

Abstract: A magnetic component includes a core, at least one coil, a first heat dissipating member and a second heat dissipating member. The core includes at least one outer leg and an inner leg. The at least one coil is wound around the inner leg. The first heat dissipating member is disposed on a first side and a top side of the core. The second heat dissipating member is disposed on a second side and the top side of the core. The first heat dissipating member and the second heat dissipating member have a first joint region, a second joint region and a third joint region on the top side. Projections of the first joint region and the second joint region do not overlap with the inner leg. A projection of at least one of the first heat dissipating member and the second heat dissipating member overlaps with the inner leg.

Abstract: A semiconductor device includes a first semiconductor well. The semiconductor device includes a channel structure disposed above the first semiconductor well and extending along a first lateral direction. The semiconductor device includes a gate structure extending along a second lateral direction and straddling the channel structure. The semiconductor device includes a first epitaxial structure disposed on a first side of the channel structure. The semiconductor device includes a second epitaxial structure disposed on a second side of the channel structure, the first side and second side opposite to each other in the first lateral direction. The first epitaxial structure is electrically coupled to the first semiconductor well with a second semiconductor well in the first semiconductor well, and the second epitaxial structure is electrically isolated from the first semiconductor well with a dielectric layer.

Abstract: Provided are a non-volatile memory device and a manufacturing method thereof. The non-volatile memory device includes a substrate having a memory region and a dummy region surrounding the memory region, an interconnect structure, memory cells, conductive vias and dummy vias. The interconnect structure is disposed on the substrate and in the memory region. The memory cells are disposed on the interconnect structure and arranged in an array when viewed from a top view. The memory cells include first memory cells in the memory region and second memory cells in the dummy region. The conductive vias are disposed in the memory region and between the first memory cells and the interconnection structure to electrically connect each of the first memory cells to the interconnect structure. The dummy vias are disposed in the dummy region and surround the memory region.

Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.

Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.

Abstract: Provided are a non-volatile memory device and a manufacturing method thereof. The non-volatile memory device includes a substrate having a memory region and a dummy region surrounding the memory region, an interconnect structure, memory cells, conductive vias and dummy vias. The interconnect structure is disposed on the substrate and in the memory region. The memory cells are disposed on the interconnect structure and arranged in an array when viewed from a top view. The memory cells include first memory cells in the memory region and second memory cells in the dummy region. The conductive vias are disposed in the memory region and between the first memory cells and the interconnection structure to electrically connect each of the first memory cells to the interconnect structure. The dummy vias are disposed in the dummy region and surround the memory region.

Abstract: Provided are a non-volatile memory device and a manufacturing method thereof. The non-volatile memory device includes a substrate having a memory region and a dummy region surrounding the memory region, an interconnect structure, memory cells, conductive vias and dummy vias. The interconnect structure is disposed on the substrate and in the memory region. The memory cells are disposed on the interconnect structure and arranged in an array when viewed from a top view. The memory cells include first memory cells in the memory region and second memory cells in the dummy region. The conductive vias are disposed in the memory region and between the first memory cells and the interconnection structure to electrically connect each of the first memory cells to the interconnect structure. The dummy vias are disposed in the dummy region and surround the memory region.

Abstract: Provided are a non-volatile memory device and a manufacturing method thereof. The non-volatile memory device includes a substrate having a memory region and a dummy region surrounding the memory region, an interconnect structure, memory cells, conductive vias and dummy vias. The interconnect structure is disposed on the substrate and in the memory region. The memory cells are disposed on the interconnect structure and arranged in an array when viewed from a top view. The memory cells include first memory cells in the memory region and second memory cells in the dummy region. The conductive vias are disposed in the memory region and between the first memory cells and the interconnection structure to electrically connect each of the first memory cells to the interconnect structure. The dummy vias are disposed in the dummy region and surround the memory region.

Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.

Abstract: A method of operating a computer that is in a sleep state and that is accessed remotely. The method includes receiving an indication that the computer should transition from a sleep state to a wake state, determining whether the indication was generated as a result of a remote access to the computer, and upon determining that the indication was generated as a result of a remote access to the computer, causing the computer to transition to a partial wake state.

Abstract: A method of operating a computer that is in a sleep state and that is accessed remotely. The method includes receiving an indication that the computer should transition from a sleep state to a wake state, determining whether the indication was generated as a result of a remote access to the computer, and upon determining that the indication was generated as a result of a remote access to the computer, causing the computer to transition to a partial wake state.

Abstract: A portable computer includes a base, a display module, at least one support element, a sliding assembly, two connecting robs, and a keyboard module. The display module includes a connecting end and a support surface. Each support element includes a first fixed end connected pivotally to the support surface and a second fixed end connected pivotally to the base. The sliding assembly includes a sliding element and a sliding guiding element disposed in the base. The sliding element is combined with the connecting end and sliding along the sliding guiding element. The keyboard module includes two keyboard portions. Each keyboard portion is moveably combined with the base. Each connecting rob can be pushed by the sliding element to drive the two keyboard portions to move relative to the base.

Abstract: A golf swing/putting trainer includes a support member including a body shaped like a plate or shaft and having a supporting wall for stopping against the user's body, and a handle including a shaft connected at one end thereof to the center of the body of the support member and having a handhold portion for holding by the user's both hands. Thus, the user can hold the handle with the two hands to abut the supporting wall of the support member against the abdomen, and then twist the waist to practice the backswing and swing actions. Alternatively, the user can hold the handle with the two hands and attach the two lower arms to the two bearing portions of the support member to practice the putting action.

Abstract: A hand grip sleeve for wrapping about a grip of a golf putter includes a flexible sleeve defining a sleeve hole extending from the front end to the rear end and a longitudinal opening cut through the peripheral wall, and a fastener provided at the flexible sleeve at two opposite sides of the longitudinal opening and operable to open or close the longitudinal opening. The fastener may be a hook and loop fastener, a zipper or snaps. Thus, the hand grip sleeve can be directly and conveniently attached to the grip of a golf putter to increase the diameter of the grip area of the golf putter for gripping tightly and comfortably. By means of the design of the longitudinal opening and the fastener, a user can easily install the hand grip sleeve on the grip of a golf putter.

Abstract: A portable computer includes a base, a display module, at least one support element, a sliding assembly, two connecting robs, and a keyboard module. The display module includes a connecting end and a support surface. Each support element includes a first fixed end connected pivotally to the support surface and a second fixed end connected pivotally to the base. The sliding assembly includes a sliding element and a sliding guiding element disposed in the base. The sliding element is combined with the connecting end and sliding along the sliding guiding element. The keyboard module includes two keyboard portions. Each keyboard portion is moveably combined with the base. Each connecting rob can be pushed by the sliding element to drive the two keyboard portions to move relative to the base.

Abstract: A golf putter includes a putter head comprising a putter block and an aiming block and a shaft fixedly connected to the putter block. The putter block includes a putting face on one side for putting a golf ball, a mounting portion on an opposite side for the mounting of the aiming block. The aiming block is a transparent block affixed to the mounting portion of the putter block, carrying an aiming mark that guides the player to put the golf ball accurately. In another embodiment, a golf putter includes a transparent putter head and a shaft connected to the putter head; and the putter head has a putting face on one side and an aiming mark on an opposite side.