Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A method for providing dynamic in-context information is disclosed.

Abstract: Disclosed are methods, systems, and computer-readable medium for dynamically displaying database containers. A display packet including a first container and a second container may be received for display via a document. A display indication including a first display requirement for the first container and a second display requirement for the second container may be received. A display size of the document may be determined. A display status may be determined based on the display size, the display status corresponding to one of being greater than a breakpoint or being less than or equal to the breakpoint. The first container and the second container may be provided to the document. A determination may be made, based on the display status and the display indication, to hide the first container and display the second container. The second container may be displayed via the document while hiding the first container.

Abstract: An OLED thin film encapsulation structure and a method of fabricating the same are provided. The OLED thin film encapsulation structure has: a substrate, a first organic layer disposed on the substrate; a first inorganic layer which is a hydrophobic layer; a second organic layer; a second inorganic layer which is disposed on the first inorganic layer and the second organic layer, and is a hydrophobic layer; and a plurality of first protrusions disposed with intervals on the first organic layer and/or the second organic layer.

Abstract: A control method for a storage device is provided. The storage device includes a memory controller and a flash memory. The flash memory includes multiple blocks. The control method includes the following steps. Maintain a state table by the memory controller, wherein the state table records a disturbance count and a last check time of the blocks in the flash memory. Trigger a probe operation on a target block in the flash memory when at least one of the following conditions is met: (a) the disturbance count of the target block is greater than or equal to a disturbance count threshold; and (b) an elapsed time period of the target block is greater than or equal to an elapsed time threshold, wherein the elapsed time period of the target block starts from the last check time of the target block.

Abstract: A control method for a storage device is provided. The storage device includes a memory controller and a flash memory. The flash memory includes multiple blocks. The control method includes the following steps. Maintain a state table by the memory controller, wherein the state table records a disturbance count and a last check time of the blocks in the flash memory. Trigger a probe operation on a target block in the flash memory when at least one of the following conditions is met: (a) the disturbance count of the target block is greater than or equal to a disturbance count threshold; and (b) an elapsed time period of the target block is greater than or equal to an elapsed time threshold, wherein the elapsed time period of the target block starts from the last check time of the target block.

Abstract: A pixel structure and manufacturing method thereof are provided. The pixel structure includes: a substrate; an anode electrode layer disposed on the substrate; a plurality of pixel units disposed on the anode electrode layer in rectangular array, where each of the pixel units includes four sub-pixel units arranged in rectangular array, and the emitting colors of the two opposite sub-pixel units at the opposite sides of any two adjacent pixel units are the same; and a cathode electrode layer disposed on the pixel units.

Abstract: A pixel structure and manufacturing method thereof are provided. The pixel structure includes: a substrate; an anode electrode layer disposed on the substrate; a plurality of pixel units disposed on the anode electrode layer in rectangular array, where each of the pixel units includes four sub-pixel units arranged in rectangular array, and the emitting colors of the two opposite sub-pixel units at the opposite sides of any two adjacent pixel units are the same; and a cathode electrode layer disposed on the pixel units.

Abstract: An OLED thin film encapsulation structure and a method of fabricating the same are provided. The OLED thin film encapsulation structure has: a substrate, a first organic layer disposed on the substrate; a first inorganic layer which is a hydrophobic layer; a second organic layer; a second inorganic layer which is disposed on the first inorganic layer and the second organic layer, and is a hydrophobic layer; and a plurality of first protrusions disposed with intervals on the first organic layer and/or the second organic layer.

Abstract: Disclosed are a cost-effective light source device that can eliminate highlights or hotspots and reduce halo phenomenon on resistor surface and a method for reading resistor value with computer vision, in which an image of a body of a resistor is extracted through irradiation by an annular light source and reflection by a replaceable diffuse reflection hood such as paper box, paper bowl, or paper cup inside pasted with white paper and extraction by an image extraction device, followed by a series of image processing operations conducted by a control unit to calculate a disposition angle of the resistor in an image. Luminous elements on opposite axial ends of the resistor are activated, according to the disposition angle, for illumination, while luminous elements on opposite lateral sides of the resistor are shut down so that a clear color resistor image can be obtained.

Abstract: Disclosed are a cost-effective light source device that can eliminate highlights or hotspots and reduce halo phenomenon on resistor surface and a method for reading resistor value with computer vision, in which an image of a body of a resistor is extracted through irradiation by an annular light source and reflection by a replaceable diffuse reflection hood such as paper box, paper bowl, or paper cup inside pasted with white paper and extraction by an image extraction device, followed by a series of image processing operations conducted by a control unit to calculate a disposition angle of the resistor in an image. Luminous elements on opposite axial ends of the resistor are activated, according to the disposition angle, for illumination, while luminous elements on opposite lateral sides of the resistor are shut down so that a clear color resistor image can be obtained.

Abstract: A switching power supply is provided and connected between external voltage source and a device having high peak current characteristic, the switching power supply comprises boost converter, control circuit and energy storing element. An input end of boost converter is connected to external voltage source, and output end of boost converter is electrically connected to the device. A control circuit is connected to boost converter in parallel. A first predetermined voltage value and a predetermined current value is set in control circuit. When output current of external voltage source is larger than predetermined current value or output voltage of external voltage source is lower than first predetermined voltage value, output voltage of boost converter is reduced to be lower than the voltage of energy storing element by control circuit.

Abstract: An OLED display panel is disclosed, which comprises: a substrate; an OLED unit disposed on the substrate; and an inorganic-DLC composite layer comprising a first inorganic layer and a first DLC layer, wherein the first inorganic layer and the first DLC layer sequentially laminate on the OLED unit, and the first inorganic layer locates between the OLED unit and the first DLC layer. Herein, a ratio of a thickness of the first inorganic layer to that of the first DLC layer is in a range from 50 to 500.

Abstract: An integrated circuit (IC) is provided. The IC includes a chip, a passivation layer, a first metal internal connection, a routing wire and a bonding area. The passivation layer is disposed on the chip, wherein the passivation layer has a first opening. The first metal internal connection is disposed under the passivation layer and disposed in the chip. The routing wire is disposed on the passivation layer, wherein a first end of the routing wire electrically connects to a first end of the first metal internal connection through the first opening of the passivation layer. The bonding area is disposed on the passivation layer, wherein the bonding area electrically connects to a second end of the routing wire.

Abstract: A light emitting diode device is provided, which comprises a substrate comprising a first growth surface and a bottom surface opposite to the first growth surface; a dielectric layer with a plurality of openings therein formed on the first growth surface; a plurality of semiconductor nano-scaled structures formed on the substrate protruding through the openings; a layer formed on the plurality of semiconductor nano-scaled structures with a second growth surface substantially parallel with the bottom surface; a light emitting diode structure formed on the second growth surface; wherein the diameters of the openings are smaller than 250 nm, and wherein the diameters of the plurality semiconductor nano-scaled structures are larger than the diameters of the corresponding openings.

Abstract: A method for controlling the color contrast of a multi-wavelength light-emitting diode (LED) made according to the present invention is disclosed. The present invention includes at least the step of increasing the junction temperature of a multi-quantum-well LED, such that holes are distributed in a deeper quantum-well layer of the LED to increase luminous intensity of the deeper quantum-well layer, thereby controlling the relative intensity ratios of the multiple wavelengths emitted by the LED. The step of increasing junction temperature of the multi-quantum-well LED is achieved either by controlling resistance through modulating thickness of a p-type electrode layer of the LED or by modifying the mesa area size to control its relative heat radiation surface area.

Abstract: A signal splitter includes a low-pass filter circuit for permitting a low-frequency component of an incoming signal in an incoming telephone line coupled to a first connecting port to pass therethrough to a second connecting port, and a coupling circuit including a capacitor coupled between a first terminal of the first connecting port and a second terminal of the second connecting port, and a coupling transformer having a primary winding that interconnects the first terminal of the first connecting port and a first input end of the low-pass filter circuit, and a secondary winding that interconnects the second terminal of the second connecting port and a second output end of the low-pass filter circuit.

Abstract: A signal splitter includes a common mode choke circuit that includes a first choke coil having two input nodes coupled to an incoming telephone line, and two output nodes coupled respectively to two first input nodes of a first filter inductor of a first filter circuit, and a second choke coil having two input nodes coupled respectively to two second output nodes of a second filter inductor of a third filter circuit, and two output nodes coupled to a telephony instrument. A second filter circuit includes a first capacitor coupled between two first output nodes of the first filter inductor that are coupled respectively to two second input nodes of the second filter inductor. The third filter circuit further includes a second capacitor coupled between the second output nodes of the second filter inductor.