Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A touch display apparatus comprising a controller and a touch display module, electrically connected to the controller, are provided. The touch display module comprises a display panel and a sensor assembly. The display panel includes a display surface and a connection surface opposite the display surface, and the sensor assembly is disposed on the connection surface and electrically connected to the controller. The sensor assembly comprises a first sensing layer and a second sensing layer, with a first sheet conducting layer and a second sheet conducting layer, respectively. When the display surface is touched, the first sheet conducting layer and the second sheet conducting layer are electrically connected to generate a touch signal. Thereby, the controller may detect a touch position according to the touch signal.