Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.

Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.

Abstract: A tile flattener device structure, which has a bottom edge support contacting the surface and positioned between the bottom of a front plate and a rear plate of a base plate, and the tiles desired to be levelled are individually positioned at the left and right elastic adjustment areas of the front and rear recesses of the front plate and the rear plate, and the levelling adjustment of tiles is performed by means of an inclined adjustment body passing through the perforation via the clamping piece, and since the front and rear recesses of the front plate and the rear plate dividing the left and right elastic adjustment areas have elasticity, they can perform levelling of various tiles, effectively reduce the working time and increase construction speed, and also reduce the usage of the tile flattener device, so that ensures the results of ease of use and reducing usage costs.

Abstract: Disclosed is a dual-usage fastener, which includes first support member, which has a body for fastening to a case for computer server, a bearing surface at the top of the body for supporting a first circuit board with a SCSI connector, and a top neck vertically upwardly extending from the bearing surface at the center, and a second support member, which has a body fixedly mounted at the top of the top neck of the first support member, and a bearing surface at the top side of the body for supporting a second circuit board with a S-ATA connector.