Patents by Inventor Yung-Sheng Sung

Yung-Sheng Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7528907
    Abstract: A material of a mirror layer is formed within a trench and a via hole. The trench is formed in a dielectric layer over a substrate. The via hole is formed within the trench. The material within the trench is the mirror layer. The material within the via hole is a via plug. The mirror layer is continuous with the via plug.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: May 5, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Yung-Sheng Sung
  • Publication number: 20070171338
    Abstract: A material of a mirror layer is formed within a trench and a via hole. The trench is formed in a dielectric layer over a substrate. The via hole is formed within the trench. The material within the trench is the mirror layer. The material within the via hole is a via plug.
    Type: Application
    Filed: January 26, 2006
    Publication date: July 26, 2007
    Inventor: Yung-Sheng Sung