Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A control device is provided. A key structure of the control device includes a keycap, an optical film layer and a membrane switch. A protrusion structure is formed on the optical film layer or the membrane switch. When the keycap is pressed down by the user, the arrangement of the protrusion structure can facilitate the user to trigger the underlying membrane switch more precisely.

Abstract: A method for laser carving of paint on an outer surface of a vehicle wheel includes a step of priming: priming an outer surface of the wheel to form a painted surface; a step of laser carving: carving the primer from a selected area of the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, and a step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area. The painted surface on the wheel can be quickly removed to disclose a selected area with metallic luster, while the wheel is prevented from corrosion so as to reduce manufacturing cost and increase precision.

Abstract: The present invention is a chain structure of bicycles, which comprises a plurality of rollers, a plurality of chain sheets and a plurality of chain rollers. Wherein the rollers define a mounting space. Each chain sheet comprises a chain body, a first pivot joint part extending from one end of chain body and to be arranged in the mounting space, a second pivot joint part horizontally extending from the other end of chain body, the second pivot joint part is installed on the roller with the first pivot joint part, wherein the first pivot joint part is in a horizontal position different from chain body, the first pivot joint part defines a rotation space for placing the second pivot joint part of another chain sheet, so that the first pivot joint part and second pivot joint part can rotate a preset angle in the rotation space.

Abstract: The present invention is a chain structure of bicycles, which comprises a plurality of rollers, a plurality of chain sheets and a plurality of chain rollers. Wherein the rollers define a mounting space. Each chain sheet comprises a chain body, a first pivot joint part extending from one end of chain body and to be arranged in the mounting space, a second pivot joint part horizontally extending from the other end of chain body, the second pivot joint part is installed on the roller with the first pivot joint part, wherein the first pivot joint part is in a horizontal position different from chain body, the first pivot joint part defines a rotation space for placing the second pivot joint part of another chain sheet, so that the first pivot joint part and second pivot joint part can rotate a preset angle in the rotation space.

Abstract: A method for laser carving of paint on an outer surface of a vehicle wheel includes a step of priming: priming an outer surface of the wheel to form a painted surface; a step of laser carving: carving the primer from a selected area of the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, and a step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area. The painted surface on the wheel can be quickly removed to disclose a selected area with metallic luster, while the wheel is prevented from corrosion so as to reduce manufacturing cost and increase precision.

Abstract: A floating drive system includes a floating disc and a floating flywheel, when the chain is offset on the floating flywheel, the floating disc is yawed on each sleeved disc axle, and the floating flywheel is yawed on the sleeved flywheel axle to maintain the linear offset of the chain.

Abstract: A signal transmission method and switching method of a waterproof connector for camera, including a lens and a bodywork. The lens contains a coupling end, the coupling end has the first NFC transmitter module and the first magnetic induction receiver module. The bodywork contains an abutting end, the abutting end has the first NFC receiver/transmitter module which receives video from the first NFC transmitter module, and the abutting end has the first magnetic induction transmitter module which transmits power to the first magnetic induction receiver module by wireless transmission. The lens is connected to the bodywork by wireless transmission, so that the lens is sealed completely for waterproofing.

Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.

Abstract: A polyurethane adhesive is formulated using a modified polyurethane copolymer, a curing agent and an antistatic agent, and the modified polyurethane copolymer is grafted a polysiloxane compound to a polyurethane polymer and made by esterifying a polyol, a hydroxyl-containing polysiloxane compound, a multi-functional isocyanate compound and a fatty acid ester; since the polyurethane adhesive is not yellowish and easy to dry as well as has excellent fabricability, air bleeding performance and transparency, when attached to surfaces of an optical or electronic device, the protective film leaves no residue and protects the surface of the device keeping no flaws.

Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.

Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

Abstract: A waterproof connector has at least one terminal housing, at least one tongue shaped surface, at least one terminal set located in the terminal housing, a plurality of contact terminals located on a side of the tongue shaped surface, and a housing surrounding the terminal housing. A water seal frame is injection molded onto the housing. The water seal frame has a first area and a second area. The housing has a first surface and a second surface. The width of the first area is larger than that of the first surface. The width of the second area is smaller than that of the second surface. The first surface is located between the first area and the second area. The first surface is located between the first area and the second area, the second surface coincides with the second area.

Abstract: A low profile card reader is disclosed to include a circuit board with a USB connection interface at the front part, an electrically insulative inner shell bonded to the circuit board outside the USB connection interface and defining an accommodation space, a card connector mounted in the accommodation space and electrically connected to the circuit board for receiving and reading a memory card and having a receiving space for receiving a memory card, a guide member connected to the circuit board and defining a sliding way disposed in line with the receiving space of the card connector for guiding a memory card into the card connector, and an outer metal shielding shell surrounding the circuit board, the electrically insulative inner shell, the card connector and the guide member for EMI protection with the USB connection interface of the circuit board exposed to the outside for connection to a computer.

Abstract: A low profile card reader is disclosed to include a circuit board with a USB connection interface at the front part, an electrically insulative inner shell bonded to the circuit board outside the USB connection interface and defining an accommodation space, a card connector mounted in the accommodation space and electrically connected to the circuit board for receiving and reading a memory card and having a receiving space for receiving a memory card, a guide member connected to the circuit board and defining a sliding way disposed in line with the receiving space of the card connector for guiding a memory card into the card connector, and an outer metal shielding shell surrounding the circuit board, the electrically insulative inner shell, the card connector and the guide member for EMI protection with the USB connection interface of the circuit board exposed to the outside for connection to a computer.