Abstract: The present invention is primarily related to the composition of an aqueous etchant containing a precursor of oxidant and patterning methods for conductive circuits, in which the chemical structure of the precursor contains chlorine and can produce oxidants through various reactions. And, the patterned conductive circuits can be used for electronic devices, including printed electronics, sensors, displays, organic light emitting diodes (OLED), touch panels, electronic circuit boards, electrodes, electroluminescent (EL) films, antennas, and solar cells.

Abstract: A structure and manufacturing method of transparent conductive circuits, comprises a base material, ink layer provided with absorbing polymer liquid characteristics and a conductive layer composed of a conductive polymer coating. The ink layer is attached to the areas on the surface of the base material not requiring electrical conductivity, and heat energy or radiation is used to accelerate drying and hardening of the ink layer. The conductive layer with an area larger than that of the ink layer is attached to and contacts the ink layer, thereby enabling the ink layer attached to the surface of the base material to increase electrical resistivity of conductive layer in contact therewith. The areas relative to the conductive layer on the surface of the base material not in contact with the ink layer are provided with electrical conductivity. Accordingly, the required conductive circuits or patterns are formed on the base material.

Abstract: The present invention is an antenna structure of a radio frequency identification system transponder, especially an antenna structure wherein an insulation layer and a foldback circuit, an opening of which faces toward a coupling part, are provided at corresponding positions of an antenna body which is provided with the coupling part. The foldback circuit is provided with a radio frequency integrated circuit, such that radio signals can be transmitted by induction by the foldback circuit and the coupling part. By this foldback circuit, an issue of directivity of the radio signals can be reduced, an effective read range of the radio signals can be increased, as well as a near field induction function and a far field induction function can be provided at a same time. Therefore, when manufacturing an RFID transponder, a production speed can be increased and production cost can be reduced.

Abstract: The present invention is an antenna structure of a radio frequency identification system transponder, especially an antenna structure wherein an insulation layer and a foldback circuit, an opening of which faces toward a coupling part, are provided at corresponding positions of an antenna body which is provided with the coupling part. The foldback circuit is provided with a radio frequency integrated circuit, such that radio signals can be transmitted by induction by the foldback circuit and the coupling part. By this foldback circuit, an issue of directivity of the radio signals can be reduced, an effective read range of the radio signals can be increased, as well as a near field induction function and a far field induction function can be provided at a same time. Therefore, when manufacturing an RFID transponder, a production speed can be increased and production cost can be reduced.

Abstract: The present invention provides a radiation curable conductive ink and a manufacturing method for conductive substrate using the conductive ink, wherein components of the radiation curable conductive ink contain at least conductive powder having a covering layer and a photosensitive binder. The radiation curable conductive ink is printed on surface of a substrate using a screen printing method, and a chemical crosslinking reaction is achieved by irradiating the conductive ink with ultraviolet ray, visible light or electron beam, thereby forming a conductive substrate. The conductive substrate is particularly applicable for use in laminate type electronic devices, including radio frequency identification (RFID) antenna, printed-circuit boards, smart cards (non-contact chip cards) components, smart labels, printed electronics, anti-electromagnetic interference (EMI) and anti-electrostatic materials.

Abstract: A light-emitting diode (LED) encapsulation material and manufacturing process comprising a photo-sensitive polymer constituting at least one of an Oligomer or a reactive Monomer, and a Photoinitiator. After a LED chip encapsulation, the photo-sensitive polymer is exposed to visible light or ultraviolet light, or electron beam, free of infrared rays, thereby triggering a free radical polymerization reaction of the photo-sensitive polymer, and rapid curing thereof under room temperature, eliminating the need for heating in a furnace during encapsulation manufacturing process of the light-emitting diode, while prompting rapid curing thereof, and thereby enhancing production efficiency.

Abstract: A light-emitting diode (LED) encapsulation material and manufacturing process comprising a photo-sensitive polymer constituting at least one of an Oligomer or a reactive Monomer, and a Photoinitiator. After a LED chip encapsulation, the photo-sensitive polymer is exposed to visible light or ultraviolet light, or electron beam, free of infrared rays, thereby triggering a free radical polymerization reaction of the photo-sensitive polymer, and rapid curing thereof under room temperature, eliminating the need for heating in a furnace during encapsulation manufacturing process of the light-emitting diode, while prompting rapid curing thereof, and thereby enhancing production efficiency.