Patents by Inventor Yung-Tai Lee

Yung-Tai Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector and manufacturing method thereof
    Patent number: 11735843
    Abstract: Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: August 22, 2023
    Assignee: PEGATRON CORPORATION
    Inventors: Yung-Tai Lee, Kai-Wen Lee, Tse-Hao Yang, Yen-Yen Chiu
  • CONNECTOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20220109257
    Abstract: Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.
    Type: Application
    Filed: August 13, 2021
    Publication date: April 7, 2022
    Inventors: Yung-Tai Lee, Kai-Wen Lee, Tse-Hao Yang, Yen-Yen Chiu