Abstract: In an embodiment, a method includes performing a first plasma deposition to form a buffer layer over a first side of a first integrated circuit device, the first integrated circuit device comprising a first substrate and a first interconnect structure; performing a second plasma deposition to form a first bonding layer over the buffer layer, wherein a plasma power applied during the second plasma deposition is greater than a plasma power applied during the first plasma deposition; planarizing the first bonding layer; forming a second bonding layer over a second substrate; pressing the second bonding layer onto the first bonding layer; and removing the first s

Abstract: A knob mechanism includes an encoder and a light guide unit. The light guide unit includes a lower member tightly sleeved on the encoder, protruding out of a housing, and having an opening and an optical channel, and an upper ring sleeved on the lower member, and having a light incident surface connected to the optical channel and a light transmitting surface spaced apart from the light incident surface. A rotary rod of the encoder protrudes out of the lower member through the opening. A knob is engaged to the rotary rod and is operable to rotate the same about an axis. Light irradiating the lower member propagates through the optical channel, into the light incident surface, and then out from the light transmitting surface in radial directions.

Abstract: A knob mechanism includes an encoder and a light guide unit. The light guide unit includes a lower member tightly sleeved on the encoder, protruding out of a housing, and having an opening and an optical channel, and an upper ring sleeved on the lower member, and having a light incident surface connected to the optical channel and a light transmitting surface spaced apart from the light incident surface. A rotary rod of the encoder protrudes out of the lower member through the opening. A knob is engaged to the rotary rod and is operable to rotate the same about an axis. Light irradiating the lower member propagates through the optical channel, into the light incident surface, and then out from the light transmitting surface in radial directions.