Patents by Inventor Yung-Ti HUNG
Yung-Ti HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11273470Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.Type: GrantFiled: December 4, 2019Date of Patent: March 15, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
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Patent number: 10814455Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.Type: GrantFiled: July 27, 2017Date of Patent: October 27, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
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Publication number: 20200101502Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.Type: ApplicationFiled: December 4, 2019Publication date: April 2, 2020Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
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Patent number: 10500616Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.Type: GrantFiled: April 26, 2017Date of Patent: December 10, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
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Patent number: 10043681Abstract: A fluid supply system includes a pressure tank configured to contain a pressurized gas and a fluid, a delivery point configured to be connected to a point of use, a recirculation piping connecting the pressure tank to the delivery point, and a return pump connected to the recirculation piping. The recirculation piping defines a circulation path for the fluid from the pressure tank through the delivery point and back to the pressure tank. The return pump is downstream of the delivery point and upstream of the pressure tank in the circulation path.Type: GrantFiled: July 23, 2013Date of Patent: August 7, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ching-Jung Hsu, Yung-Ti Hung, Chun-Feng Hsu, Nan-Peng Cheng
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Publication number: 20170320193Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.Type: ApplicationFiled: July 27, 2017Publication date: November 9, 2017Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG
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Patent number: 9789448Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.Type: GrantFiled: January 24, 2014Date of Patent: October 17, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shing-Fong Wu, Yung-Ti Hung, Shih-Pao Chien, Yen-Chen Chen
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Patent number: 9744642Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.Type: GrantFiled: October 29, 2013Date of Patent: August 29, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
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Publication number: 20170225207Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.Type: ApplicationFiled: April 26, 2017Publication date: August 10, 2017Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
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Patent number: 9643217Abstract: An apparatus includes a sprinkler configured for spraying liquid and a member with a nano-coating surface. The nano-coating surface is configured to receive liquid sprayed from the sprinkler. The apparatus further includes a sensor associated with the member and the sensor is configured to detect a signal directly or indirectly corresponding to a film deposition on the nano-coating surface. Moreover, the apparatus has a controller coupled with the sensor and the sprinkler, wherein the signal detected by the sensor is transmitted to the controller and the controller is configured to command the sprinkler spraying liquid on the nano-coating surface while a value of the signal reaches a threshold value.Type: GrantFiled: October 18, 2013Date of Patent: May 9, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
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Publication number: 20150214035Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.Type: ApplicationFiled: January 24, 2014Publication date: July 30, 2015Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shing-Fong WU, Yung-Ti HUNG, Shih-Pao CHIEN, Yen-Chen CHEN
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Publication number: 20150187562Abstract: A system including a water flow controller arranged to transmit electrical signals between a fluoride ion clean tool and a fluoride emission abatement system is provided. Fluoride gas is configured to be released from the fluoride ion clean tool and lead to the fluoride emission abatement system, and water is introduced to the fluoride emission abatement system so as to process the fluoride gas. The water flow controller further includes a receiver for accepting electrical signals from a detector. The detector is configured to measure a flow rate of fluoride gas introduced to the fluoride ion clean tool. In addition, a computing unit is configured to process electrical signals from the detector. A transmitter is configured to send commands to an actuator of the fluoride emission abatement system so as to adjust water introduced to the fluoride emission abatement system based on a processing result of the computing unit.Type: ApplicationFiled: December 27, 2013Publication date: July 2, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: HENG-MING LEE, YUNG-TI HUNG, NAN-HSIUNG HUNG
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Publication number: 20150117135Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.Type: ApplicationFiled: October 29, 2013Publication date: April 30, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG
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Publication number: 20150107623Abstract: An apparatus includes a sprinkler configured for spraying liquid and a member with a nano-coating surface. The nano-coating surface is configured to receive liquid sprayed from the sprinkler. The apparatus further includes a sensor associated with the member and the sensor is configured to detect a signal directly or indirectly corresponding to a film deposition on the nano-coating surface. Moreover, the apparatus has a controller coupled with the sensor and the sprinkler, wherein the signal detected by the sensor is transmitted to the controller and the controller is configured to command the sprinkler spraying liquid on the nano-coating surface while a value of the signal reaches a threshold value.Type: ApplicationFiled: October 18, 2013Publication date: April 23, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
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Publication number: 20150027552Abstract: A fluid supply system includes a pressure tank configured to contain a pressurized gas and a fluid, a delivery point configured to be connected to a point of use, a recirculation piping connecting the pressure tank to the delivery point, and a return pump connected to the recirculation piping. The recirculation piping defines a circulation path for the fluid from the pressure tank through the delivery point and back to the pressure tank. The return pump is downstream of the delivery point and upstream of the pressure tank in the circulation path.Type: ApplicationFiled: July 23, 2013Publication date: January 29, 2015Applicant: Taiwna Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Jung HSU, Yung-Ti HUNG, Chun-Feng HSU, Nan-Peng CHENG
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Patent number: 8629356Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.Type: GrantFiled: December 16, 2011Date of Patent: January 14, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chwen Yu, Yung-Ti Hung, Kuo-An Yeh, Tzu-Sou Chuang, Chien-Teh Huang
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Publication number: 20130153285Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.Type: ApplicationFiled: December 16, 2011Publication date: June 20, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chwen YU, Yung-Ti HUNG, Kuo-An YEH, Tzu-Sou CHUANG, Chien-Teh HUANG