Patents by Inventor Yung-Ti HUNG

Yung-Ti HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11273470
    Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: March 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
  • Patent number: 10814455
    Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 27, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
  • Publication number: 20200101502
    Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 2, 2020
    Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
  • Patent number: 10500616
    Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: December 10, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
  • Patent number: 10043681
    Abstract: A fluid supply system includes a pressure tank configured to contain a pressurized gas and a fluid, a delivery point configured to be connected to a point of use, a recirculation piping connecting the pressure tank to the delivery point, and a return pump connected to the recirculation piping. The recirculation piping defines a circulation path for the fluid from the pressure tank through the delivery point and back to the pressure tank. The return pump is downstream of the delivery point and upstream of the pressure tank in the circulation path.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: August 7, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Jung Hsu, Yung-Ti Hung, Chun-Feng Hsu, Nan-Peng Cheng
  • Publication number: 20170320193
    Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.
    Type: Application
    Filed: July 27, 2017
    Publication date: November 9, 2017
    Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG
  • Patent number: 9789448
    Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: October 17, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Fong Wu, Yung-Ti Hung, Shih-Pao Chien, Yen-Chen Chen
  • Patent number: 9744642
    Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: August 29, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
  • Publication number: 20170225207
    Abstract: An apparatus includes: a sprinkler configured for spraying liquid; a conduit with a nano-particle coated surface; a sensor associated with the conduit, wherein the sensor is configured to detect a signal corresponding to a film deposition on the nano-particle coated surface; and a controller coupled with the sensor and the sprinkler, wherein the controller is configured to regulate liquid spraying of the sprinkler over the nano-particle coated surface.
    Type: Application
    Filed: April 26, 2017
    Publication date: August 10, 2017
    Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
  • Patent number: 9643217
    Abstract: An apparatus includes a sprinkler configured for spraying liquid and a member with a nano-coating surface. The nano-coating surface is configured to receive liquid sprayed from the sprinkler. The apparatus further includes a sensor associated with the member and the sensor is configured to detect a signal directly or indirectly corresponding to a film deposition on the nano-coating surface. Moreover, the apparatus has a controller coupled with the sensor and the sprinkler, wherein the signal detected by the sensor is transmitted to the controller and the controller is configured to command the sprinkler spraying liquid on the nano-coating surface while a value of the signal reaches a threshold value.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: May 9, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Li-Hsing Chien, Yung-Ti Hung, Rouh Jier Wang, Yu-Te Chang
  • Publication number: 20150214035
    Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 30, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Fong WU, Yung-Ti HUNG, Shih-Pao CHIEN, Yen-Chen CHEN
  • Publication number: 20150187562
    Abstract: A system including a water flow controller arranged to transmit electrical signals between a fluoride ion clean tool and a fluoride emission abatement system is provided. Fluoride gas is configured to be released from the fluoride ion clean tool and lead to the fluoride emission abatement system, and water is introduced to the fluoride emission abatement system so as to process the fluoride gas. The water flow controller further includes a receiver for accepting electrical signals from a detector. The detector is configured to measure a flow rate of fluoride gas introduced to the fluoride ion clean tool. In addition, a computing unit is configured to process electrical signals from the detector. A transmitter is configured to send commands to an actuator of the fluoride emission abatement system so as to adjust water introduced to the fluoride emission abatement system based on a processing result of the computing unit.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 2, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: HENG-MING LEE, YUNG-TI HUNG, NAN-HSIUNG HUNG
  • Publication number: 20150117135
    Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.
    Type: Application
    Filed: October 29, 2013
    Publication date: April 30, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG
  • Publication number: 20150107623
    Abstract: An apparatus includes a sprinkler configured for spraying liquid and a member with a nano-coating surface. The nano-coating surface is configured to receive liquid sprayed from the sprinkler. The apparatus further includes a sensor associated with the member and the sensor is configured to detect a signal directly or indirectly corresponding to a film deposition on the nano-coating surface. Moreover, the apparatus has a controller coupled with the sensor and the sprinkler, wherein the signal detected by the sensor is transmitted to the controller and the controller is configured to command the sprinkler spraying liquid on the nano-coating surface while a value of the signal reaches a threshold value.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: LI-HSING CHIEN, YUNG-TI HUNG, ROUH JIER WANG, YU-TE CHANG
  • Publication number: 20150027552
    Abstract: A fluid supply system includes a pressure tank configured to contain a pressurized gas and a fluid, a delivery point configured to be connected to a point of use, a recirculation piping connecting the pressure tank to the delivery point, and a return pump connected to the recirculation piping. The recirculation piping defines a circulation path for the fluid from the pressure tank through the delivery point and back to the pressure tank. The return pump is downstream of the delivery point and upstream of the pressure tank in the circulation path.
    Type: Application
    Filed: July 23, 2013
    Publication date: January 29, 2015
    Applicant: Taiwna Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Jung HSU, Yung-Ti HUNG, Chun-Feng HSU, Nan-Peng CHENG
  • Patent number: 8629356
    Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: January 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chwen Yu, Yung-Ti Hung, Kuo-An Yeh, Tzu-Sou Chuang, Chien-Teh Huang
  • Publication number: 20130153285
    Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chwen YU, Yung-Ti HUNG, Kuo-An YEH, Tzu-Sou CHUANG, Chien-Teh HUANG