Abstract: A multi-antenna module system includes a substrate, a plurality of first antenna modules, a plurality of second antenna modules, and a plurality of third antenna modules. The substrate has an opening. The first antenna modules are respectively disposed on the substrate and located on two opposite first sides and two opposite second sides for transmitting and receiving a first frequency band signal. The second antenna modules are respectively disposed on the substrate and located on two opposite third sides for transmitting and receiving a second frequency band signal. The third antenna modules are respectively disposed on the substrate and located on two opposite third sides and two opposite fourth sides for transmitting and receiving a third frequency band signal. The second antenna modules and the third antenna modules are respectively located between the first antenna modules.

Abstract: A siloxane monomer, a contact lens composition, and a contact lens are respectively provided. The siloxane monomer is represented by Chemical Formula 1 below: where R1 is H or CH3; R2 is NHR3, N(R3)2, OR3, SR3, or R3 is and R4 is H or an alkyl group having a carbon chain length of C1 to C6; where x is greater than or equal to 0, y is greater than or equal to 1, and z is greater than or equal to 0.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.

Abstract: A defog lens for vehicles includes a lens barrel, a lens, and a hydrophilic layer. The lens barrel has an opening toward an object side. The lens is disposed in the lens barrel and is located at the opening. The hydrophilic layer covers a surface of the lens and includes silicone compounds. Water droplets condensed on the lens could form a sheet film sticking to the surface of the lens and hard to form spherical water droplets, thereby improving the problem that the field of view of the conventional lens is blocked by spherical water droplets, effectively improving the clarity of the image captured by the defog lens, and therefore the defog lens could be applied to various environments.

Abstract: Micro LED display device and driving method thereof. The display device includes a display substrate and a data driving circuit. The display substrate includes multiple pixels, and each pixel includes a first subpixel and a second subpixel. The first subpixel has a first subpixel circuit and a first light-emitting element. The second subpixel has a second subpixel circuit and a second light-emitting element. The first subpixel circuit and the second subpixel circuit are configured independently. The data driving circuit is electrically connected to the first and the second subpixel circuits. The data driving circuit transmits a first data signal to the first subpixel circuits to drive the first light-emitting elements and a second data signal to the second subpixel circuits to drive the second light-emitting elements. The first data signal is a PWM signal, and the second data signal is a PAM signal.

Abstract: Micro LED display device and driving method thereof. The display device includes a display substrate and a data driving circuit. The display substrate includes multiple pixels, and each pixel includes a first subpixel and a second subpixel. The first subpixel has a first subpixel circuit and a first light-emitting element. The second subpixel has a second subpixel circuit and a second light-emitting element. The first subpixel circuit and the second subpixel circuit are configured independently. The data driving circuit is electrically connected to the first and the second subpixel circuits. The data driving circuit transmits a first data signal to the first subpixel circuits to drive the first light-emitting elements and a second data signal to the second subpixel circuits to drive the second light-emitting elements. The first data signal is a PWM signal, and the second data signal is a PAM signal.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a substrate processing device and a processor. The substrate processing device includes a processing chamber, a gas supply module and a gas source. The processor is configured to monitor and control the gas supplied into the substrate processing device.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.

Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.

Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.

Abstract: A display device includes a display panel, a data driving unit, and a timing control unit. The display panel includes a plurality of data driving lines. The data driving unit is electrically coupled to the display panel for driving at least one part of the plurality of data driving lines. The timing control unit is disposed on a side of the display panel for processing a plurality of data vectors generated by a data source. The timing control unit includes an encoder module, a serializer module, and a data transmitter module. The encoder module is used for encoding a plurality of N bit data vectors to a plurality of N+m bit data vectors. The serializer module is electrically coupled to the encoder module for serializing the plurality of N+m bit data vectors. The data transmitter module is used for transmitting the plurality of serialized N+m bit data vectors to the data driving unit.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.