Patents by Inventor Yung Tseng

Yung Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050247707
    Abstract: An interface panel structure used in an electric machine; comprises a fixed seat with a fixed seat with a holding element and sliding rails and a movable sliding seat installed therein. Fixing holes for accepting the holding element and sliding grooves operated in cooperation with the sliding rails are disposed in the sliding seat. In addition, a guide rod is installed in the sliding seat for touching off the holding the holding element to separate it from the fixing hole. When the holding element and the fixing hole are engaged, the sliding seat with interface outlets disposed at the front face thereof is hidden in the fixed seat fixed in the electric machine. And, there is no need to open holes on the surface of the electric machine by means of the interface panel structure.
    Type: Application
    Filed: September 30, 2004
    Publication date: November 10, 2005
    Inventors: Yung Tseng, Kuan Ko, Yi Yuan, Chen Chang
  • Publication number: 20050022142
    Abstract: An integrated circuit for locating failure process layers. The circuit has a substrate with a scan chain disposed therein, having scan cells connected to form a series chain. Each connection is formed according to a layout constraint of a minimum dimension provided by design rules for an assigned routing layer. Since the connection in the assigned routing layer is constrained to a minimum, the scan chain is vulnerable to variations in processes relevant to the assigned routing layer. The scan chain makes it easier to locate processes causing low yield rate of the scan chain.
    Type: Application
    Filed: July 25, 2003
    Publication date: January 27, 2005
    Inventors: An-Ru Andrew Cheng, Chang-Song Lin, Tzu-Chun Liu, Huan-Yung Tseng
  • Publication number: 20040081208
    Abstract: A circuit for control and observation of a scan chain. The circuit comprises a group of first scan cells connected in series, receiving a first data signal and outputting a second data signal, a multiplexer receiving the first and second data signal, and selectively outputting the first and second data signal in response to a selection signal, and a group of second scan cells connected in series, receiving the first or second data signal from the multiplexer, and outputting a third data signal.
    Type: Application
    Filed: October 29, 2002
    Publication date: April 29, 2004
    Inventor: Huan-Yung Tseng
  • Patent number: 6723654
    Abstract: A method for in-situ descum/hot bake/dry etch a polyimide photoresist layer and a passivation layer in a singe process chamber is disclosed. A process chamber that can be used for conducting in-situ a descum, a hot bake and a dry etch process sequentially in the same chamber is also disclosed. In the method, a process chamber equipped with a wafer platform and a wafer backside heating and cooling device is first provided, followed by the step of positioning a wafer that has a passivation layer and a patterned polyimide photoresist layer on top of the platform. An oxygen plasma is then generated in the chamber cavity to conduct a descum process, followed by flowing a heated inert gas onto a backside of the wafer to conduct a hot bake process. A cooling inert gas is then flown onto the wafer backside and an etchant gas is flown into the chamber to conduct a dry etch process for forming a via opening in the wafer.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: April 20, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Kuei-Jen Chang, Yuan-Ko Hwang, Juei-Wen Lin, Jen-Yung Tseng
  • Publication number: 20020139775
    Abstract: A method for in-situ descum/hot bake/dry etch a polyimide photoresist layer and a passivation layer in a singe process chamber is disclosed. A process chamber that can be used for conducting in-situ a descum, a hot bake and a dry etch process sequentially in the same chamber is also disclosed. In the method, a process chamber equipped with a wafer platform and a wafer backside heating and cooling device is first provided, followed by the step of positioning a wafer that has a passivation layer and a patterned polyimide photoresist layer on top of the platform. An oxygen plasma is then generated in the chamber cavity to conduct a descum process, followed by flowing a heated inert gas onto a backside of the wafer to conduct a hot bake process. A cooling inert gas is then flown onto the wafer backside and an etchant gas is flown into the chamber to conduct a dry etch process for forming a via opening in the wafer.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Kuei-Jen Chang, Yuan-Ko Hwang, Juei-Wen Lin, Jen-Yung Tseng
  • Patent number: 6398381
    Abstract: A wind-driven perfume dispenser capable of producing different light patterns includes a body portion, a rotatable light-emitting device rotatably mounted on the body portion, and a decoration, the rotatable light-emitting device including an impeller and a light-emitting device mounted on the impeller, whereby the light-emitting device will give light when the impeller is blown by wind and, almost at the same time, the integrated circuit will control the light-emitting diodes to give various kinds of light patterns which will pass through the opening of the decoration to produce a mysterious and appealing appearance, especially at night time.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: June 4, 2002
    Inventor: Wen Yung Tseng
  • Patent number: 5696319
    Abstract: A modal survey flexure fixture of designed to be soft laterally and stiff axially to simulate the same behavior of space shuttle flight latches which support shuttle payloads for payload modal survey verification, qualification and test. The device consists of three major components: an A-Frame which supports flexure rods attached to a trunnion clamp. Flexure rods made of stainless steel with a partially reduced cross section at both ends increase the lateral flexibility for simulating flight conditions. The trunnion clamp is a unique design which takes into account payload integration with the test fixture. The trunnion clamp can be split into upper and lower portions. During the modal survey the lower trunnion clamp acts initially as a place holder for payload installation and alignment. After payload installation and alignment the lower trunnion clamp is combined with the upper trunnion clamp to complete the test fixture configuration.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: December 9, 1997
    Assignee: McDonnell Douglas Corporation
    Inventors: Yung-Tseng Chung, Walter Tsui
  • Patent number: D403492
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: January 5, 1999
    Inventor: Chang-Yung Tseng