Patents by Inventor Yung Wei

Yung Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250038052
    Abstract: In a method of manufacturing a chip structure, a first carrier is attached on a back surface of a wafer, the wafer is diced into individual dies and there is a groove formed between the adjacent dies, then a second carrier is attached on an active surface of the wafer and the first carrier is removed to expose the groove, a back surface and a lateral surface of each of the dies, a heat dissipation cover is formed on the back surface and the lateral surface of each of the dies to obtain chip structures. The heat dissipation cover is provided to increase heat dissipation efficiency of the dies and prevent formation of metal debris which may contaminate the dies. Furthermore, the heat dissipation cover is prevented from being separated from the die.
    Type: Application
    Filed: March 21, 2024
    Publication date: January 30, 2025
    Inventors: Cheng-Hung Shih, Yung-Wei Hsieh, Chia-Ling Shih
  • Publication number: 20240356234
    Abstract: Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.
    Type: Application
    Filed: March 12, 2024
    Publication date: October 24, 2024
    Applicant: Innolux Corporation
    Inventors: Yan-Zheng Wu, Yung-Wei Chen, Chen-Lin Yeh
  • Patent number: 11962426
    Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module is used to provide a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to the load device being connected or not.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 16, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yung-Wei Peng, Kuan-Hsien Tu, Cheng-En Liu
  • Patent number: 11953964
    Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module provides a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to whether the load device is connected to the Ethernet power supply.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 9, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yung-Wei Peng, Kuan-Hsien Tu, Cheng-En Liu
  • Publication number: 20240030580
    Abstract: An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.
    Type: Application
    Filed: June 9, 2023
    Publication date: January 25, 2024
    Applicant: Innolux Corporation
    Inventors: Chen-Lin Yeh, Yan-Zheng Wu, Yung-Wei Chen
  • Publication number: 20240024188
    Abstract: An airway clearance therapy system includes a blower and an air pulse generator coupled to the blower. The air pulse generator includes a casing defining a chamber, first and second pistons disposed within the chamber, and a connector assembly coupled to the first and second pistons. A first connecting rod is coupled to the first piston, and a second connecting rod is coupled to the second piston. The air pulse generator also includes dampening pads disposed between the connector assembly and each of the first and second pistons. A motor assembly is operably coupled to the connector assembly. The connector assembly translates rotational motion from the motor assembly to linear motion of the first and second pistons to generate air pulses. A dampener is disposed between the motor assembly and the casing to reduce vibrations transferred between the motor assembly and the casing.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 25, 2024
    Inventors: Deny Duay Barilea, Yong Guan Tay, Mo Chuk Wong, Yung Wei Neo, Kean Peng Tay
  • Publication number: 20230391610
    Abstract: A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package also includes a sensor disposed on the substrate and having a connecting structure disposed on the bottom of the sensor. The connecting structure is electrically connected to the substrate and the circuit device. The MEMS microphone package further includes a cap covering the circuit device and the sensor and separated from the circuit device and the sensor.
    Type: Application
    Filed: January 18, 2023
    Publication date: December 7, 2023
    Inventors: Yen-Son Paul HUANG, Iou-Din Jean CHEN, Shih-Chung WANG, Yung-Wei CHEN
  • Publication number: 20230345184
    Abstract: A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface and a second surface opposite to the first surface. The IC die is stacked on the first surface of the first MEMS sensor die. The first conductive lid is disposed on the second surface of the first MEMS sensor die.
    Type: Application
    Filed: September 19, 2022
    Publication date: October 26, 2023
    Inventors: Yen-Son Paul HUANG, Iou-Din Jean CHEN, Shih-Chung WANG, Yung-Wei CHEN
  • Publication number: 20230340323
    Abstract: A quantum dot light emitting material is provided, which includes: a core comprising an inorganic oxide; a quantum dot layer covering the core and comprising perovskite quantum dots; and a protection layer covering the quantum dot layer, wherein the protection layer comprises PbX(OH), and X is Cl, Br or I. In addition, a method for manufacturing the aforesaid quantum dot light emitting material is also provided. Moreover, a diffusion plate comprising the aforesaid quantum dot light emitting material is also provided.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 26, 2023
    Inventor: Yung-Wei HUANG
  • Publication number: 20230340321
    Abstract: A quantum dot light emitting material is provided, which includes: a core including an inorganic oxide; and a quantum dot layer covering the core and including perovskite quantum dots. In addition, a diffusion plate including the aforesaid quantum dot light emitting material is also provided.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 26, 2023
    Inventor: Yung-Wei HUANG
  • Publication number: 20230275100
    Abstract: This disclosure provides a display panel including pixels and a metal layer below the pixels. The metal layer includes a body portion at the center of the display panel and a mesh portion at the edge of the display panel and adjacent to the body portion. The contour of the body portion defines a first region, where first pixels are disposed in the first region and electrically connected to the body portion. The contour of the mesh portion defines a second region, where second pixels are disposed in the second region and electrically connected to the mesh portion. The mesh portion and the body portion are electrically connected to each other, the density of metal distribution of the first region is higher than that of the second region, and the area of the second region is 20% to 40% of the area of the display panel.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 31, 2023
    Inventors: I-Peng CHIEN, Tai-Tso LIN, Wen-Yung WEI, Chen-Yuan TU
  • Publication number: 20230275101
    Abstract: The present disclosure provides a display panel including a substrate, a pixel pad layer above the substrate, and a contact stack above the substrate and electrically connected the pixel pad layer. The contact stack includes a first metal layer, a second metal layer above the first metal layer, and a first interlayer insulation layer between the first metal layer and the second metal layer. The first interlayer insulation layer includes a first top portion covering an edge of a top surface of the first metal layer. The second metal layer is electrically connected to the top surface of the first metal layer exposed by the first interlayer insulation layer. A sidewall of the first interlayer insulation layer is recessed from a sidewall of the substrate by a first distance greater than zero.
    Type: Application
    Filed: November 8, 2022
    Publication date: August 31, 2023
    Inventors: I-Peng CHIEN, Tai-Tso LIN, Chen-Yuan TU, Wen-Yung WEI
  • Publication number: 20230180450
    Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module provides a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to whether the load device is connected to the Ethernet power supply.
    Type: Application
    Filed: June 2, 2022
    Publication date: June 8, 2023
    Inventors: Yung-Wei PENG, Kuan-Hsien TU, Cheng-En LIU
  • Publication number: 20230179436
    Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module is used to provide a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to the load device being connected or not.
    Type: Application
    Filed: May 25, 2022
    Publication date: June 8, 2023
    Inventors: Yung-Wei PENG, Kuan-Hsien TU, Cheng-En LIU
  • Publication number: 20230020188
    Abstract: An auxiliary unit for a face mask with earloops comprises a rectangular or oval main body, the main body includes first and opposite second end. At least one first hanger and more than one second hangers are arranged on the main body, the first hanger being close to the first end while the second hangers are closer to the second end. The wearer hangs one of loops of the mask on the first hanger and selects one second hanger for securing the other loop, depending on his head circumstances, therefore, the auxiliary unit releases ears from pressures of anchoring the face mask loops and improves experiences of wearing the face mask.
    Type: Application
    Filed: April 25, 2022
    Publication date: January 19, 2023
    Inventor: YUNG-WEI SHEN
  • Publication number: 20220391385
    Abstract: A system for managing a report comprises a generating module, for receiving data of a first user and for generating a first report according to the data; an associating module, coupled to the generating module, for determine a first content of a second report according an association between the first report and the second report; and a notifying module, coupled to the associating module, for notifying a managing result of the first report and the second report to the first user and a second user, wherein the second user is associated with a project corresponding to the first report.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chih-Chin Yu, Yung-Wei Tseng, Yu-Fu Chen, Wan-Ling Zhong
  • Patent number: 11212122
    Abstract: A power source device coupled to a power device includes an output port and a controller. When the output port is coupled to a connection cable, the controller is activated to generate a handshake signal, so as to communicate with the power device. When it is determined that the power device is able to be powered according to the handshake signal, the controller controls the power supply device to power the power device through the connection cable. When the connection cable is not coupled to the output port, the controller is deactivated and thus the handshake signal is not generated.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: December 28, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yung-Wei Peng, Kuan-Hsien Tu, Yen-Lun Wu, Cheng-En Liu, Hsuan-Chen Lin
  • Patent number: 11206057
    Abstract: There is provided a capacitive communication system including an object and a capacitive touch panel. The object includes a plurality of induction conductors configured to have different potential distributions at different time intervals by modulating respective potentials thereof. The capacitive touch panel includes a plurality of sensing electrodes configured to form a coupling electric field with the induction conductors to detect the different potential distributions at the different time intervals. When the different potential distributions match a predetermined agreement between the object and the capacitive touch panel, a near field communication is formed between the object and the capacitive touch panel.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: December 21, 2021
    Assignee: PIXART IMAGING INC.
    Inventors: Yung-Wei Chen, Yen-Chang Wang, Yen-Min Chang, Hsin-Chia Chen
  • Publication number: 20210160438
    Abstract: An image device for generating depth images includes at least two image capturers and a rotating device. When the rotating device rotates the at least two image capturers, multiple images captured by the at least two image capturers are utilized to generate a depth image, wherein a view angle corresponding to the depth image is not less than a view angle of each image capturer of the at least two image capturers.
    Type: Application
    Filed: January 6, 2021
    Publication date: May 27, 2021
    Inventors: Chi-Feng Lee, Yung-Wei Chen
  • Publication number: 20210126804
    Abstract: A power source device coupled to a power device includes an output port and a controller. When the output port is coupled to a connection cable, the controller is activated to generate a handshake signal, so as to communicate with the power device. When it is determined that the power device is able to be powered according to the handshake signal, the controller controls the power supply device to power the power device through the connection cable. When the connection cable is not coupled to the output port, the controller is deactivated and thus the handshake signal is not generated.
    Type: Application
    Filed: July 13, 2020
    Publication date: April 29, 2021
    Inventors: Yung-Wei PENG, Kuan-Hsien TU, Yen-Lun WU, Cheng-En LIU, Hsuan-Chen LIN