Abstract: An electric treadmill includes a treadmill frame, an endless belt, a motor coupled to the endless belt for driving the endless belt to rotate, a brake device and a lifting device. The brake device has a rotating disc coaxially fixed to a motor shaft of the motor and a magnetic brake mechanism. The magnetic brake mechanism has at least one magnetic portion for applying a drag force against rotation of the rotating disc. The lifting device is operable to drive the magnetic brake mechanism to move between a first position where the magnetic portion is located close to the rotating disc and a second position where the magnetic portion is located away from the rotating disc. When there is no electric power supplied to the electric treadmill, the magnetic brake mechanism will automatically move to the first position due to gravity to stop rotation of the endless belt.

Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A motor brake device of an exercise apparatus includes a motor, a brake device and a lifting device. The brake device has a rotating disc and a magnetic brake mechanism. The rotating disc is coaxially mounted on a motor shaft of the motor. The magnetic brake mechanism has at least one magnetic portion. The lifting device is configured to drive the magnetic brake mechanism to move between a first position where the magnetic portion is located close to the rotating disc and a second position where the magnetic portion is located away from the rotating disc. The second position is located higher than the first position. When there is no electric power supplied to the exercise apparatus, the magnetic brake mechanism can move downward to the first position to stop rotation of the motor shaft by gravity due to potential difference between the second position and the first position.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a semiconductor protruding structure over a substrate and surrounding the semiconductor protruding structure with an insulating layer. The method also includes forming a dielectric layer over the insulating layer. The method further includes partially removing the dielectric layer and insulating layer using a planarization process. As a result, topmost surfaces of the semiconductor protruding structure, the insulating layer, and the dielectric layer are substantially level with each other. In addition, the method includes forming a protective layer to cover the topmost surfaces of the dielectric layer. The method includes recessing the insulating layer after the protective layer is formed such that the semiconductor protruding structure and a portion of the dielectric layer protrude from a top surface of a remaining portion of the insulating layer.

Abstract: A semiconductor device and method of manufacture are provided. In embodiments a first liner is deposited to line a recess between a first semiconductor fin and a second semiconductor fin, the first liner comprising a first material. The first liner is annealed to transform the first material to a second material. A second liner is deposited to line the recess, the second liner comprising a third material. The second liner is annealed to transform the third material to a fourth material.

Abstract: A blood pressure device includes a first blood pressure measuring device, a second blood pressure measuring device, and a controller. The first blood pressure measuring device is to be worn on a first position of a wrist so as to obtain a first blood pressure information of the first position. The second blood pressure measuring device is to be worn on a second position of the wrist so as to obtain a second blood pressure information of the second position. The controller is electrically coupled to the first blood pressure measuring device and the second blood pressure measuring device so as to adjust tightness between the expanders and the user's skin, respectively. The controller receives, processes, and calculates a pulse transit time between the first blood pressure information and the second blood pressure information, and the controller obtains at least one blood pressure value based on the pulse transit time.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: An electric-carrier power-supply device for use in an electric carrier is provided. The electric-carrier power-supply device includes a piezoresistive sensor, a battery interface, and a power-management unit (PMU). The battery interface is connected to an on-board battery and receives power from the on-board battery. The PMU controls power to a motor of the electric carrier. A piezoresistive strain gage is disposed between a contact area between the battery interface and the on-board battery, and is used to detect a pressure value of the contact area. The piezoresistive sensor receives the pressure value detected by the piezoresistive strain gage, and converts the pressure value into a resistance value. The piezoresistive sensor determines whether the resistance value is within a safe resistance value range to generate a resistance-value-determination signal. The PMU determines whether to provide power to the motor is according to the resistance-value-determination signal.

Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.

Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: A wireless device driving method includes hiding a header emulated with a second protocol in a payload of a packet defined with a first protocol and transmitting the emulated header at a transmission side, receiving the emulated header and an ambient signal at a reception side, and decoding the ambient signal according to the second protocol to obtain a bit sequence.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: A modulation scheme conversion device includes: a backscattering tag to which a tag signal is provided; and a tag signal forming unit for forming a tag signal. The modulation scheme conversion device multiplies a radio signal, which has been modulated in a first modulation scheme, and a tag signal, and reconfigures the multiplied signal by using a second modulation scheme, so as to backscatter the reconfigured signal, wherein the reconfiguration is performed in a physical (PHY) layer.

Abstract: A wireless device driving method includes hiding a header emulated with a second protocol in a payload of a packet defined with a first protocol and transmitting the emulated header at a transmission side, receiving the emulated header and an ambient signal at a reception side, and decoding the ambient signal according to the second protocol to obtain a bit sequence.

Abstract: A treadmill contains a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns, wherein each column having a slidable space, and the slidable space having two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.