Abstract: A method of generating image signals includes: receiving a first input image signal and a second input image signal by a processing device; outputting, by the processing device, an output image signal having an output resolution according to the first input image signal and the second input image signal; and outputting the output image signal from the processing device to a display device. An ending edge of a first frame image pulse of the first input image signal is at a first moment, an ending edge of a first output frame image pulse of the output image signal is at a second moment, a first time length from the first moment to the second moment is smaller than a time length of the first output frame image pulse.

Abstract: A gateway includes a modulation scheme conversion device, which includes a backscattering tag and a tag signal generation unit configured to provide a tag signal to the backscattering tag. The modulation scheme conversion device multiplies a radio signal, which has been modulated with a first modulation scheme, and the tag signal to produce a multiplied signal and to reshape the multiplied signal using a second modulation scheme to produce a reshaped signal and backscatters the reshaped signal. The signal, which is reshaped with the second modulation scheme and backscattered, is provided to a receiver of second modulation scheme signals and then provided to the Internet.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: A modulation scheme conversion device includes: a backscattering tag to which a tag signal is provided; and a tag signal forming unit for forming a tag signal. The modulation scheme conversion device multiplies a radio signal, which has been modulated in a first modulation scheme, and a tag signal, and reconfigures the multiplied signal by using a second modulation scheme, so as to backscatter the reconfigured signal, wherein the reconfiguration is performed in a physical (PHY) layer.

Abstract: A wireless device driving method includes hiding a header emulated with a second protocol in a payload of a packet defined with a first protocol and transmitting the emulated header at a transmission side, receiving the emulated header and an ambient signal at a reception side, and decoding the ambient signal according to the second protocol to obtain a bit sequence.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: A modulation scheme conversion device includes: a backscattering tag to which a tag signal is provided; and a tag signal forming unit for forming a tag signal. The modulation scheme conversion device multiplies a radio signal, which has been modulated in a first modulation scheme, and a tag signal, and reconfigures the multiplied signal by using a second modulation scheme, so as to backscatter the reconfigured signal, wherein the reconfiguration is performed in a physical (PHY) layer.

Abstract: A wireless device driving method includes hiding a header emulated with a second protocol in a payload of a packet defined with a first protocol and transmitting the emulated header at a transmission side, receiving the emulated header and an ambient signal at a reception side, and decoding the ambient signal according to the second protocol to obtain a bit sequence.

Abstract: A treadmill contains a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns, wherein each column having a slidable space, and the slidable space having two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: The present invention provides an asymmetric duplex transmission device and a switching system employing the same. The master device and the slave device communicate with each other through a single clock and full duplex data channels. It can also switch the duplex data channels between a plurality of slave devices under limited resources.

Abstract: A many-to-many state identification system of equipment names broadcasted from Internet-of-Things comprises IoT nodes and IoT mobile devices connecting the IoT nodes wirelessly. Each IoT node receives the sensed value of transducer on a machine element, determining whether the sensed value of transducer is abnormal. Next, the IoT node broadcasts an equipment identification name containing an existing gateway identification code and a state code of transducer showing whether the transducer is abnormal. When the IoT mobile device scans the equipment identification name broadcasted from the IoT node, a visual interface displays the state of IoT node by identifying the gateway identification code and the state code. Accordingly, before connecting the IoT mobile device to the IoT node, the state of transducer in the IoT node is acquired, allowing any IoT mobile device to monitor any transducer in a synchronous and many-to-many manner within the broadcasting area.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A treadmill contains: a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns. The respective column has a slidable space, and the slidable space has two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A many-to-many state identification system of equipment names broadcasted from Internet-of-Things comprises IoT nodes and IoT mobile devices connecting the IoT nodes wirelessly. Each IoT node receives the sensed value of transducer on a machine element, determining whether the sensed value of transducer is abnormal. Next, the IoT node broadcasts an equipment identification name containing an existing gateway identification code and a state code of transducer showing whether the transducer is abnormal. When the IoT mobile device scans the equipment identification name broadcasted from the IoT node, a visual interface displays the state of IoT node by identifying the gateway identification code and the state code. Accordingly, before connecting the IoT mobile device to the IoT node, the state of transducer in the IoT node is acquired, allowing any IoT mobile device to monitor any transducer in a synchronous and many-to-many manner within the broadcasting area.

Abstract: The present invention is related to a trackable authentication system of canvas for tracking and authenticating artwork, the canvas comprising: a canvas made by thread; and a plurality of wireless communication chips, that is NFC (Near Field Communication) or RFID (Radio Frequency Identification) chip, each chip being disposed at an appropriate position wherein a plurality of threads are knitted into canvas material for the canvas, and wherein the NFC or RFID chips are for transferring verifiable codes and the codes are provided with tracking and authentification information.

Abstract: The present invention relates to a method for determining a communication method between a base station and a terminal and, more particularly, to a method and an apparatus allowing a base station to lead the setting of a communication method including wireless LAN communication between the base station and the terminal. The method by which a first network base station determines the communication method, according to an embodiment of the present invention, comprises the steps of: receiving access related information from an access point of the terminal and a second network; and determining the communication method with the terminal among a plurality of communication methods on the basis of the access related information, wherein the plurality of communication methods comprise a first network dedicated carrier aggregation, a second network dedicated carrier aggregation or a carrier aggregation between the first network and the second network.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.