Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a semiconductor protruding structure over a substrate and surrounding the semiconductor protruding structure with an insulating layer. The method also includes forming a dielectric layer over the insulating layer. The method further includes partially removing the dielectric layer and insulating layer using a planarization process. As a result, topmost surfaces of the semiconductor protruding structure, the insulating layer, and the dielectric layer are substantially level with each other. In addition, the method includes forming a protective layer to cover the topmost surfaces of the dielectric layer. The method includes recessing the insulating layer after the protective layer is formed such that the semiconductor protruding structure and a portion of the dielectric layer protrude from a top surface of a remaining portion of the insulating layer.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: An electric-carrier power-supply device for use in an electric carrier is provided. The electric-carrier power-supply device includes a piezoresistive sensor, a battery interface, and a power-management unit (PMU). The battery interface is connected to an on-board battery and receives power from the on-board battery. The PMU controls power to a motor of the electric carrier. A piezoresistive strain gage is disposed between a contact area between the battery interface and the on-board battery, and is used to detect a pressure value of the contact area. The piezoresistive sensor receives the pressure value detected by the piezoresistive strain gage, and converts the pressure value into a resistance value. The piezoresistive sensor determines whether the resistance value is within a safe resistance value range to generate a resistance-value-determination signal. The PMU determines whether to provide power to the motor is according to the resistance-value-determination signal.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A treadmill contains a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns, wherein each column having a slidable space, and the slidable space having two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: The present invention provides an asymmetric duplex transmission device and a switching system employing the same. The master device and the slave device communicate with each other through a single clock and full duplex data channels. It can also switch the duplex data channels between a plurality of slave devices under limited resources.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A treadmill contains: a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns. The respective column has a slidable space, and the slidable space has two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: The present invention is related to a trackable authentication system of canvas for tracking and authenticating artwork, the canvas comprising: a canvas made by thread; and a plurality of wireless communication chips, that is NFC (Near Field Communication) or RFID (Radio Frequency Identification) chip, each chip being disposed at an appropriate position wherein a plurality of threads are knitted into canvas material for the canvas, and wherein the NFC or RFID chips are for transferring verifiable codes and the codes are provided with tracking and authentification information.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: The present invention is related to a trackable authentication system of canvas for tracking and authenticating artwork, the canvas comprising: a canvas made by thread; and a plurality of wireless communication chips, that is NFC (Near Field Communication) or RFID (Radio Frequency Identification) chip, each chip being disposed at an appropriate position wherein a plurality of threads are knitted into canvas material for the canvas, and wherein the NFC or RFID chips are for transferring verifiable codes and the codes are provided with tracking and authentification information.

Abstract: A synchronized video stream switching method for a video wall system. The video wall system includes a transmitter having first and second channels, and a receiver having third and fourth channels. The method includes: (a) After receiving a control command, the transmitter uses the first channel to transmit the first video stream to the third channel, and uses the second channel to transmit a pre-switch command to the fourth channel. (b) After receiving the pre-switch command, the receiver preserves the first video stream in the third channel. (c) After the switching event occurs at the transmitter in response to the control command, the transmitter transmit the second video stream via the first channel, but the receiver continues to preserve the first video stream in the third channel within a predetermined time period. (d) After the predetermined time period, the receiver accepts the second video stream in the third channel.

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

Abstract: A synchronized video stream switching method for a video wall system. The video wall system includes a transmitter having first and second channels, and a receiver having third and fourth channels. The method includes: (a) After receiving a control command, the transmitter uses the first channel to transmit the first video stream to the third channel, and uses the second channel to transmit a pre-switch command to the fourth channel. (b) After receiving the pre-switch command, the receiver preserves the first video stream in the third channel. (c) After the switching event occurs at the transmitter in response to the control command, the transmitter transmit the second video stream via the first channel, but the receiver continues to preserve the first video stream in the third channel within a predetermined time period. (d) After the predetermined time period, the receiver accepts the second video stream in the third channel.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: An electronic device includes a transducer including a sensing area and a covering structure that covers the transducer. The covering structure includes a shelter portion and defines at least one aperture. The shelter portion covers the sensing area. The aperture includes a first curved surface and a second curved surface farther away from the sensing area than the first curved surface, and a first center of a first curvature of the first curved surface is at a different location than a second center of a second curvature of the second curved surface.