Patents by Inventor Yung You Lin

Yung You Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance thermal solution concept for surface mount device packages
    Patent number: 11357097
    Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: June 7, 2022
    Assignee: Flex Ltd.
    Inventors: Yung You Lin, Lien Jin Chiang, Hung Cheng Chang
  • HIGH PERFORMANCE THERMAL SOLUTION CONCEPT FOR SURFACE MOUNT DEVICE PACKAGES
    Publication number: 20220132651
    Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 28, 2022
    Applicant: Flex Ltd.
    Inventors: Yung You Lin, Lien Jin Chiang, Hung Cheng Chang