Abstract: A pressure sensing flexible circuit board and a method of fabricating the same are provided. The pressure sensing flexible circuit board includes a flexible circuit substrate and a pressure sensing element and a vibrating element disposed on the flexible circuit substrate. The pressure sensing element includes a first piezoelectric layer; plural first interlayer electrical conductor dispersed within the first piezoelectric layer; a first polymer layer adjacent to the first piezoelectric layer; and a first electrode layer disposed on the first piezoelectric layer. The vibrating element includes a multi-layer piezoelectric structure; a second electrode layer disposed on the multi-layer piezoelectric structure; and a second polymer layer adjacent to the multi-layer piezoelectric structure. Each layer of the multi-layer piezoelectric structure includes a second piezoelectric layer and plural second interlayer electrical conductor dispersed within the second piezoelectric layer.