Patents by Inventor Yung-Yu Liu

Yung-Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990258
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: May 21, 2024
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
  • Publication number: 20240161998
    Abstract: A deflecting plate includes a silicon-on-insulator (SOI) substrate. The SOI substrate includes: an insulator layer having a top surface and a bottom surface; a device layer coupled to the insulator layer at the top surface, wherein multiple deflecting apertures are disposed in the device layer, each of which extending from a top open end to a bottom open end through the device layer, and wherein the bottom open end is coplanar with the top surface of the insulator layer; and a handle substrate coupled to the insulator layer at the bottom surface, wherein a cavity is disposed in the handle substrate and extends from a cavity open end to a cavity bottom wall, and wherein the bottom wall is coplanar with the top surface of the insulator layer, such that the bottom open end of each deflecting aperture is exposed to the cavity.
    Type: Application
    Filed: September 10, 2023
    Publication date: May 16, 2024
    Inventors: Cheng-Hsien Chou, Yung-Lung Lin, Chun Liang Chen, Kuan-Liang Liu, Chin-Yu Ku, Jong-Yuh Chang
  • Publication number: 20240152418
    Abstract: A communication system and an operation method thereof are provided. A transmitting device transmits a data unit to a receiving device through a data channel of a communication interface. The transmitting device calculates an original verification information unit of the data unit and synchronously transmits the original verification information unit to the receiving device through a verification information channel of the communication interface based on a transmission timing of the data unit in the data channel. After receiving a current data unit and before receiving a next data unit, the receiving device verifies whether the current data unit received from the data channel has errors in real time based on a current original verification information unit corresponding to the current data unit.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 9, 2024
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Igor Elkanovich, Yung-Sheng Fang, Pei Yu, Chang-Ming Liu
  • Publication number: 20240145133
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.
    Type: Application
    Filed: April 5, 2023
    Publication date: May 2, 2024
    Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
  • Publication number: 20240145132
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 2, 2024
    Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Patent number: 11951259
    Abstract: Disclosed herein are novel designs of a medical tube for delivering a respiratory gas to a subject in respiratory therapy, wherein the medical tube is in fluid connection with a user interface and a respiratory device. The medical tube has a tubular body, a first rib helically extending along the outer surface of the tubular body, and optionally, a second rib disposed next to the first rib, and optionally, a membrane encapsulating the first and/or second ribs thereby creating a helical space along the outer surface of the tubular body. In some embodiments, the first rib has a lumen and at least one wire disposed outside the lumen. In other embodiments, the first rib is free of any lumen and includes one or more wires extended therethrough. The lumen of the first rib or the helical space created by membrane encapsulation is configured to monitor the temperature, humidity, flow rate or pressure of the respiratory gas or an exhaled/inhaled gas of a subject.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 9, 2024
    Assignee: FOXXMED LTD.
    Inventors: Jeng-Yu Chou, Yung-Yang Shih, Wen-Hsien Liu
  • Patent number: 11929319
    Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Publication number: 20040196979
    Abstract: The encryption/decryption device of the present invention comprises a first encryption/decryption table, and electrically connects a host with a second encryption/decryption table. The content of the first and the second encryption/decryption table comprises a station identifier field, an encryption/decryption algorithm identifier field and a key field for encrypting/decrypting the frames transmitted from or to the station. The encryption/decryption device comprises a data receiving unit, a data transmitting unit, a hardware encryption/decryption unit, a first checking unit and a second checking unit. The hardware encryption/decryption unit will encrypt/decrypt a frame if it can do so, or the encryption/decryption of the frame will be performed by the host.
    Type: Application
    Filed: August 4, 2003
    Publication date: October 7, 2004
    Inventors: Sheng-Yuan Cheng, Yung-Yu Liu, Hsin-Hsiung Fang