Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: A separation apparatus suitable for separating plastic and silicone in a composite material includes a storage tank configured to store a hydrocarbon solvent, and a reaction tank fluidly connected to the storage tank and having a reaction space for placement of the composite material therein and for receiving the hydrocarbon solvent from the storage tank such that the composite material is immersed in the hydrocarbon solvent for separating the plastic and the silicone in the composite material. The plastic and the silicone in the composite material are insoluble in the hydrocarbon solvent.

Abstract: A method of making a semiconductor device includes forming a circuit layer over a substrate. The method further includes depositing an insulator over the substrate. The method further includes patterning the insulator to define a test line trench, a first trench, and a second trench, wherein the first trench is on a portion of the substrate exposed by the circuit layer. The method further includes filling the test line trench to define a test line electrically connected to the circuit layer. The method further includes filling the first trench and the second trench to define a capacitor.

Abstract: A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are sequentially formed on the transparent substrate. A sealant layer is formed to at least cover the light emitting layer and the metal cathode layer. A covering layer having a covering surface is provided. An evaporation process is performed to form an active absorption layer on the covering surface of the covering layer. The covering surface of the covering layer covers on a portion of the sealant layer above the metal cathode layer. The covering layer can have a recess region that is to be formed the active absorption layer thereon. Alternatively, the active absorption layer can be evaporated before the sealant is formed. Moreover, the active absorption layer can be replaced with an insulating layer.

Abstract: A packaging method of electro-luminescence devices. By controlling the moisture and oxygen in an environment, a glass substrate with electro-luminescence devices and a glass covering plate corresponding thereto are provided. A frame glues with an opening is applied on each frame on the glass plate that corresponds to each electro-luminescence device on the substrate. The glass plate is laminated with the glass substrate via the frame glues. The glass substrate is cut into individual package including an electro-luminescence device enclosed by a part of the glass substrate, a part of the glass plate and the frame glue except that a side thereof is exposed to the environment via the opening. Each of the packages is disposed in a vacuum cavity with the opening facing the packaging material in a glue tub in the vacuum cavity. The pressure of the vacuum is raised up to a certain value to have the packaging material filling the cavity containing the electro-luminescence in the package.

Abstract: A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are sequentially formed on the transparent substrate. A sealant layer is formed to at least cover the light emitting layer and the metal cathode layer. A covering layer having a covering surface is provided. An evaporation process is performed to form an active absorption layer on the covering surface of the covering layer. The covering surface of the covering layer covers on a portion of the sealant layer above the metal cathode layer. The covering layer can have a recess region that is to be formed the active absorption layer thereon. Alternatively, the active absorption cab be evaporated before the sealant is formed. Moreover, the active absorption layer can be replaced with an insulating layer.

Abstract: A two-in-one combination safe lock. The combination safe lock includes lock device and an electronic lock device in a box that is set on the side of a safe door with a lock latch on the upper side. A numeric dial and a circular pushbutton plate are disposed at the front side of the safe door and the wheel is connected to the mechanical lock device and the electronic lock device in the box by a shaft. By rotating the numeric dial or inputting the access code through the circular pushbutton plate, the mechanical lock device and the electronic lock device are moved to pull back the lock latch and open the safe door.