Patents by Inventor Yung-Cheol Kong
Yung-Cheol Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230207416Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.Type: ApplicationFiled: March 3, 2023Publication date: June 29, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Ji Hwang KIM, Jong Bo Shim, Jang Woo Lee, Yung Cheol Kong, Young Hoon Hyun
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Patent number: 11600545Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.Type: GrantFiled: July 15, 2021Date of Patent: March 7, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Ji Hwang Kim, Jong Bo Shim, Jang Woo Lee, Yung Cheol Kong, Young Hoon Hyun
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Publication number: 20210343617Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.Type: ApplicationFiled: July 15, 2021Publication date: November 4, 2021Applicant: Samsung Electronics Co., Ltd.Inventors: Ji Hwang KIM, Jong Bo SHIM, Jang Woo LEE, Yung Cheol KONG, Young Hoon HYUN
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Patent number: 11069592Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.Type: GrantFiled: September 25, 2019Date of Patent: July 20, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Ji Hwang Kim, Jong Bo Shim, Jang Woo Lee, Yung Cheol Kong, Young Hoon Hyun
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Patent number: 10964618Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.Type: GrantFiled: August 1, 2019Date of Patent: March 30, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha
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Publication number: 20200194331Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.Type: ApplicationFiled: September 25, 2019Publication date: June 18, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Ji Hwang KIM, Jong Bo SHIM, Jang Woo LEE, Yung Cheol KONG, Young Hoon HYUN
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Publication number: 20200168522Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.Type: ApplicationFiled: August 1, 2019Publication date: May 28, 2020Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha
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Patent number: 10105102Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.Type: GrantFiled: May 4, 2015Date of Patent: October 23, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mitsuo Umemoto, Yung-Cheol Kong, Woon-Bae Kim, Pyoung-Wan Kim, Kyong-Soon Cho
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Publication number: 20160051197Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.Type: ApplicationFiled: May 4, 2015Publication date: February 25, 2016Inventors: Mitsuo UMEMOTO, Yung-Cheol KONG, Woon-Bae KIM, Pyoung-Wan KIM, Kyong-Soon CHO
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Patent number: 8927316Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: GrantFiled: September 3, 2013Date of Patent: January 6, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8902356Abstract: An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.Type: GrantFiled: March 16, 2011Date of Patent: December 2, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-Rim Seo, Beoung-Ouk Min, Tae-Je Cho, Yung-Cheol Kong, Dong-Min Kim, Ji-Woong Park
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Publication number: 20140073079Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: ApplicationFiled: September 3, 2013Publication date: March 13, 2014Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8547471Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: GrantFiled: March 10, 2011Date of Patent: October 1, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8203130Abstract: An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.Type: GrantFiled: September 22, 2011Date of Patent: June 19, 2012Assignee: SAMSUNG Electronics Co., Ltd.Inventor: Yung-Cheol Kong
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Publication number: 20120105706Abstract: Methods of forming camera modules include forming a chip structure including a molding pattern surrounding a chip and sidewalls of the chip. A lens module is formed, and the lens module is coupled to an upper part of the chip structure.Type: ApplicationFiled: January 11, 2012Publication date: May 3, 2012Applicant: Samsung Electronics Co., Ltd.Inventor: Yung-Cheol KONG
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Patent number: 8139145Abstract: Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.Type: GrantFiled: October 31, 2008Date of Patent: March 20, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Han-Sung Ryu, Byoung-Rim Seo, Yung-Cheol Kong
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Publication number: 20120038813Abstract: A camera module includes an image sensor package including an image sensor chip and a chip cover layer protecting the image sensor chip, a first lens disposed above the image sensor package to be coupled with an upper surface of the chip cover layer, a second lens disposed over the first lens, and an infrared blocking film formed in direct contact with the upper surface of the chip cover layer or an upper surface of the second lens.Type: ApplicationFiled: July 19, 2011Publication date: February 16, 2012Applicant: Samsung Electronics Co., LtdInventors: Young-Gyu JUNG, Yung-Cheol Kong, Tai-Hyun Eum, Han-Sung Ryu, Yu-Jung Tae
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Publication number: 20120009718Abstract: An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.Type: ApplicationFiled: September 22, 2011Publication date: January 12, 2012Applicant: Samsung Electronics Co., Ltd.Inventor: Yung-Cheol KONG
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Publication number: 20110285889Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.Type: ApplicationFiled: March 10, 2011Publication date: November 24, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong-Hoe Cho, Byoung-Rim Seo, Yung-Cheol Kong, Han-Sung Ryu
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Patent number: 8053714Abstract: An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.Type: GrantFiled: January 29, 2009Date of Patent: November 8, 2011Assignee: Samsung Electronics Co., Ltd.Inventor: Yung-Cheol Kong