Abstract: A thermal pad includes: a thermally conductive sheet-like substrate, where the sheet-like substrate has a compressible porous mesh structure in a thickness direction; and a thermally conductive coating, where the coating is formed of a flexible organic compound, and the organic compound fills inside the sheet-like substrate or is coated on a surface of the sheet-like substrate, or the organic compound both fills inside the sheet-like substrate and is coated on the surface of the sheet-like substrate. In the thermal pad, the method for fabricating a thermal pad, the heat dissipating apparatus, and the electronic device provided in the embodiments of the present application, a thermally conductive flexible organic compound fills inside or is coated on a thermally conductive sheet-like substrate having a compressible porous mesh structure in the thickness direction.