Patents by Inventor Yunhui Zhong

Yunhui Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing non-corrosive fire extinguishing agent
    Patent number: 11617909
    Abstract: A method for preparing a non-corrosive fire extinguishing agent, including combining a methyl phosphate organosilane material and a perfluorohexanone to prepare the fire extinguishing agent.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: April 4, 2023
    Assignees: Huazhong University of Science and Technology, ZHEJIANG LANDUN ELECTRICIAN NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Yuancheng Cao, Weixin Zhang, Shun Tang, Yunhui Zhong, Hao Wu
  • METHOD FOR PREPARING NON-CORROSIVE FIRE EXTINGUISHING AGENT
    Publication number: 20220387837
    Abstract: A method for preparing a non-corrosive fire extinguishing agent, including combining a methyl phosphate organosilane material and a perfluorohexanone to prepare the fire extinguishing agent.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 8, 2022
    Inventors: Yuancheng CAO, Weixin ZHANG, Shun TANG, Yunhui ZHONG, Hao WU
  • SMD diode taking a runner as body and manufacturing method thereof
    Patent number: 11024567
    Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: June 1, 2021
    Assignee: SIYANG GRANDE ELECTRONICS CO., LTD.
    Inventor: Yunhui Zhong
  • SMD DIODE TAKING A RUNNER AS BODY AND MANUFACTURING METHOD THEREOF
    Publication number: 20200075465
    Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.
    Type: Application
    Filed: November 7, 2019
    Publication date: March 5, 2020
    Inventor: Yunhui ZHONG
  • SMD Diode Taking A Runner As Body And Manufacturing Method Thereof
    Publication number: 20170154840
    Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.
    Type: Application
    Filed: November 25, 2016
    Publication date: June 1, 2017
    Inventor: Yunhui Zhong