Patents by Inventor Yunjian LAN

Yunjian LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12040426
    Abstract: This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: July 16, 2024
    Assignee: Najing Technology Corporation Limited
    Inventors: Yongyin Kang, Xiangpeng Du, Hailin Wang, Jianhai Zhou, Yunjian Lan
  • Patent number: 12015108
    Abstract: The disclosure provides a light emitting device and a manufacturing method thereof. The light emitting device includes a substrate, an LED chip, a quantum dot composite layer and a first protective layer; the LED chip is disposed on a surface of the substrate; the quantum dot composite layer is arranged on a surface of the LED chip away from the substrate; the first protective layer is arranged on a surface of the quantum dot composite layer away from the LED chip; wherein the quantum dot composite layer includes a water-soluble polymer matrix and quantum dots dispersed in the water-soluble polymer matrix; the material of the first protective layer is one of a first inorganic oxide and a first water-blocking polymer; and the material of the water-soluble polymer matrix is an oxygen-blocking polymer.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 18, 2024
    Assignee: Najing Technology Corporation Limited
    Inventors: Hailin Wang, Yunjian Lan, Xiangpeng Du
  • Publication number: 20210408323
    Abstract: This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.
    Type: Application
    Filed: September 20, 2019
    Publication date: December 30, 2021
    Inventors: Yongyin KANG, Xiangpeng DU, Hailin WANG, Jianhai ZHOU, Yunjian LAN
  • Publication number: 20210265538
    Abstract: The disclosure provides a light emitting device and a manufacturing method thereof. The light emitting device includes a substrate, an LED chip, a quantum dot composite layer and a first protective layer; the LED chip is disposed on a surface of the substrate; the quantum dot composite layer is arranged on a surface of the LED chip away from the substrate; the first protective layer is arranged on a surface of the quantum dot composite layer away from the LED chip; wherein the quantum dot composite layer includes a water-soluble polymer matrix and quantum dots dispersed in the water-soluble polymer matrix; the material of the first protective layer is one of a first inorganic oxide and a first water-blocking polymer; and the material of the water-soluble polymer matrix is an oxygen-blocking polymer.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 26, 2021
    Inventors: Hailin WANG, Yunjian LAN, Xiangpeng DU