Patents by Inventor Yunlong Wang

Yunlong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160137263
    Abstract: An attitude-adaptive hydrofoil apparatus, including: strut-braced wing assemblies, a horizontal wing assembly, connection plates, and attack angle adjusting plates. The strut-braced wing assemblies each include a bearing, at least one inclined tube, at least one inclined flow-guiding wing, and at least one stop dog. The horizontal wing assembly includes a horizontal tube, at least one horizontal flow-guiding wing, and at least one depth-locating wing. The attack angle adjusting plates each include an angle adjusting end plate having a hole. The strut-braced wing assemblies are symmetrically disposed at two sides of the horizontal wing assembly. The bearing is fixed on a vessel body by welding. The at least one inclined flow-guiding wing is sleeved on the at least one inclined tube, and is limited by the at least one stop dog. The attack angle adjusting plates are disposed at two ends of the horizontal tube, respectively.
    Type: Application
    Filed: November 16, 2015
    Publication date: May 19, 2016
    Inventors: Yan LIN, Yunlong WANG, Chaoguang JIN, Ming CHEN, Guan GUAN, Yanyun YU, Kai LI
  • Patent number: 9205899
    Abstract: An electromagnetic marine fender, including: a rubber fender, two electromagnet groups, tensile steel ropes, an electric cable, and a waterproof power socket. Each electromagnet group includes at least one electromagnet. The electromagnet coils of the electromagnets have the same winding direction. The two electromagnet groups are disposed on two sides of the rubber fender, and the two electromagnet groups and the rubber fender are connected and fixed as a whole by the tensile steel ropes. The electromagnet is a combination structure including an electromagnet core, an electromagnet coil, an electromagnet steel shell, and a rubber coating covering the electromagnet steel shell from the center outward. The electromagnet coils of the electromagnets of the two electromagnet groups are connected in parallel, and the two electromagnet groups are in electric connection to the waterproof power socket via the electric cable.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: December 8, 2015
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Yanyun Yu, Yan Lin, Ming Chen, Yunlong Wang, Kai Li
  • Publication number: 20150225047
    Abstract: A carrying device for a side-scan sonar, including a suspension rod, a hanging rack, and a flange. The side-scan sonar is in fixed connection to the lower part of the hanging rack. The suspension rod includes a suspension unit, a universal joint, and a tension rod. The flange is disposed below the lower part of the tension rod. The hanging rack includes a Z-shaped main cross beam. Two U-shaped hooks are disposed at two ends of the Z-shaped main cross beam for supporting the side-scan sonar. A vertical drag hook is disposed in the inner side of each of the two U-shaped hooks for hanging the side-scan sonar. The flange is fixed in the center of the Z-shaped main cross beam.
    Type: Application
    Filed: April 27, 2015
    Publication date: August 13, 2015
    Inventors: Yan LIN, Ming CHEN, Yanyun YU, Yunlong WANG, Kai LI
  • Publication number: 20150203179
    Abstract: An electromagnetic marine fender, including: a rubber fender, two electromagnet groups, tensile steel ropes, an electric cable, and a waterproof power socket. Each electromagnet group includes at least one electromagnet. The electromagnet coils of the electromagnets have the same winding direction. The two electromagnet groups are disposed on two sides of the rubber fender, and the two electromagnet groups and the rubber fender are connected and fixed as a whole by the tensile steel ropes. The electromagnet is a combination structure including an electromagnet core, an electromagnet coil, an electromagnet steel shell, and a rubber coating covering the electromagnet steel shell from the center outward. The electromagnet coils of the electromagnets of the two electromagnet groups are connected in parallel, and the two electromagnet groups are in electric connection to the waterproof power socket via the electric cable.
    Type: Application
    Filed: April 1, 2015
    Publication date: July 23, 2015
    Inventors: Yanyun YU, Yan LIN, Ming CHEN, Yunlong WANG, Kai LI
  • Publication number: 20150072202
    Abstract: The present disclosure provides an electrochemical device, which comprises a plurality of cells which are stacked in a step configuration, electrode tabs of the same polarity of the plurality of cells are electrically connected together. Compared with only using a single wound-type cell or only using a single laminated-type cell, the plurality of cells stacked in the step configuration of the present disclosure can more flexibly adapt to an irregular inner space of an electronic device using the electrochemical device, so that the inner space in the electronic device is fully used, the performance of the electrochemical device for use in the electronic device is improved, and the manufacturing process is more simple, flexible and efficient.
    Type: Application
    Filed: May 30, 2014
    Publication date: March 12, 2015
    Inventors: Cong LI, Yunlong Wang, Ping He, Zhong Shi, Hongxin Fang, Baiqing Zhang
  • Patent number: 8697470
    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: April 15, 2014
    Assignee: General Mems Corporation
    Inventor: Yunlong Wang
  • Patent number: 8571249
    Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: October 29, 2013
    Assignee: General MEMS Corporation
    Inventor: Yunlong Wang
  • Patent number: 8472648
    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: June 25, 2013
    Assignee: General MEMS Corporation
    Inventors: Yunlong Wang, Yi-Wen Chen
  • Publication number: 20130028459
    Abstract: A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially.
    Type: Application
    Filed: July 28, 2011
    Publication date: January 31, 2013
    Inventor: Yunlong Wang
  • Publication number: 20120328132
    Abstract: This invention relates to a miniature silicon capacitive microphone having a perforated backplate supported on a substrate, a shallowly corrugated and perforated diaphragm that is suspended above said backplate and said suspended shallowly corrugated and perforated diaphragm is fully clamped and anchored on the said substrate at the edge of said diaphragm. Said perforated backplate is isolated electrically from said substrate by a layer of dielectric material. Said suspended shallowly corrugated diaphragm has a plurality of perforation holes to allow the passage of slow varying ambient pressure, and to equalize the barometric pressure in and out of the back cavity.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Inventor: Yunlong Wang
  • Patent number: 8325951
    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: December 4, 2012
    Assignee: General MEMS Corporation
    Inventor: Yunlong Wang
  • Patent number: 8042916
    Abstract: This invention relates to a micromachined fluid ejector array having a fluid reservoir bounded at one side by an elastic membrane having scalable arrays of orifices arranged between concentric piezoelectric transducers, and at another side by a top cover supported by surrounding walls. By actuating neighboring concentric piezoelectric transducers, the scalable array of orifices arranged between the actuated neighboring concentric piezoelectric transducers deflect to eject fluid droplets. Also disclosed is a micromachined fluid ejector array having a fluid reservoir bounded at one side by an elastic membrane having scalable arrays of orifices arranged between concentric piezoelectric transducers, and at another side by a top cover supported by surrounding walls. A piezoelectric layer is bonded on top of the top cover.
    Type: Grant
    Filed: March 31, 2007
    Date of Patent: October 25, 2011
    Assignee: Micropoint Biosciences, Inc.
    Inventor: Yunlong Wang
  • Patent number: 7899935
    Abstract: A data synchronization system and method. The method includes that when a change happens in a source application, data is collected from a source application based on a target application subscribing the source application and collection data is transmitted to the target application or is directly inserted to target database. The system includes data collection unit and distribution unit. The present invention may realize synchronization on demand, simultaneously reduce greatly synchronous data quantity, decrease network load, and guarantee smoothness and stabilization of network. The present invention applies to data synchronization of enterprise internal/external data systems, telecommunication networks, etc.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: March 1, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zhongchu Zhu, Yongfeng Wang, Fei Zhou, Mingzhu Shi, Wei He, Yunlong Wang
  • Publication number: 20100303271
    Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 2, 2010
    Applicant: GENERAL MEMS CORPORATION
    Inventor: Yunlong Wang
  • Publication number: 20100246877
    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.
    Type: Application
    Filed: June 11, 2010
    Publication date: September 30, 2010
    Applicant: FORTEMEDIA, INC.
    Inventors: Yunlong Wang, Yi-Wen Chen
  • Patent number: 7771989
    Abstract: This invention relates to a micromachined microfluidics diagnostic device that comprises one or multiple assaying channels each of which is comprised a sample port, a first valve, a reaction chamber, a second valve, a fluid ejector array, a third valve, a buffer chamber, a capture zone and a waste chamber. Each of these device components are interconnected through microfluidic channels. This invention further relates to the method of operating a micromachined microfluidic diagnostic device. The flow of fluid in the microchannels is regulated through micromachined valves. The reaction of sample analytes with fluorescent tags and detection antibodies in the reaction chamber are enhanced by the micromachined active mixer. By ejecting reaction mixture onto the capture zone through micromachined fluid ejector array, the fluorescent tagged analytes bind with capturing antiodies on capture zone. The fluid ejector array further ejects buffer fluid to wash away unbound fluorescent tags.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: August 10, 2010
    Assignee: Micro Point Bioscience, Inc.
    Inventor: Yunlong Wang
  • Publication number: 20100183181
    Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.
    Type: Application
    Filed: January 19, 2010
    Publication date: July 22, 2010
    Applicant: GENERAL MEMS CORPORATION
    Inventor: Yunlong Wang
  • Publication number: 20100029014
    Abstract: This invention relates to a micromachined microfluidics diagnostic device that comprises one or multiple assaying channels each of which is comprised a sample port, a first valve, a reaction chamber, a second valve, a fluid ejector array, a third valve, a buffer chamber, a capture zone and a waste chamber. Each of these device components are interconnected through microfluidic channels. This invention further relates to the method of operating a micromachined microfluidic diagnostic device. The flow of fluid in the microchannels is regulated through micromachined valves. The reaction of sample analytes with fluorescent tags and detection antibodies in the reaction chamber are enhanced by the micromachined active mixer. By ejecting reaction mixture onto the capture zone through micromachined fluid ejector array, the fluorescent tagged analytes bind with capturing antiodies on capture zone. The fluid ejector array further ejects buffer fluid to wash away unbound fluorescent tags.
    Type: Application
    Filed: August 24, 2009
    Publication date: February 4, 2010
    Applicant: MicroPoint Bioscience Inc.
    Inventor: Yunlong Wang
  • Publication number: 20090271653
    Abstract: A data synchronization system and method. The method includes that when a change happens in a source application, data is collected from a source application based on a target application subscribing the source application and collection data is transmitted to the target application or is directly inserted to target database. The system includes data collection unit and distribution unit. The present invention may realize synchronization on demand, simultaneously reduce greatly synchronous data quantity, decrease network load, and guarantee smoothness and stabilization of network. The present invention applies to data synchronization of enterprise internal/external data systems, telecommunication networks, etc.
    Type: Application
    Filed: October 10, 2008
    Publication date: October 29, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhongchu ZHU, Yongfeng WANG, Fei ZHOU, Mingzhu SHI, Wei HE, Yunlong WANG
  • Patent number: 7598091
    Abstract: This invention relates to a micromachined microfluidics diagnostic device that comprises one or multiple assaying channels each of which is comprised a sample port, a first valve, a reaction chamber, a second valve, a fluid ejector array, a third valve, a buffer chamber, a capture zone and a waste chamber. Each of these device components are interconnected through microfluidic channels. This invention further relates to the method of operating a micromachined microfluidic diagnostic device. The flow of fluid in the microchannels is regulated through micromachined valves. The reaction of sample analytes with fluorescent tags and detection antibodies in the reaction chamber are enhanced by the micromachined active mixer. By ejecting reaction mixture onto the capture zone through micromachined fluid ejector array, the fluorescent tagged analytes bind with capturing antiodies on capture zone. The fluid ejector array further ejects buffer fluid to wash away unbound fluorescent tags.
    Type: Grant
    Filed: March 31, 2007
    Date of Patent: October 6, 2009
    Assignee: Micropoint Bioscience, Inc.
    Inventor: Yunlong Wang